Methods and materials for forming in-situ cavities for silicon-based ceramic matrix composite components
US-10017425-B2 · Jul 10, 2018 · US
Method of forming cooling channels in a ceramic matrix composite component
US11534936B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11534936-B2 |
| Application number | US-201916503905-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 5, 2019 |
| Priority date | Jul 5, 2019 |
| Publication date | Dec 27, 2022 |
| Grant date | Dec 27, 2022 |
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- Title
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Abstract
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A method of forming a ceramic matrix composite component with cooling channels includes embedding a plurality of wires into a preform structure, densifying the preform structure with embedded wires, and removing the plurality of wires to create a plurality of corresponding channels within the densified structure.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of forming a ceramic matrix composite component with cooling channels, the method comprising: embedding a plurality of molybdenum wires into a preform structure comprising a plurality of fiber plies and an outer surface, the embedding step comprising one of: inserting the plurality of molybdenum wires into the preform structure such that the wires push aside fibers of the plies; and weaving the plurality of molybdenum wires into the preform structure; wherein at least a subset of the plurality of embedded molybdenum wires are embedded, with respect to the outer surface of the preform structure, at an angle ranging from 5° to 25°; densifying the preform structure with the plurality embedded molybdenum wires; and removing the plurality of molybdenum wires using a chemical etchant comprising nitric acid and sulfuric acid to create a plurality of corresponding channels within the densified preform structure. 2. The method of claim 1 , wherein the plurality of fiber plies is formed from a ceramic material. 3. The method of claim 1 , wherein at least one of the plurality of molybdenum wires extends completely through a thickness of the preform structure. 4. The method of claim 1 , wherein a diameter of each of the plurality of molybdenum wires ranges from 0.010 in to 0.050 in. 5. The method of claim 1 , wherein a diameter of each of the plurality of molybdenum wires ranges from 0.150 in to 0.250 in. 6. The method of claim 1 , wherein a distance between one of the plurality of molybdenum wires and an adjacent one of the plurality of molybdenum wires ranges from 0.010 in to 0.050 in. 7. The method of claim 1 , wherein the densifying step comprises forming a matrix surrounding the preform structure with embedded molybdenum wires using a chemical vapor infiltration or chemical vapor deposition process. 8. The method of claim 1 , wherein the chemical etchant comprises a solution of 50% nitric acid and 5% sulfuric acid.
Assignees
Inventors
Classifications
Products containing grooves, cuts, recesses or protusions · CPC title
Selecting composite materials, e.g. blades with reinforcing filaments · CPC title
Shaping around a core which is removed later · CPC title
- B28B1/0935Primary
using only elements wholly or partly immersed in the material, e.g. cores · CPC title
Ceramic matrix composites [CMC] · CPC title
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- What does patent US11534936B2 cover?
- A method of forming a ceramic matrix composite component with cooling channels includes embedding a plurality of wires into a preform structure, densifying the preform structure with embedded wires, and removing the plurality of wires to create a plurality of corresponding channels within the densified structure.
- Who is the assignee on this patent?
- United Technologies Corp, Raytheon Tech Corp
- What technology area does this patent fall under?
- Primary CPC classification B28B1/0935. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 27 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).