Methods and materials for forming in-situ cavities for silicon-based ceramic matrix composite components

Patent metadata

Field	Value
Publication number	US-2016115086-A1
Application number	US-201414893702-A
Country	US
Kind code	A1
Filing date	Apr 23, 2014
Priority date	May 29, 2013
Publication date	Apr 28, 2016
Grant date	—

Abstract

Methods and materials for forming in-situ features in a ceramic matrix composite component are described. The method of forming a ceramic matrix composite component with cooling features, comprises forming a preform tape, laying up said preform tape to a desired shape, placing a high-temperature resistant fugitive material insert of preselected geometry in the preform tape of the desired shape, compacting the preform tape of the desired shape, burning out the preform tape of the desired shape, melt infiltrating the desired shape, removing the high-temperature resistant insert to form the cooling features during one of the burning out or the melt infiltrating or following the burning out or the melt infiltrating.

First claim

What is claimed is:

1 . A method of forming a ceramic matrix composite component with cooling features, comprising:
forming a preform tape; laying up said preform tape to a desired shape; placing a high-temperature resistant fugitive material insert of preselected geometry in said preform tape of said desired shape; compacting said preform tape of said desired shape; burning out said preform tape of said desired shape; melt infiltrating said desired shape; and removing said high-temperature resistant insert to form said cooling features one of during or following one of said burning out or said melt infiltrating.

2 . The method of claim 1 , forming said high-temperature fugitive material resistant insert of one of boron nitride, silica, silicon oxide, boron nitride coated DAP polymer, Y 2 Si 2 O 7 rare earth oxides, boron nitride coated silicon oxide, carbon coated boron nitride, molybdenum wire, high refractories, or diamond powder.

3 . The method of claim 2 , said placing being by tape-cast placement, pre-formed tube placement, spraying, screen printing, rapid prototype polymer coated with boron nitride placement, and injection molding.

4 . The method of claim 1 , said removing being one of mechanical or chemical removal.

5 . The method of claim 1 , said removing being a chemical dissolution.

6 . The method of claim 1 , said removing occurring during said burning out or said melt infiltrating when said insert is formed of silicon oxide.

7 . The method of claim 1 , further comprising mechanically clearing said cooling features formed by said insert.

8 . The method of claim 1 , said melt infiltrating comprising inserting molten silicon at least 2600 degrees on said burned-out preform tape of preselected shape.

9 . The method of claim 1 , forming complex non-line of sight cooling features.

Assignees

• Gen Electric

Inventors

• Tuertscher Michael Ray
• Noe Mark Eugene
• Kirby Glen Harold
• Walker Sheena Kum Foster

Classifications

• C04B2235/616

  Liquid infiltration of green bodies or pre-forms · CPC title

• F05D2300/211

  Silica · CPC title

• F05D2300/2282

  of boron · CPC title

• F05D2300/6033

  Ceramic matrix composites [CMC] · CPC title

• F05D2230/40

  Heat treatment · CPC title