Methods and materials for forming in-situ cavities for silicon-based ceramic matrix composite components

Patent metadata

Field	Value
Publication number	US-10017425-B2
Application number	US-201414893702-A
Country	US
Kind code	B2
Filing date	Apr 23, 2014
Priority date	May 29, 2013
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

Methods and materials for forming in-situ features in a ceramic matrix composite component are described. The method of forming a ceramic matrix composite component with cooling features, comprises forming a preform tape, laying up said preform tape to a desired shape, placing a high-temperature resistant fugitive material insert of preselected geometry in the preform tape of the desired shape, compacting the preform tape of the desired shape, burning out the preform tape of the desired shape, melt infiltrating the desired shape, removing the high-temperature resistant insert to form the cooling features during one of the burning out or the melt infiltrating or following the burning out or the melt infiltrating.

First claim

What is claimed is:

1. A method of forming a ceramic matrix composite component with cooling features, comprising:
forming a preform tape;
laying up said preform tape to a desired shape;
placing a high-temperature resistant fugitive material in the form of an insert of preselected geometry in said preform tape to form a lay-up of the ceramic matrix composite component;
compacting said lay-up to form a preform;
pyrolyzing said preform by burning out said preform to form a porous preform;
melt infiltrating said porous preform with molten silicon to form said ceramic matrix composite component;
wherein the method comprises forming said cooling features, by one or both of reducing said high temperature resistant fugitive material or removing said insert, during or following one of said pyrolyzing or said melt infiltrating.

2. The method of claim 1 , wherein the high-temperature fugitive material resistant material comprises boron nitride, silica, silicon oxide, boron nitride coated DAP polymer, rare earth oxides, rare earth oxides coated with boron nitride, rare earth silicate, rare earth silicate coated with boron nitride, boron nitride coated silicon oxide, carbon coated boron nitride, molybdenum wire, high refractories, diamond powder, or combinations thereof.

3. The method of claim 2 , said placing being by tape-cast placement, pre-formed tube placement, spraying, screen printing, rapid prototype polymer coated with boron nitride placement, or injection molding.

4. The method of claim 1 , said removing being one of mechanical or chemical removal.

5. The method of claim 1 , said removing being a chemical dissolution.

6. The method of claim 1 , said removing occurring during said burning out or said melt infiltrating when said insert is formed of silicon oxide.

7. The method of claim 1 , further comprising mechanically clearing said cooling features formed by said insert.

8. The method of claim 1 , said melt infiltrating comprising inserting said molten silicon at least 2600 degrees into said porous preform.

9. The method of claim 1 , forming complex non-line of sight cooling features.

10. The method of claim 1 , wherein said cooling features are formed after said melt infiltration by removing said insert using heat treatment, acid treatment, base treatment, or combinations thereof.

11. The method of claim 1 , wherein forming said preform tape comprises coating a silicon carbide fiber with a prepreg slurry.

12. The method of claim 1 , wherein said insert is in the form of a tape comprising a high temperature resistant fugitive material particulate bound by a polymer.

13. The method of claim 1 , wherein said insert comprises fused silicon oxide as a high temperature resistant fugitive material, and said insert is in the form of a wire, a rod, or a tube.

14. The method of claim 12 , wherein said cooling features are formed by reducing and melting said fused silicon oxide during said pyrolyzing.

15. The method of claim 1 , wherein said insert is in the form of a coupon comprising a plurality of inserts, said coupon comprising silicon carbide fibers in a silicon carbide matrix.

16. A method of forming a ceramic matrix composite component with cooling features, comprising:
forming a preform tape using a silicon carbide fiber;
laying up said preform tape to a desired shape;
placing a high-temperature resistant fugitive material comprising silicon oxide in the form of an insert of preselected geometry in said preform tape, to form a lay-up of the ceramic matrix composite component;
compacting said lay-up to form a preform;
pyrolyzing said preform by burning out said preform to form a porous preform;
melt infiltrating said porous preform with molten silicon to form said ceramic matrix composite component;
wherein said method comprises forming said cooling features, by reducing said silicon oxide, during or following one of said pyrolyzing or said melt infiltrating.

17. The method of claim 16 , wherein forming said preform tape comprises coating a silicon carbide fiber with a prepreg slurry.

18. The method of claim 16 , wherein said high-temperature resistant fugitive material comprises fused silicon oxide and said insert is in the form of a tube.

19. The method of claim 18 , wherein said cooling features are formed by reducing and melting said silicon oxide during said pyrolyzing.

20. The method of claim 16 , wherein said insert is in the form of a coupon comprising a plurality of inserts, said coupon comprising silicon carbide fibers in a silicon carbide matrix.

Assignees

• Gen Electric

Inventors

• Tuertscher Michael Ray
• Noe Mark Eugene
• Kirby Glen Harold
• Walker Sheena Kum Foster

Classifications

• C04B2235/5248

  Carbon, e.g. graphite · CPC title

• F05D2300/131

  Molybdenum · CPC title

• C04B35/14

  based on silica · CPC title

• C04B41/85

  with inorganic materials · CPC title

• F05D2300/222

  Silicon · CPC title