Method and system for predictive maintenance of integrated circuits

US11525858B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11525858-B2
Application numberUS-201816632083-A
CountryUS
Kind codeB2
Filing dateJul 18, 2018
Priority dateJul 19, 2017
Publication dateDec 13, 2022
Grant dateDec 13, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system and method for the predictive maintenance of electronic components that includes sensors at at least one position via which present values of system parameters, such as temperature and voltage, and a signal propagation time at the at least one position are determined, where values of the system parameters and the signal propagation time presently determined by the sensors are retrieved by a central monitoring unit, an individual valid limit value is determined for the signal propagation time at each of the at least one position via the central monitoring unit based on the presently determined values of the system parameters, and the presently determined signal propagation time at each of the at least one position is compared with the associated valid limit value, and a notification is sent to a superordinate level, if the signal propagation time exceeds the limit value to trigger replacement of the electronic component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for predictive maintenance of an electronic device which is implemented as an integrated circuit, the electronic device having, at at least one position, a plurality of sensors via which present values of system parameters and of signal propagation time values at the at least one position are determined during operation, the method comprising: interrogating, by a central monitor mounted in the electronic device, the system parameter values and the signal propagation time values presently detected by each sensor of the plurality of sensors at the at least one position; determining, by the central monitor, temperature and voltage at the at least one position of the electronic device as the system parameters and determining, by the central monitor, an applicable limit value for the signal propagation time at the at least one position based on the presently determined system parameter values; sending an indication to a superordinate level, if an applicable limit value is exceeded by the presently detected value of the signal propagation time at the at least one position; wherein the plurality of sensors minimize power dissipation and determine the system parameters and the signal propagation time values at the at least one position. 2. The method as claimed in claim 1 , wherein the plurality of sensors mounted in the electronic device at the at least one position are combined in at least one monitoring element. 3. The method as claimed in claim 1 , wherein determination of the applicable limit value for the signal propagation time at the at least one position is performed such that the applicable limit value is below a critical value for the signal propagation time at the at least one position. 4. The method as claimed in claim 2 , wherein determination of the applicable limit value for the signal propagation time at the at least one position is performed such that the applicable limit value is below a critical value for the signal propagation time at the at least one position. 5. The method as claimed in claim 1 , wherein during operation the system parameter values and signal propagation time values currently determined by the sensors at the at least one position are interrogated by the central monitor continuously or during predefined periodic self-test phases. 6. The method as claimed in claim 2 , wherein during operation the system parameter values and signal propagation time values presently determined by the sensors at the at least one position are interrogated by the central monitor continuously or during predefined periodic self-test phases. 7. The method as claimed in claim 3 , wherein during operation the system parameter values and signal propagation time values presently determined by the plurality of sensors at the at least one position are interrogated by the central monitor continuously or during predefined periodic self-test phases. 8. The method as claimed in claim 1 , wherein the integrated circuit comprises one of an application-specific integrated circuit (ASIC) and a field programmable gate array (FPGA). 9. A system for performing predictive maintenance of an electronic device implemented as an integrated circuit, the system comprising: a plurality of sensors, each sensor of the plurality of sensors determining present values of system parameters and signal propagation time values at at least one position of the electronic device; a central monitor which interrogates the system parameter values and the signal propagation time values presently determined by the plurality of sensors at the at least one position of the electronic device, temperature and voltage at the at least one position of the electronic device being determined as the system parameters, which determines an applicable limit value for the signal propagation time at the at least one position based on the currently determined system parameter values, and which compares the applicable limit value with the presently determined value of the signal propagation time at the at least one position; wherein the plurality of sensors minimize power dissipation and determine the system parameters and the signal propagation time values at the at least one position. 10. The system as claimed in claim 9 , wherein the central monitor is further configured to send indications to a superordinate level if the applicable limit value is exceeded by the presently determined value of the signal propagation time at the at least one position. 11. The system as claimed in claim 9 , further comprising: at least one monitoring element in which the plurality of sensors mounted in the electronic device at the at least one position are combined. 12. The system as claimed in claim 10 , further comprising: at least one monitoring element in which the plurality of sensors mounted in the electronic device at the at least one position are combined. 13. The system as claimed in claim 9 , wherein at least one sensor for determining current temperature values and one sensor for determining current voltage values of the plurality of sensors are utilized to determine present values of system parameters at the at least one position of the electronic device. 14. The system as claimed in claim 10 , wherein at least one sensor for determining current temperature values and one sensor for determining current voltage values of the plurality of sensors are utilized to determine present values of system parameters at the at least one position of the electronic device. 15. The system as claimed in claim 11 , wherein at least one sensor for determining current temperature values and one sensor for determining current voltage values of the plurality of sensors are utilized to determine present values of system parameters at the at least one position of the electronic device. 16. The system as claimed in claim 9 , wherein the central monitor is implemented as a discrete unit. 17. The system as claimed in claim 9 , wherein the central monitor is incorporated in a system unit. 18. The system as claimed in claim 9 , wherein the integrated circuit comprises one of an application-specific integrated circuit (ASIC) and a field programmable gate array (FPGA).

Assignees

Inventors

Classifications

  • Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM] · CPC title

  • Error detection; Error correction; Monitoring (error detection, correction or monitoring in information storage based on relative movement between record carrier and transducer G11B20/18; monitoring, i.e. supervising the progress of recording or reproducing G11B27/36; in static stores G11C29/00) · CPC title

  • Thermometers specially adapted for specific purposes · CPC title

  • Testing timing characteristics · CPC title

  • Timing aspects, e.g. clock distribution, skew, propagation delay (for tester hardware G01R31/31937) · CPC title

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What does patent US11525858B2 cover?
A system and method for the predictive maintenance of electronic components that includes sensors at at least one position via which present values of system parameters, such as temperature and voltage, and a signal propagation time at the at least one position are determined, where values of the system parameters and the signal propagation time presently determined by the sensors are retrieved…
Who is the assignee on this patent?
Siemens Ag
What technology area does this patent fall under?
Primary CPC classification G01R31/2882. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 13 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).