Multilayer circuit board manufacturing method

Patent metadata

Field	Value
Publication number	US-11525073-B2
Application number	US-201716463562-A
Country	US
Kind code	B2
Filing date	Nov 24, 2017
Priority date	Nov 28, 2016
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

There is a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween, wherein an unoccupied region without the soluble adhesive layer is provided within a facing area where the reinforcing sheet faces the multilayer laminate; allowing a liquid capable of dissolving the soluble adhesive layer to infiltrate the unoccupied region to dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced to generate no large local warpage, thereby improving the reliable connection and the surface flatness (coplanarity) of the multilayer wiring layer. The used reinforcing sheet can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.

First claim

The invention claimed is:

1. A method of manufacturing a multilayer wiring board, comprising:
providing a laminated sheet comprising, in sequence, a substrate, a release layer, and a metal layer;
forming a first wiring layer directly on a surface of the metal layer;
alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to produce a multilayer laminate;
stacking a reinforcing sheet on one surface of the multilayer laminate with a soluble adhesive layer therebetween, wherein an unoccupied region without the soluble adhesive layer is provided within a facing area where the reinforcing sheet faces the multilayer laminate, and wherein the soluble adhesive layer is in direct contact with both the multilayer laminate and the reinforcing sheet during the stacking of the reinforcing sheet;
allowing a liquid capable of dissolving the soluble adhesive layer to infiltrate the unoccupied region to dissolve or soften the soluble adhesive layer; and
releasing the reinforcing sheet from the multilayer laminate at the soluble adhesive layer to give a multilayer wiring board;
wherein the reinforcing sheet has a spring deflection limit Kb 0.1 of 100 to 1500 N/mm 2 as measured in accordance with the repeated deflection test of JIS H 3130-2012.

2. The method according to claim 1 , wherein a ratio of an area of the unoccupied region to an area of the facing area is 20 to 90 area %.

3. The method according to claim 1 , wherein each occupied region covered with the soluble adhesive layer has a circumscribed circle diameter of 0.1 to 10 mm, and the each occupied region is surrounded by the unoccupied region.

4. The method according to claim 1 , wherein the soluble adhesive layer has a thickness of 0.5 to 50 μm.

5. The method according to claim 1 , wherein the soluble adhesive layer comprises a solution-soluble resin.

6. The method according to claim 1 , wherein the soluble adhesive layer comprises an acid-soluble resin or an alkali-soluble resin.

7. The method according to claim 1 , further comprising mounting an electronic device on a surface of the multilayer laminate after stacking the reinforcing sheet and before releasing the reinforcing sheet, the surface being remote from the reinforcing sheet.

8. The method according to claim 1 , wherein the reinforcing sheet has an opening.

9. The method according to claim 1 , wherein stacking the reinforcing sheet with the soluble adhesive layer comprises:
providing a composite film comprising the soluble adhesive layer on a first protective film;
stacking the composite film on the reinforcing sheet and/or the multilayer laminate such that the soluble adhesive layer comes into contact with the reinforcing sheet and/or the multilayer laminate; and
releasing the first protective film from the soluble adhesive layer.

10. The method according to claim 9 , wherein providing the composite film further comprises providing a second protective film on a surface of the composite film, the surface being adjacent to the soluble adhesive layer,
wherein the method further comprises releasing the second protective film before stacking the composite film on the reinforcing sheet and/or the multilayer laminate.

11. The method according to claim 1 , further comprising releasing the substrate from the metal layer at the release layer after stacking the reinforcing sheet and before releasing the reinforcing sheet.

12. The method according to claim 1 , further comprising removing the metal layer by etching before releasing the reinforcing sheet.

Assignees

• Mitsui Mining & Smelting Co Ltd

Inventors

• Matsuura Yoshinori
• Sato Tetsuro
• Nakamura Toshimi
• Yanai Takenori

Classifications

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/7436

  used to support a device or a wafer when forming electrical connections thereto · CPC title

• H10P72/7424

  used as a support during the manufacture of self-supporting substrates · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/743

  used as a support during manufacture of interconnect decals or build up layers · CPC title