Surface-treated copper foil and copper clad laminate

Patent metadata

Field	Value
Publication number	US-11519092-B1
Application number	US-202117562031-A
Country	US
Kind code	B1
Filing date	Dec 27, 2021
Priority date	Jul 19, 2021
Publication date	Dec 6, 2022
Grant date	Dec 6, 2022

Abstract

A surface-treated copper foil includes a treating surface, and a peak extreme height (Sxp) of the treating surface being in a range of 0.4-2.5 μm, where the hysteresis loop of the surface-treated copper foil includes a first magnetization and a second magnetization when the magnetic field strength of the hysteresis loop is zero, and the absolute difference between the value of the first magnetization and the value of the second magnetization is in a range of 20-1200 emu/m3.

First claim

What is claimed is:

1. A surface-treated copper foil, comprising a treating surface, and a peak extreme height (Sxp) of the treating surface being in a range of 0.4 to 2.5 μm, wherein a hysteresis loop of the surface-treated copper foil comprises a first magnetization and a second magnetization when the magnetic field strength of the hysteresis loop is zero, and the absolute difference between the value of the first magnetization and the value of the second magnetization is in a range of 20-1200 emu/m 3 .

2. The surface-treated copper foil of claim 1 , wherein the peak extreme height (Sxp) of the treating surface is in a range of 0.4 to 1.8 μm, and the absolute difference between the value of the first magnetization and the value of the second magnetization is in a range of 20-800 emu/m 3 .

3. The surface-treated copper foil of claim 1 , wherein the absolute difference between the value of the first magnetization and the value of the second magnetization is in a range of 20-500 emu/m 3 .

4. The surface-treated copper foil of claim 1 , further comprising:
a bulk copper foil; and
a surface treatment layer, disposed on at least one surface of the bulk copper foil, wherein an outermost surface of the surface treatment layer is the treating surface.

5. The surface-treated copper foil of claim 4 , wherein when an X-ray photoelectron spectroscopy (XPS) analysis is performed on the treating surface by using Ni, Cu, Zn, Co, Cr, Si, C, N, O, P and S as target atoms, the concentration of Si in the surface treatment layer is in a range of 2 to 15 atomic % based on the total number of the target atoms.

6. The surface-treated copper foil of claim 5 , wherein the concentration of Si in the surface treatment layer is in a range of 2.5 to 11.5 atomic %.

7. The surface-treated copper foil of claim 5 , wherein the concentration of Si in the surface treatment layer is in a range of 2.5 to 8.0 atomic %.

8. The surface-treated copper foil of claim 4 , wherein the surface treatment layer comprises at least two sublayers, and one of the at least two sublayers is selected from the group consisting of a roughening layer, a barrier layer and an antirust layer.

9. The surface-treated copper foil of claim 8 , wherein the other one of the at least two sublayers is a silicon-containing coupling layer.

10. The surface-treated copper foil of claim 8 , wherein a composition of at least one of the roughening layer, the barrier layer and the antirust layer comprises a ferromagnetic metal.

11. The surface-treated copper foil of claim 10 , wherein the ferromagnetic metal comprises nickel, cobalt or iron.

12. A copper-clad laminate, comprising:
a board; and
the surface-treated copper foil of claim 1 , wherein the treating surface is attached to the board.

Assignees

• Chang Chun Petrochemical Co Ltd

Inventors

• Lai Ting-Chun
• Lai Yao-Sheng
• Chou Jui-Chang

Classifications

• C25D5/605 Primary

  Surface topography of the layers, e.g. rough, dendritic or nodular layers · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title

• Y10T428/12438

  Composite · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C25D7/0614

  Strips or foils · CPC title