Flexible hybrid interconnect circuits

Patent metadata

Field	Value
Publication number	US-11516904-B2
Application number	US-202117455386-A
Country	US
Kind code	B2
Filing date	Nov 17, 2021
Priority date	Oct 29, 2018
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

First claim

What is claimed is:

1. A flexible hybrid interconnect circuit, having a thickness, the flexible hybrid interconnect circuit comprising:
a first outer dielectric;
a second outer dielectric;
an inner dielectric;
a first conductive element comprising a first edge;
a second conductive element comprising a second edge and stacked with the first conductive element along the thickness of the flexible hybrid interconnect circuit and between the first outer dielectric and the second outer dielectric, wherein the inner dielectric is at least partially disposed between the first conductive element and the second conductive element providing support to the first conductive element and the second conductive element relative to each other; and
an interconnecting jumper looping around the first edge of the first conductive element and the second edge of the second conductive element and interconnecting the first conductive element and the second conductive element, wherein:
at least the first outer dielectric does not extend to the first edge such that a part of a surface of the first conductive element, extending to the first edge is exposed; and
the interconnecting jumper directly interfaces the part of the surface of the first conductive element extending to the first edge.

2. The flexible hybrid interconnect circuit of claim 1 , wherein the first conductive element is substantially wider than the second conductive element such that edges of the first conductive element extend past edges of the second conductive element.

3. The flexible hybrid interconnect circuit of claim 2 , wherein:
the first conductive element is operable as a shield;
the second conductive element is operable as a signal line configured to transmit an electromagnetic wave; and
the first conductive element comprises a plurality of openings each having a size less than a wavelength of the electromagnetic wave transmitted by the second conductive element.

4. The flexible hybrid interconnect circuit of claim 1 , wherein:
the first conductive element comprises a first conductive element portion, a second conductive element portion, and a transition portion, disposed between and monolithic with each of the first conductive element portion and the second conductive element portion; and
a width of the transition portion is less than a width of either the first conductive element portion or the second conductive element portion.

5. The flexible hybrid interconnect circuit of claim 4 , wherein the width of the transition portion is 5% to 50% of the width of either the first conductive element portion or the second conductive element portion.

6. The flexible hybrid interconnect circuit of claim 4 , wherein:
the first conductive element portion, the transition portion, and the second conductive element portion extend along an axis; and
the first conductive element portion is offset relative to the second conductive element portion in a direction perpendicular to this axis.

7. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric comprises a crosslinked polyethylene (XLPE).

8. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric has a dielectric constant less than 2.

9. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric comprises a flame retardant.

10. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric comprises a coefficient of thermal expansion (CTE)-matching additive such that a CTE of the inner dielectric substantially matches a CTE of each of the first conductive element and the second conductive element.

11. The flexible hybrid interconnect circuit of claim 1 , wherein the inner dielectric has a uniform composition throughout an entire volume between the first outer dielectric and the second outer dielectric.

12. A flexible hybrid interconnect circuit, having a thickness, the flexible hybrid interconnect circuit comprising:
a first outer dielectric;
a second outer dielectric;
an inner dielectric;
a first conductive element comprising a first edge;
a second conductive element comprising a second edge and stacked with the first conductive element along the thickness of the flexible hybrid interconnect circuit and between the first outer dielectric and the second outer dielectric, wherein the inner dielectric is at least partially disposed between the first conductive element and the second conductive element providing support to the first conductive element and the second conductive element relative to each other; and
an interconnecting jumper looping around the first edge of the first conductive element and the second edge of the second conductive element and interconnecting the first conductive element and the second conductive element, wherein:
at least the first outer dielectric comprises an opening; and
the interconnecting jumper further loops around an edge of the first outer dielectric and extends through the opening in the first outer dielectric to form a connection with the first conductive element.

13. The flexible hybrid interconnect circuit of claim 12 , wherein the first conductive element is substantially wider than the second conductive element such that edges of the first conductive element extend past edges of the second conductive element.

14. The flexible hybrid interconnect circuit of claim 13 , wherein:
the first conductive element is operable as a shield;
the second conductive element is operable as a signal line configured to transmit an electromagnetic wave; and
the first conductive element comprises a plurality of openings each having a size less than a wavelength of the electromagnetic wave transmitted by the second conductive element.

15. The flexible hybrid interconnect circuit of claim 12 , wherein:
the first conductive element comprises a first conductive element portion, a second conductive element portion, and a transition portion, disposed between and monolithic with each of the first conductive element portion and the second conductive element portion; and
a width of the transition portion is less than a width of either the first conductive element portion or the second conductive element portion.

16. The flexible hybrid interconnect circuit of claim 15 , wherein the width of the transition portion is 5% to 50% of the width of either the first conductive element portion or the second conductive element portion.

17. The flexible hybrid interconnect circuit of claim 12 , wherein the inner dielectric comprises a crosslinked polyethylene (XLPE).

18. The flexible hybrid interconnect circuit of claim 12 , wherein the inner dielectric comprises a flame retardant.

19. The flexible hybrid interconnect circuit of claim 12 , wherein the inner dielectric comprises a coefficient of thermal expansion (CTE)-matching additive such that a CTE of the inner dielectric substantially matches a CTE of each of the first conductive element and the second conductive element.

20. The flexible hybrid interconnect circuit of claim 12 , wherein the inner dielectric has a uniform composition throughout an entire volume between the first outer dielectric and the second outer dielectric.

Assignees

• Cellink Corp

Inventors

• Coakley Kevin Michael
• Brown Malcolm Parker
• Juarez Jose
• Hernandez Emily
• Pratt Joseph
• Stone Peter
• Viswanath Vidya
• Findlay Will

Classifications

• H05K2201/052

  Branched · CPC title

• H01B7/0838

  Parallel wires, sandwiched between two insulating layers · CPC title

• H05K1/0237

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K2201/0154

  Polyimide · CPC title