Flexible hybrid interconnect circuit

Patent metadata

Field	Value
Publication number	US-10694618-B2
Application number	US-201916667133-A
Country	US
Kind code	B2
Filing date	Oct 29, 2019
Priority date	Oct 29, 2018
Publication date	Jun 23, 2020
Grant date	Jun 23, 2020

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

First claim

What is claimed is:

1. A flexible hybrid interconnect circuit, having a length, a width, and a thickness, the flexible hybrid interconnect circuit comprising:
a first outer dielectric;
a second outer dielectric;
a signal transmission portion, disposed between the first outer dielectric and the second outer dielectric along the thickness of the flexible hybrid interconnect circuit, the signal transmission portion comprising: a
signal line;
a first shield;
a second shield, wherein the signal line is disposed between the first shield and the second shield along the width of the flexible hybrid interconnect circuit;
a third shield, comprising an opening; and
a fourth shield, wherein the signal line is disposed between the third shield and the fourth shield along the thickness of the flexible hybrid interconnect circuit.

2. The flexible hybrid interconnect circuit of claim 1 , wherein each of the first shield and the second shield is disposed between the third shield and the fourth shield along the thickness of the flexible hybrid interconnect circuit.

3. The flexible hybrid interconnect circuit of claim 2 , wherein a size of a gap between the first shield and the third shield, a gap between the first shield and the fourth shield, a gap between the second shield and the third shield, and a gap between the second shield and the fourth shield along the thickness of the flexible hybrid interconnect circuit is each less than 1 millimeter.

4. The flexible hybrid interconnect circuit of claim 2 , wherein each of a size of a gap between the first shield and the third shield, a gap between the first shield and the fourth shield, a gap between the signal line and the third shield, a gap between the signal line and the fourth shield, a gap between the second shield and the third shield, and a gap between the second shield and the fourth shield along the thickness of the flexible hybrid interconnect circuit is substantially the same.

5. The flexible hybrid interconnect circuit of claim 1 , wherein the signal line is electrically insulated from each of the first shield, the second shield, the third shield, and the fourth shield.

6. The flexible hybrid interconnect circuit of claim 1 , further comprising a power transmission portion, disposed between the first outer dielectric and the second outer dielectric and offset relative to the signal transmission portion along the width of the flexible hybrid interconnect circuit, the power transmission portion comprising a first power conductor, a second power conductor, and a third power conductor, such that the third power conductor is disposed between the first power conductor and the second power conductor along the thickness of the flexible hybrid interconnect circuit.

7. The flexible hybrid interconnect circuit of claim 6 , wherein each of a size of a gap between the signal line and the third shield, a gap between the signal line and the fourth shield, a gap between the first power conductor and the third power conductor, and a gap between the second power conductor and the third power conductor along the thickness of the flexible hybrid interconnect circuit is substantially the same.

8. The flexible hybrid interconnect circuit of claim 1 , further comprising: a first inner dielectric, disposed between the signal line and the third shield; and a second inner dielectric disposed between the signal line and the fourth shield.

9. The flexible hybrid interconnect circuit of claim 8 , wherein at least one of the first inner dielectric and the second inner dielectric comprises crosslinked low density polyethylene (LDPE).

10. The flexible hybrid interconnect circuit of claim 8 , wherein: the first inner dielectric comprises: a first inner base, comprising polyethylene terephthalate (PET); a first inner outer-facing adhesive; and a first inner inner-facing adhesive; and the first inner base is disposed between the first inner outer-facing adhesive and the first inner inner-facing adhesive along the thickness of the flexible hybrid interconnect circuit.

11. The flexible hybrid interconnect circuit of claim 10 , wherein: the first inner outer-facing adhesive directly interfaces the third shield; and the first inner inner-facing adhesive directly interfaces the signal line.

12. The flexible hybrid interconnect circuit of claim 8 , wherein the first inner dielectric directly interfaces the second inner dielectric between the signal line and the first shield.

13. The flexible hybrid interconnect circuit of claim 12 , wherein at least one the first inner dielectric or the second inner dielectric is at least partially disposed between the signal line and the first shield.

14. The flexible hybrid interconnect circuit of claim 8 , wherein at least one the first inner dielectric or the second inner dielectric comprises a flame retardant.

15. The flexible hybrid interconnect circuit of claim 1 , wherein a thickness of each of the signal line, the first shield, and the second shield along the thickness of the flexible hybrid interconnect circuit is the same.

16. The flexible hybrid interconnect circuit of claim 1 , wherein a composition of each of the signal line, the first shield, and the second shield is the same.

17. The flexible hybrid interconnect circuit of claim 1 , wherein the signal line, the first shield, and the second shield are made from the same metal sheet.

18. The flexible hybrid interconnect circuit of claim 1 , wherein the signal line comprises a signal tab extending outside of space between the first outer dielectric and the second outer dielectric.

19. The flexible hybrid interconnect circuit of claim 1 , wherein the first outer dielectric comprises a first outer base and a first outer adhesive, the first outer adhesive directly interfacing the third shield.

20. The flexible hybrid interconnect circuit of claim 1 , wherein:
the first outer dielectric comprises a first dielectric opening;
the second outer dielectric comprises a second dielectric opening; and
the first dielectric opening, the second dielectric opening, and the opening in the third shield are aligned along the thickness of the flexible hybrid interconnect circuit thereby allowing in-plane bending of the flexible hybrid interconnect circuit.

Assignees

• Cellink Corp

Inventors

• Coakley Kevin Michael
• Brown Malcolm Parker
• Juarez Jose
• Hernandez Emily
• Pratt Joseph
• Stone Peter
• Viswanath Vidya
• Findlay Will

Classifications

• H05K3/4084

  by deforming at least one of the conductive layers · CPC title

• H05K1/0219 Primary

  Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors · CPC title

• H01B7/0861

  comprising one or more screens · CPC title

• H01B7/0838

  Parallel wires, sandwiched between two insulating layers · CPC title

• H05K2201/10401

  Eyelets, i.e. rings inserted into a hole through a circuit board · CPC title