Thermal profile monitoring wafer and methods of monitoring temperature

Patent metadata

Field	Value
Publication number	US-11515218-B2
Application number	US-202016842429-A
Country	US
Kind code	B2
Filing date	Apr 7, 2020
Priority date	Aug 11, 2016
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

Thermal monitors comprising a substrate with at least one camera position on a bottom surface thereof, a wireless communication controller and a battery. The camera has a field of view sufficient to produce an image of at least a portion of a wafer support, the image representative of the temperature within the field of view. Methods of using the thermal monitors are also described.

First claim

What is claimed is:

1. A thermal monitor comprising:
a substrate having a top surface and a bottom surface;
a plurality of cameras positioned on the substrate, each camera configured to obtain a thermal image of a field of view, at least one field of view oriented in a different direction relative to the substrate than at least one other field of view, with at least one camera positioned on the top surface of the substrate and at least one camera positioned on the bottom surface of the substrate;
a wireless communication controller; and
a battery connected to the plurality of cameras and the wireless communication controller,

wherein the thermal monitor has a total thickness less than about 1 inch.

2. The thermal monitor of claim 1 , wherein at least one camera of the plurality of cameras comprises a high resolution thermal imaging camera.

3. The thermal monitor of claim 2 , wherein the high resolution thermal imaging camera produces a color gradient image representative of temperature variations.

4. The thermal monitor of claim 1 , wherein the fields of view of the plurality of cameras overlap to provide a complete image.

5. The thermal monitor of claim 1 , wherein the wireless communication controller is configured to communicate through one or more of a wi-fi or Bluetooth standard.

6. The thermal monitor of claim 1 , wherein the plurality of cameras, the battery and the wireless communication controller are operable at temperatures in a range of about 50° C. to about 500° C.

7. The thermal monitor of claim 1 , further comprising a microcontroller connected to the wireless communication controller, the plurality of cameras and the battery.

8. The thermal monitor of claim 7 , wherein the microcontroller is configured to: analyze or process data received from the plurality of cameras; transmit the processed data through the wireless communication controller; and form a three-dimensional temperature map.

9. A thermal monitor comprising:
a substrate having a top surface, a sidewall, and a bottom surface;
a plurality of high resolution thermal imaging camera, at least one camera positioned on each of the top surface, the sidewall, and the bottom surface of the substrate, the plurality of camera configured to obtain a thermal image of a field of view;
a wireless communication controller;
a battery connected to the camera and the wireless communication controller; and
a microcontroller connected to the camera, the wireless communication controller, and the battery.

10. The thermal monitor of claim 9 , wherein the camera produces a color gradient image representative of temperature variations.

11. The thermal monitor of claim 9 , further comprising an additional camera on the substrate, the additional camera each having a field of view.

12. The thermal monitor of claim 11 , wherein the field of view of one of the plurality of camera and the field of view of the additional camera overlap to provide a larger image.

13. The thermal monitor of claim 11 , wherein the field of view of the one of the plurality of camera is oriented in a different direction relative to the substrate than the field of view of the additional camera.

14. The thermal monitor of claim 9 , wherein the wireless communication controller is configured to communicate through one or more of a wi-fi or Bluetooth standard.

15. The thermal monitor of claim 9 , wherein the plurality of camera, the battery, the wireless communication controller and the microcontroller are operable at temperatures in a range of about 50° C. to about 500° C.

16. The thermal monitor of claim 9 , wherein the microcontroller is configured to: analyze or process data received from the plurality of camera; transmit the processed data through the wireless communication controller; and form a three-dimensional temperature map.

17. A thermal monitor comprising:
a substrate having a top surface and a bottom surface;
a plurality of cameras positioned on the substrate with at least one camera positioned on the top surface and at least one camera positioned on the bottom surface, each of the cameras producing a high resolution color gradient thermal image representative of temperature variations, each of the cameras having a field of view, the fields of view of the cameras overlapping to provide a complete image with at least one field of view oriented in a different direction relative to the substrate than at least one other field of view;
a wireless communication controller configured to communicate through one or more of a wi-fi or Bluetooth standard;
a battery connected to the plurality of cameras and the wireless communication controller; and
a microcontroller connected to the wireless communication controller, the plurality of camera and the battery, the microcontroller configured to analyze or process data received from the plurality of cameras, transmit the processed data through the wireless communication controller, and form a three-dimensional temperature map, wherein the thermal monitor has a total thickness less than about 1 inch, and the plurality of cameras, battery and wireless communication controller operable at temperatures in a range of about 100° C. to about 500° C.

Assignees

• Applied Materials Inc

Inventors

• Jadhav Deepak

Classifications

• H10P74/277

  Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title