Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices

Patent metadata

Field	Value
Publication number	US-11515171-B2
Application number	US-202016895751-A
Country	US
Kind code	B2
Filing date	Jun 8, 2020
Priority date	Jun 8, 2020
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

This patent application relates to methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices with heat applied from a bond head of a thermocompression bonding tool. The stack is substantially enclosed within a skirt carried by the bond head to reduce heat loss and contaminants from the stack, and heat may be added from the skirt.

First claim

What is claimed is:

1. A thermocompression bonding apparatus, comprising:
a bond stage;
a bond head movable in X, Y and Z directions, the bond head including:
a bond tip having a compression surface on an underside thereof, the bond tip including a primary heating device; and
a skirt carried by and movable with the bond head, the skirt extending vertically downward from the bond head surrounding the bond tip and laterally encompassing an open-bottomed chamber sized to encompass a single stack of microelectronic devices.

2. The thermocompression bonding apparatus of claim 1 , wherein the skirt and the bond tip, in combination, comprise a bond tip assembly, and the skirt includes one or more sidewall heating devices.

3. The thermocompression bonding apparatus of claim 2 , wherein one or more of the one or more sidewall heating devices extend substantially around the chamber.

4. The thermocompression bonding apparatus of claim 2 , wherein the one or more sidewall heating devices comprise two or more horizontally oriented and vertically superimposed sidewall heating devices.

5. The thermocompression bonding apparatus of claim 4 , wherein the two or more sidewall heating devices extend substantially around the chamber.

6. The thermocompression bonding apparatus of claim 4 , wherein each of the two or more horizontally oriented and vertically superimpose sidewall is either configured to provide a different amount of heat or controllable to provide a different amount of heat.

7. The thermocompression bonding apparatus of claim 3 , wherein the one or more sidewall heating devices comprise a sidewall heating device extending vertically and horizontally along each side of the skirt.

8. The thermocompression bonding apparatus of claim 6 , wherein each sidewall heating device is configured to provide an increasing amount of heat with increasing vertical distance from the bond tip or controllable to provide a different amount of heat with increasing vertical distance from the bond tip.

9. The thermocompression bonding apparatus of claim 1 , wherein the bond stage includes a stage heating device.

10. The thermocompression bonding apparatus of claim 2 , wherein the skirt further comprises one or more of a thermally insulative material extending vertically along the skirt from proximate a top of the chamber to proximate a bottom of the chamber and circumferentially around the chamber laterally outside of the one or more sidewall heating devices, a heat reflective material extending vertically along the skirt from proximate a top of the chamber to proximate a bottom of the chamber and circumferentially around the chamber laterally outside of the one or more sidewall heating devices, and a low surface energy (LSE) material lining an inside surface of the skirt.

11. The thermocompression bonding apparatus of claim 10 , wherein the skirt comprises the thermally insulative material surrounding the heat reflective material, and the LSE material lining the inside surface of the skirt.

12. The thermocompression bonding apparatus of claim 2 , wherein the one or more sidewall heating devices are configured to provide sufficient heat to a stack of microelectronic devices located on the bond stage to at least partially offset loss of heat applied by the primary heating device of the bond tip to initiate bonding of discrete conductive elements between microelectronic devices of the stack and curing of dielectric material located in bond lines between the microelectronic devices and surrounding the discrete conductive elements.

13. The thermocompression bonding apparatus of claim 2 , wherein the bond tip is configured as a bond tip compression member vertically slidably disposed within the chamber, and further including a resilient compression element located above the bond tip compression member between a ceiling of a bore of a bond tip barrel from which the skirt extends downwardly, and a top of the bond tip compression member.

14. The thermocompression bonding apparatus of claim 13 , further including a cooperative key and slot arrangement between the bond tip compression member and at least one of the bond tip barrel and the skirt, the cooperative key and slot arrangement configured to constrain movement of the bond tip compression member to the vertical.

15. The thermocompression bonding apparatus of claim 1 , wherein the skirt comprises a tube of a heat reflective material extending downward from the bond head.

16. The thermocompression bonding apparatus of claim 15 , wherein the tube comprises a metal material having a polished interior surface.

17. The thermocompression bonding apparatus of claim 15 , further comprising a thermally insulative material surrounding and carried by the tube.

18. The thermocompression bonding apparatus of claim 17 , further comprising a transparent coating of a low surface energy (LSE) material lining an inner surface of the heat reflective material.

19. The thermocompression bonding apparatus of claim 18 , wherein the LSE material covers the compression surface of the bond tip.

20. The thermocompression bonding apparatus of claim 15 , further comprising a transparent coating of a low surface energy (LSE) material lining an inner surface of the heat reflective material.

21. The thermocompression bonding apparatus of claim 15 , wherein the bond tip is configured as a bond tip compression member vertically slidably disposed within the chamber, and further including a resilient compression element located above the bond tip compression member between a ceiling of the chamber and a top of the bond tip compression member.

22. The thermocompression bonding apparatus of claim 1 , further comprising one or more ports carried by the bond head and opening into the open-bottomed chamber, and a vacuum source in communication with the one or more ports.

23. A method, comprising:
aligning a bond head of a thermocompression bonding tool with a stack of two or more microelectronic devices supported on a substrate;
lowering the bond head over the stack of microelectronic devices to surround and substantially enclose the stack in a chamber within a skirt secured to and extending vertically downward from the bond head and to contact an uppermost microelectronic device of the stack with a bond tip of the bond head within the chamber;
applying heat from the bond tip to the stack of microelectronic devices through the uppermost microelectronic device; and
reducing heat loss from the bond tip through the stack of microelectronic devices and from a periphery of the stack with the skirt.

24. The method of claim 23 , further comprising adding heat to the stack of microelectronic devices from one or more heating devices carried by the skirt.

25. The method of claim 24 , further comprising adding a different amount of heat from different vertical portions of the skirt using the one or more heating devices.

26. The method of claim 23 , further comprising adding heat to the stack of microelectronic devices from substantially an entire periphery of the skirt from one or more heating devices carried by the skirt.

27. The method of claim 23 , wherein reducing heat loss from the bond tip through the stack of microelectronic devices and from a periphery of the stack with the skirt comprises using material of the skirt comprising thermal insulation.

28. The method of claim 23 , wherein redu

Assignees

• Micron Technology Inc

Inventors

• Qu Xiaopeng
• Chun Hyunsuk
• Wirz Brandon P
• Bayless Andrew M

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W72/073

  of die-attach connectors · CPC title