Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices
US-11515171-B2 · Nov 29, 2022 · US
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Patent family 78817788
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 78817788 |
| Family type | — |
| Earliest priority | Jun 8, 2020 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11515171B2 — Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices |
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US11515171B2 — Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices (published Nov 29, 2022)
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