Reduced sugar wafer

Patent metadata

Field	Value
Publication number	US-11510414-B2
Application number	US-201716314727-A
Country	US
Kind code	B2
Filing date	Jul 7, 2017
Priority date	Jul 8, 2016
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

The present invention relates a sugar reduced wafer composition comprising, 60-80 wt. % of flour, 10-23 wt. % of sucrose, 0.5-8.0 wt. %, preferably 0.5-5 wt. % of oil or fat and 5-20 wt. % of non-digestible fibers wherein the total amount of mono and disaccharides is 10-25 wt. %; all wt. % being in weight percentage of the composition dry mass. The invention also relates to a baked sugar reduced wafer such as a wafer cone or edible container made with this composition and a process for manufacturing the sugar reduced wafer.

First claim

The invention claimed is:

1. A sugar reduced wafer composition comprising:
60-80 wt. % of flour;
10-20 wt. % of sucrose;
0.5-8.0 wt. % of oil or fat; and
5-20 wt. % of non-digestible fiber selected from the group consisting of inulin, resistant dextrin, and a combination thereof, wherein a total amount of mono and disaccharides is 10-25 wt. %, all wt. % being in weight percentage of the sugar reduced wafer composition dry mass.

2. The sugar reduced wafer composition according to claim 1 comprising 0.2-3.0 wt. % emulsifier.

3. The sugar reduced wafer composition according to claim 1 comprising 0.5-6 wt. % whey or milk.

4. The sugar reduced wafer composition according to claim 1 comprising 0.5-3 wt. % oil or fat.

5. The sugar reduced wafer composition according to claim 4 , wherein the oil is selected from the group consisting of coconut oil, rapeseed oil, sunflower oil, soy oil, nut oil, and a combination, blend or fractions thereof.

6. The sugar reduced wafer composition according to claim 1 comprising 0.1-1.0 wt. % of sodium chloride.

7. The sugar reduced wafer composition according to claim 1 , wherein the sugar reduced wafer composition does not contain any polyols or high intensity sweeteners.

8. The sugar reduced wafer composition according to claim 1 , wherein the total amount of mono and disaccharides is 13-21 wt. %.

9. The sugar reduced wafer composition according to claim 1 , wherein a total amount of sucrose is 12-20 wt. %.

10. The sugar reduced wafer composition according to claim 1 comprising 35-45 wt. % water.

11. The sugar reduced wafer composition according to claim 1 , wherein the sugar reduced wafer composition has a viscosity between 2500 cps and 5000 cps.

12. A baked wafer comprising a sugar reduced wafer composition comprising 60-80 wt. % of flour, 10-20 wt. % of sucrose, 0.5-8.0 wt. % of oil or fat, and 5-20 wt. % of non-digestible fibers selected from the group consisting of inulin, resistant dextrin, and a combination thereof, wherein a total amount of mono and disaccharides is 10-25 wt. %, all wt. % being in weight percentage of the sugar reduced wafer composition dry mass, and the baked wafer having a water content after baking of 1.0-6.5 wt. % and a water content after storage of 2.5-6.0 wt. %.

13. A process for manufacturing a sugar reduced wafer, the process comprising:
providing a composition comprising 60-80 wt. % of flour, 10-20 wt. % of sucrose, 0.5-8.0 wt. % of oil or fat, and 5-20 wt. % of non-digestible fibers selected from the group consisting of inulin, resistant dextrin, and a combination thereof, wherein a total amount of mono and disaccharides is 10-25 wt. %, all wt. % being in weight percentage of the composition dry mass;
adding the composition into a baking plate or iron;
baking the composition in an oven at a temperature between 180° C. and 215° C. for 50 to 75 sec to obtain a baked wafer; and
shaping the baked wafer before the baked wafer becomes rigid.

14. The sugar reduced wafer composition according to claim 1 , wherein at least 60% in dry mass of the non-digestible fiber is non-digestible oligosaccharides.

15. The baked wafer according to claim 12 , wherein at least 60% in dry mass of the non-digestible fibers are non-digestible oligosaccharides.

16. The process according to claim 13 , wherein at least 60% in dry mass of the non-digestible fibers are non-digestible oligosaccharides.

17. The sugar reduced wafer composition according to claim 1 comprising 10-12 wt. % of the sucrose.

18. The baked wafer according to claim 12 comprising 10-12 wt. % of the sucrose.

19. The process according to claim 13 , wherein the composition comprises 10-12 wt. % of the sucrose.

Assignees

• Nestec Sa
• Nestle Sa

Inventors

• Sunderland Charles-Austin
• Green John
• De Labauve D'Arifat Louis

Classifications

• A23G2220/14

  being an edible support, e.g. a cornet · CPC title

• A21D2/364

  Nuts, e.g. cocoa · CPC title

• A21D13/062

  with modified sugar content; Sugar-free products · CPC title

• A21D2/16

  Fatty acid esters · CPC title

• A21D13/45

  Wafers (filled wafers A21D13/36) · CPC title