Organic light-emitting device and method of manufacturing the same
US-10734597-B2 · Aug 4, 2020 · US
US11502145B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11502145-B2 |
| Application number | US-202016899124-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 11, 2020 |
| Priority date | Oct 11, 2019 |
| Publication date | Nov 15, 2022 |
| Grant date | Nov 15, 2022 |
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A method of manufacturing a light-emitting display apparatus and a light-emitting display apparatus are provided. The method includes forming a first photosensitive layer on a conductive material layer, forming a pixel electrode by etching the conductive material layer by using the first photosensitive layer as a mask, ashing the first photosensitive layer disposed on the pixel electrode, forming a pixel defining layer that covers an edge portion of the pixel electrode and includes a first opening overlapping the ashed first photosensitive layer, removing the ashed first photosensitive layer disposed in the first opening, forming an intermediate layer including a functional layer and an emission layer on the pixel defining layer, and forming an opposite electrode on the intermediate layer.
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What is claimed is: 1. A method of manufacturing a light-emitting display apparatus, the method comprising: forming a first photosensitive layer on a conductive material layer; forming a pixel electrode by etching the conductive material layer by using the first photosensitive layer as a mask; ashing the first photosensitive layer disposed on the pixel electrode; forming a pixel defining layer that covers an edge portion of the pixel electrode and includes a first opening overlapping the ashed first photosensitive layer; removing the ashed first photosensitive layer disposed in the first opening; forming an intermediate layer including a functional layer and an emission layer on the pixel defining layer; and forming an opposite electrode on the intermediate layer. 2. The method of claim 1 , wherein the forming of the pixel defining layer comprises: forming a color material layer on the ashed first photosensitive layer; exposing a part of the color material layer; and forming the first opening by developing the exposed part of the color material layer. 3. The method of claim 2 , wherein the pixel defining layer comprises a negative photosensitive material. 4. The method of claim 3 , further comprising: curing the pixel defining layer after the forming of the first opening. 5. The method of claim 3 , wherein the pixel defining layer further comprises a color pigment or carbon black. 6. The method of claim 1 , wherein a shape of the first opening is substantially same as a shape of the pixel electrode in a plan view. 7. The method of claim 1 , further comprising: forming a thin-film transistor; and forming an insulating layer between the thin-film transistor and the pixel electrode, wherein the forming of the insulating layer includes forming a contact hole for electrical connection between the thin-film transistor and the pixel electrode, and the first opening overlaps the contact hole. 8. The method of claim 7 , further comprising: forming an optical functional layer comprising a color filter overlapping the first opening and a black matrix adjacent to the color filter, wherein the black matrix overlaps the contact hole. 9. The method of claim 1 , further comprising: forming a second photosensitive layer on the conductive material layer; and forming a wiring by etching the conductive material layer using the second photosensitive layer as a mask. 10. The method of claim 9 , further comprising: ashing the second photosensitive layer disposed on the wiring, wherein the forming of the pixel defining layer comprises forming a second opening overlapping the ashed second photosensitive layer and spaced apart from the first opening. 11. The method of claim 10 , further comprising: removing the ashed second photosensitive layer from the second opening. 12. The method of claim 11 , further comprising: forming an insulating layer overlapping the second opening and disposed between the wiring and the intermediate layer. 13. The method of claim 11 , further comprising: forming a hole in a portion of the functional layer, which overlaps the wiring, wherein the opposite electrode is formed to be in electrical contact with the wiring through the hole.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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