Welding method of diffusion bonded structure

Patent metadata

Field	Value
Publication number	US-11498145-B2
Application number	US-201916515391-A
Country	US
Kind code	B2
Filing date	Jul 18, 2019
Priority date	Jan 24, 2017
Publication date	Nov 15, 2022
Grant date	Nov 15, 2022

Abstract

A welding method of a diffusion bonded structure in which the diffusion bonded structure formed by diffusion bonding metal parts to each other is bonded to another part by fusion welding includes a buffer layer forming step of forming a buffer layer in a welding region including a diffusion bonded joint of the diffusion bonded structure, the buffer layer having greater ductility than the diffusion bonded joint, and a welding step of bonding the welding region in which the buffer layer is formed to the another part by performing the fusion welding from above the buffer layer.

First claim

What is claimed is:

1. A welding method of a diffusion bonded structure in which the diffusion bonded structure formed by diffusion bonding metal parts to each other is bonded to another part by fusion welding, the welding method comprising:
a buffer layer forming step of forming a buffer layer in a welding region including a diffusion bonded joint of the diffusion bonded structure, the buffer layer having higher ductility than the diffusion bonded joint in a high temperature region in which the ductility of the diffusion bonded joint decreases; and
a welding step of bonding the welding region in which the buffer layer is formed to the another part by performing the fusion welding from above the buffer layer in the high temperature region in which the ductility of the diffusion bonded joint decreases,
wherein the metal parts are made of a Ni alloy or a stainless steel.

2. The welding method of a diffusion bonded structure according to claim 1 , wherein, in the buffer layer forming step, the buffer layer is formed by overlay welding.

3. The welding method of a diffusion bonded structure according to claim 1 , wherein, in the buffer layer forming step, the buffer layer is formed by any one of processes of powder sintering, ultrasonic welding, friction welding, friction surfacing, friction stir welding, friction stir processing, diffusion bonding, brazing, magnetic pulse welding, and explosive welding.

4. The welding method of a diffusion bonded structure according to claim 1 , wherein the diffusion bonded structure is fusion welded to the another part by a joint welding method.

5. The welding method of a diffusion bonded structure according to claim 2 , wherein the diffusion bonded structure is fusion welded to the another part by a joint welding method.

6. The welding method of a diffusion bonded structure according to claim 3 , wherein the diffusion bonded structure is fusion welded to the another part by a joint welding method.

7. The welding method of a diffusion bonded structure according to claim 4 , wherein the fusion welding by the joint welding method is patch welding, butt welding, fillet welding, or lap welding.

8. The welding method of a diffusion bonded structure according to claim 5 , wherein the fusion welding by the joint welding method is patch welding, butt welding, fillet welding, or lap welding.

9. The welding method of a diffusion bonded structure according to claim 6 , wherein the fusion welding by the joint welding method is patch welding, butt welding, fillet welding, or lap welding.

10. The welding method of a diffusion bonded structure according to claim 1 , wherein the metal parts and the buffer layer are made of a Ni alloy.

11. The welding method of a diffusion bonded structure according to claim 1 , wherein the metal parts and the buffer layer are made of a stainless steel.

12. The welding method of a diffusion bonded structure according to claim 1 , wherein the metal parts and the buffer layer are made of metal materials with the same alloy composition.

Assignees

• Ihi Corp

Inventors

• Masaki Kunitaka
• Harada Rie
• HOSOYA Nagisa
• Matsuoka Takaaki
• Mizo Yutaka

Classifications

• B23K20/00

  Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating · CPC title

• B23K9/23

  taking account of the properties of the materials to be welded · CPC title

• B23K20/02

  by means of a press {; Diffusion bonding} · CPC title

• B23K9/235 Primary

  Preliminary treatment · CPC title

• B23K9/04 Primary

  Welding for other purposes than joining, e.g. built-up welding · CPC title