Methods for printing conformal materials on component edges at high resolution

Patent metadata

Field	Value
Publication number	US-11497124-B2
Application number	US-202117302449-A
Country	US
Kind code	B2
Filing date	May 3, 2021
Priority date	Jun 9, 2020
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

First claim

What is claimed is:

1. A method, comprising:
during a first printing step, printing by a laser-based printing system a material on edges of an electronic component by laser induced spraying, wherein the laser induced spraying sprays droplets of the material with a first droplet size onto the edges of the electronic component;
curing the material printed during the first printing step;
during a second printing step, printing by the laser-based printing system the material over portions of the electronic component excluding the edges by laser induced jetting, wherein the laser induced jetting jets droplets of the material with a second droplet size onto the portions of the electronic component excluding the edges, wherein the first droplet size is smaller than the second droplet size; and
curing the material printed during the second printing step.

2. The method of claim 1 , further comprising during the first printing step, the droplets of the material with the first droplet size are sprayed, using a laser of the laser-based printing system, from a layer of the material coated on a transparent or semi-transparent substrate.

3. The method of claim 2 , further comprising coating, by a coating system, a uniform layer of the material on the transparent or semi-transparent substrate, the coating comprising:
driving, by an air or mechanical pump, the material from a syringe containing the material onto the substrate;
forming a gap between rollers or knifes; and
translating, by one or more motors, the substrate through the gap to remove excess amounts of the material from the transparent or semi-transparent substrate so as to form the uniform layer of the material on the transparent or semi-transparent substrate with a thickness that is defined by the gap.

4. The method of claim 3 , wherein coating further comprises:
translating, by the one or more motors, the substrate bidirectionally in a controlled manner through the gap so as to form the uniform layer of the material on the substrate with the thickness that is defined by the gap.

5. The method of claim 2 , wherein the material is one of: a highly viscous material, a wax material, a polymer material, a mix of a polymer and a monomer material, a heat or light sensitive low viscosity material, a UV-curable material, a heat-curable material, and a dryable material.

6. The method of claim 2 , wherein the transparent or semi-transparent substrate is a continuous transparent film substrate, the method further comprising coating the continuous transparent film substrate with a metal layer or with the metal layer and a dielectric layer.

7. The method of claim 1 , wherein the curing of the material printed during the first or second printing step is performed by ultraviolet (UV) light and/or heat.

8. The method of claim 2 , wherein during one or more of the first and second printing steps, a bottom surface of the transparent or semi-transparent substrate is oriented at an acute angle with respect to a top surface of the electronic component.

9. The method of claim 1 , further comprising inspecting, with an inspection module, the electronic component after each of the first and second printing steps, wherein the inspection is performed using an inspection module integrated with the laser-based printing system.

10. The method of claim 2 , further comprising:
during a third printing step, printing by the laser-based printing system the material over yet-to-be printed portions of the electronic component, wherein during the third printing step, a bottom surface of the transparent or semi-transparent substrate is disposed at an acute angle with respect to a top surface of the electronic component; and
curing the material printed during the third printing step.

Assignees

• Io Tech Group Ltd

Inventors

• Zenou Michael

Classifications

• H05K3/284 Primary

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K3/1283

  After-treatment of the printed patterns, e.g. sintering or curing methods · CPC title

• H05K3/0091

  Apparatus for coating printed circuits using liquid non-metallic coating compositions · CPC title

• H05K3/282 Primary

  for inhibiting the corrosion of the circuit, e.g. for preserving the solderability · CPC title

• H05K2201/09872

  Insulating conformal coating · CPC title