Methods and Apparatus for Printing High-Viscosity Materials

Patent metadata

Field	Value
Publication number	US-2018090314-A1
Application number	US-201715709486-A
Country	US
Kind code	A1
Filing date	Sep 20, 2017
Priority date	Sep 28, 2016
Publication date	Mar 29, 2018
Grant date	—

Abstract

A method for disposing material includes positioning a donor film including a donor material at a predefined distance from an acceptor substrate, the donor film facing toward the acceptor substrate. One or more pulses of laser radiation are directed to impinge on the donor film at a given location so as to induce formation of a protrusion made from the donor material. A distal tip of the protrusion touches the acceptor substrate and disposes thereon while the protrusion is still in contact with the donor film. A spot of the donor material is formed on the acceptor substrate by increasing a separation between the donor film and the acceptor substrate so as to detach the distal tip of the protrusion from the donor film.

First claim

1 . A method for disposing material, comprising:
positioning a donor film comprising a donor material at a predefined distance from an acceptor substrate, wherein the donor film is facing toward the acceptor substrate; directing one or more pulses of laser radiation to impinge on the donor film at a given location so as to induce formation of a protrusion made from the donor material, wherein a distal tip of the protrusion touches the acceptor substrate and disposes thereon while the protrusion is still in contact with the donor film; and forming a spot of the donor material on the acceptor substrate by increasing a separation between the donor film and the acceptor substrate so as to detach the distal tip of the protrusion from the donor film.

2 . The method according to claim 1 , wherein positioning the donor film at the predefined distance is carried out after directing the pulses of the laser radiation, and wherein increasing the separation is carried out after the distal tip of the protrusion touches the acceptor substrate.

3 . The method according to claim 1 , and comprising controlling an amount of the disposed donor material by controlling the predefined distance between the donor film and the acceptor substrate.

4 . The method according to claim 1 , wherein directing the pulses of the laser radiation comprises setting at least one parameter of the laser pulses based on the predefined distance.

5 . The method according to claim 1 , and comprising disposing additional donor material on top of the disposed donor material at the given location by (i) re-positioning the donor film at the predefined distance without applying additional pulses of the laser radiation and (ii) increasing the separation between the donor film and the acceptor substrate again.

6 . The method according to claim 1 , and comprising disposing on the acceptor substrate a contiguous pattern of the donor material, by performing one or more of:
spatially shaping a beam of the laser radiation; and directing one or more additional pulses of the laser radiation to impinge on the donor film at a predefined spacing from the given location.

7 . The method according to claim 1 , wherein directing the pulses of the laser radiation comprises scanning the laser radiation to impinge on the donor film at multiple points.

8 . The method according to claim 1 , wherein directing the pulses of the laser radiation comprises splitting the laser radiation to multiple beams that impinge on the donor film at multiple respective locations separated from one another.

9 . The method according to claim 1 , and comprising, before finally disposing the protrusions on the acceptor substrate, forming the protrusions by (i) positioning an auxiliary substrate at a given distance from the donor film, (ii) shaping the protrusions by increasing a separation between the donor film and the auxiliary substrate and (iii) removing the auxiliary substrate.

10 . The method according to claim 9 , wherein the auxiliary substrate comprises an allocated area of the acceptor substrate.

11 . The method according to claim 9 , wherein the auxiliary substrate comprises a substrate different from the acceptor substrate.

12 . The method according to claim 1 , wherein the donor material has an equivalent viscosity level higher than 10,000 centipoise at a temperature of 25° C.

13 . The method according to claim 1 , wherein directing the pulses of the laser radiation comprises forming a geometrical pattern of spots on the acceptor substrate, by directing the pulses to multiple different locations on the donor film and inducing the formation of multiple protrusions at the multiple locations, and comprising, after forming the protrusions, printing the geometrical pattern by increasing a separation between the donor film and the acceptor substrate so as to detach distal tips of the protrusions from the donor film.

14 . The method according to claim 13 , and comprising repeating printing of the geometrical pattern without applying additional pulses of the laser radiation.

15 . The method according to claim 1 , wherein the donor material comprises a given material whose viscosity decreases under shear stress.

16 . The method according to claim 15 , wherein the shear stress is caused by the one or more pulses of laser radiation impinging on the donor film.

17 . The method according to claim 16 , wherein in response to removal of the shear stress, the viscosity level of the given material returns to its pre-stress level after a time delay between 100 microseconds and 100 milliseconds.

18 . The method according to claim 15 , wherein the given material comprises a form selected from a list consisting of an ink, a paste, a gel, and dispersions comprising particles.

19 . An apparatus for disposing material, the apparatus comprising:
a positioning assembly, which is configured to position a donor film comprising a donor material at a predefined distance from an acceptor substrate, wherein the donor film is facing toward the acceptor substrate; and an optical assembly, which is configured to generate one or more pulses of laser radiation and to direct the one or more pulses to impinge on the donor film at a given location so as to induce formation of a protrusion made from the donor material, wherein a distal tip of the protrusion touches the acceptor substrate and disposes thereon while the protrusion is still in contact with the donor film, wherein, after forming the protrusion, the positioning assembly is configured to form a spot of the donor material on the acceptor substrate by increasing a separation between the donor film and the acceptor substrate so as to detach the distal tip of the protrusion from the donor film.

20 . The apparatus according to claim 19 , wherein the positioning assembly is configured to position the donor film at the predefined distance after directing the pulses of the laser radiation, and to increase the separation after the distal tip of the protrusion touches the acceptor substrate.

21 . The apparatus according to claim 19 , wherein the positioning assembly is configured to control an amount of the disposed donor material by controlling the predefined distance between the donor film and the acceptor substrate.

22 . The apparatus according to claim 19 , wherein the optical assembly is configured to set at least one parameter of the laser pulses based on the predefined distance.

23 . The apparatus according to claim 19 , wherein the positioning assembly is configured to dispose additional donor material on top of the disposed donor material at the given location by (i) re-positioning of the donor film and (ii) increasing the separation between the donor film and the acceptor substrate again.

24 . The apparatus according to claim 19 , wherein the optical assembly is configured to dispose on the acceptor substrate a contiguous pattern of the donor material, by performing one or more of:
spatially shaping a beam of the laser radiation; and directing one or more additional pulses of the laser radiation to impinge on the donor film at a predefined spacing from the given location.

25 . The apparatus according to claim 19 , wherein the optical assembly is configured to scan the laser radiation to impinge on the donor film at multiple points.

26 . The apparatus according to claim 19 , wherein the optical assembly is configured to s

Assignees

• Orbotech Ltd

Inventors

• Kotler Zvi
• Ankri Jonathan

Classifications

• H10P72/70

  for supporting or gripping · CPC title

• H10P14/6329 Primary

  using physical ablation of a target, e.g. physical vapour deposition or pulsed laser deposition · CPC title

• H05K3/046

  by selective transfer or selective detachment of a conductive layer · CPC title

• B05D1/286

  using a temporary backing to which the coating has been applied · CPC title

• H05K3/305

  Affixing by adhesive · CPC title