Data communication system

Patent metadata

Field	Value
Publication number	US-11495899-B2
Application number	US-201816764142-A
Country	US
Kind code	B2
Filing date	Nov 14, 2018
Priority date	Nov 14, 2017
Publication date	Nov 8, 2022
Grant date	Nov 8, 2022

Abstract

A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

First claim

We claim:

1. A data communication system comprising:
a substrate having a first surface and a second surface opposite the first surface;
an integrated circuit mounted to the first surface of the substrate;
a first plurality of electrical connectors mounted to the first surface of the substrate, wherein the first plurality of electrical connectors are arranged so as to surround the integrated circuit; and
a second plurality of electrical connectors mounted to the second surface of the substrate.

2. The data communication system as recited in claim 1 , wherein the first plurality of electrical connectors are in electrical communication with the integrated circuit.

3. The data communication system as recited in claim 1 , wherein the first plurality of electrical connectors are configured as cable connector assemblies.

4. The data communication system as recited in claim 1 , further comprising a heat sink that is in thermal communication with the integrated circuit.

5. The data communication system as recited in claim 1 , wherein the heat sink is in physical contact the integrated circuit.

6. The data communication system as recited in claim 5 , wherein the heat sink defines an overhang that projects out from the integrated circuit so as to define a gap that extends from the overhang to the substrate.

7. The data communication system as recited in claim 6 , wherein the gap is between substantially 1 mm and substantially 5 mm.

8. The data communication system as recited in claim 7 , wherein at least one electrical connector of the first plurality of electrical connectors has a height less than the height of the gap.

9. The data communication system as recited in claim 8 wherein at least a portion of the electrical connector is disposed in the gap.

10. The data communication system as recited in claim 9 , wherein an entirety of the electrical connector is disposed in the gap.

11. The data communication system as recited in claim 1 , wherein the second plurality of electrical connectors are in electrical communication with the integrated circuit.

12. The data communication system as recited in claim 1 , wherein the substrate is configured as a printed circuit board.

13. The data communication system as recited in claim 1 , wherein the integrated circuit is an application specific integrated circuit.

Assignees

• Samtec Inc

Inventors

• Zbinden Eric
• Shah Jignesh H

Classifications

• H01R12/714 Primary

  with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit · CPC title

• H01R12/724 Primary

  containing contact members forming a right angle · CPC title

• H05K1/021

  Components thermally connected to metal substrates or heat-sinks by insert mounting · CPC title

• H01R13/187

  with spring member in the socket · CPC title