Optical module

Patent metadata

Field	Value
Publication number	US-9606307-B2
Application number	US-201314430620-A
Country	US
Kind code	B2
Filing date	Sep 2, 2013
Priority date	Sep 27, 2012
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Object
To prevent deformation of locating pins and breakage of the glass substrate on which locating holes are formed.
Means for Solving the Problems
There is provided an optical module including: a glass substrate that includes an optical-electric-conversion element, that is transparent to either one of light emitted from the optical-electric-conversion element and light received by the optical-electric-conversion element, and in which a locating hole is formed; and an optical component in which a locating pin is formed, the glass substrate and the optical component being positioned by fitting the locating pin to the locating hole through a protective film so that the protective film is in contact with the locating hole and the locating pin.

First claim

The invention claimed is:

1. An optical module, comprising:
a glass substrate
that includes an optical-electric-conversion element,
that is transparent to either one of light emitted from the optical-electric-conversion element and light received by the optical-electric-conversion element, and
in which a locating hole is formed; and
an optical component in which a locating pin is formed,
wherein the locating pin has a tapered surface and is fitted to the locating hole through a protective film,
a recess is formed around a root of the locating pin in the optical component,
the glass substrate and the optical component being positioned by fitting the locating pin to the locating hole through a protective film so that the protective film is in contact with an edge of the locating hole and the tapered surface of the locating pin, and
the protective film is formed beforehand on the edge of the locating hole of the glass substrate, the protective film formed on the surface of the glass substrate being placed between the glass substrate and the recess of the optical component, and a part of the protective film being formed on the surface of the glass substrate.

2. An optical module according to claim 1 , wherein
the locating pin is fitted to the locating hole through the protective film, the protective film being formed beforehand on an edge of the locating hole of the glass substrate.

3. An optical module according to claim 2 , wherein
irregularities of the glass substrate on the edge of the locating hole are covered by the protective film, and
an opening of the locating hole is composed of the protective film.

4. An optical module according to claim 2 , wherein
the protective film is resin film.

5. An optical module according to claim 2 , wherein
the protective film is resin film that is formed together with a passivation film of the glass substrate.

6. An optical module according to claim 2 , wherein
a through via is formed on the glass substrate, and
the protective film is formed by means in which film is laminated on the glass substrate by vacuum lamination.

7. An optical module according to claim 2 , wherein
the protective film is metal film.

8. An optical module according to claim 7 , wherein
the protective film is metal film that is formed together with wiring of the glass substrate.

9. An optical module according to claim 2 , wherein
the locating hole is a non-through hole, and
the protective film is not formed on a bottom of the locating hole.

10. An optical module according to claim 9 , wherein
the protective film is formed
by forming a photosensitive resin layer on a surface of the glass substrate on which the locating hole is formed and
by exposing and developing the resin layer.

11. An optical module according to claim 2 , wherein
the protective film is formed on an inner surface of the locating hole.

12. An optical module according to claim 1 , wherein
the locating hole is a tapered non-through hole, and
the locating pin has a truncated cone shape.

13. An optical module according to claim 1 , wherein
a coefficient of linear expansion of the glass substrate is different from a coefficient of linear expansion of the optical component.

14. An optical module,
comprising:
a glass substrate
that includes an optical-electric conversion element,
that is transparent to either one of light emitted from the optical-electric-conversion element and light received by the optical-electric-conversion element, and
in which a locating hole is formed; and
an optical component in which a locating pin is formed,
wherein the locating pin has a tapered surface,
the glass substrate and the optical component are positioned by fitting the locating pin to the locating hole through a protective film so that the protective film is in contact with an edge of the locating hole and the tapered surface of the locating pin,
an edge of the locating hole is chamfered, and
the protective film is in contact with the tapered surface of the locating pin and a chamfered surface of the locating hole, and a part of the protective film being formed on the surface of the glass substrate.

Assignees

• Fujikura Ltd

Inventors

• Matsumaru Kohei
• Yamamoto Satoshi
• Nakazato Hiroto

Classifications

• G02B6/4214 Primary

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title

• G02B6/4246

  Bidirectionally operating package structures · CPC title

• G02B6/4259

  of the transparent type · CPC title

• G02B6/4284

  of optical modules with disconnectable electrical connectors (latching arms for electrical connectors H01R13/627) · CPC title