Integrated parallel optical transceiver

Patent metadata

Field	Value
Publication number	US-9647762-B2
Application number	US-201514844661-A
Country	US
Kind code	B2
Filing date	Sep 3, 2015
Priority date	Feb 4, 2015
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Aspects of the present invention include an optical transceiver for providing transmission and reception of optical signals. The optical transceiver includes a carrier having two opposing surfaces and one or more openings extending from a first of the two opposing surfaces to a second of the two opposing surfaces. The optical transceiver includes a laser driver chip coupled to the first surface. The optical transceiver includes a vertical cavity surface emitting laser (VCSEL) array chip coupled to the first surface. The optical transceiver includes a photodetector array chip coupled to the first surface. The optical transceiver includes a receiver amplifier chip coupled to the first surface. The optical transceiver includes an optical coupling element coupled to the second surface. The VCSEL array chip and the photodetector array chip are disposed such that optical signals can pass through the one or more openings in the carrier.

First claim

What is claimed is:

1. An optical transceiver comprising:
a carrier having two opposing surfaces and one or more openings extending from a first surface of the two opposing surfaces to a second surface of the two opposing surfaces;
a laser driver chip coupled to the first surface;
a vertical cavity surface emitting laser (VCSEL) array chip coupled to the first surface;
a photodetector array chip coupled to the first surface;
a receiver amplifier chip coupled to the first surface; and
an optical coupling element coupled to the second surface, wherein the optical coupling element includes a housing with one or more lead-in surfaces that guide an optical connector ferrule to alignment with the optical coupling element, and wherein the optical coupling element includes at least one of: a plurality of sampling lenses, a plurality of collimating lenses, at least one feedback mirror, a plurality of monitor focusing lenses, a plurality of final receiver focusing lenses, or a plurality of focusing lenses;
wherein the VCSEL array chip and the photodetector array chip are disposed such that optical signals can pass through the one or more openings in the carrier.

2. The optical transceiver of claim 1 , further comprising a heat spreader/stiffener coupled via one or more intermediary components to at least a portion of the laser driver chip, the VCSEL array chip, the photodetector array chip, and the receiver amplifier chip.

3. The optical transceiver of claim 2 , wherein the heat spreader/stiffener is coupled to at least a portion of the laser driver chip, the VCSEL array chip, the photodetector array chip, and the receiver amplifier chip with at least one internal thermal interface material.

4. The optical transceiver of claim 2 , wherein the heat spreader/stiffener is coupled to at least one external thermal interface material.

5. The optical transceiver of claim 1 , further comprising a plurality of electrical contact pads coupled to the second surface of the carrier, and wherein one or more of the plurality of electrical contact pads surround the optical coupling element.

6. The optical transceiver of claim 1 , wherein the laser driver chip, the VCSEL array chip, the photodetector array chip, and the receiver amplifier chip are coupled to the carrier via flip chip technology.

7. The optical transceiver of claim 1 , wherein the carrier is one of an organic laminate or a ceramic carrier.

8. The optical transceiver of claim 1 , wherein the openings in the carrier are of a cylindrical shape.

9. The optical transceiver of claim 1 , wherein the carrier includes one or more openings to accommodate mating posts.

10. The optical transceiver of claim 1 , wherein the optical coupling element is configured to interface with a plurality of optical fibers.

11. The optical transceiver of claim 1 , wherein the optical coupling element is configured to receive a corresponding coupling element containing a plurality of optical fibers.

12. The optical transceiver of claim 1 , wherein at least one surface of the optical coupling element is transparent at a wavelength of a transmitter laser.

13. The optical transceiver of claim 1 , wherein the optical coupling element includes one or more posts for mating to the one or more openings in the carrier.

14. The optical transceiver of claim 1 , wherein optical signals pass through the one or more openings in the carrier.

15. The optical transceiver of claim 1 , wherein electrical signals pass through one or more signal traces in the carrier.

Assignees

• IBM

Inventors

• Arvelo Amilcar
• Benner Alan F
• Ellsworth Michael J
• Mckeever Eric J
• Nguyen Thong N
• Seminaro Edward J

Classifications

• H04B10/40 Primary

  Transceivers · CPC title

• H01S5/423

  having a vertical cavity · CPC title

• H04B10/503

  Laser transmitters · CPC title

• G02B6/4296

  coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources · CPC title

• G02B6/425

  Optical features (semiconductor laser arrays H01S5/40; hybrid LED arrays H10W90/00) · CPC title