Systems for integrated decomposition and scanning of a semiconducting wafer
US-11049741-B2 · Jun 29, 2021 · US
Systems for integrated decomposition and scanning of a semiconducting wafer
US11476134B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11476134-B2 |
| Application number | US-202117361943-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 29, 2021 |
| Priority date | Dec 1, 2017 |
| Publication date | Oct 18, 2022 |
| Grant date | Oct 18, 2022 |
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Abstract
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Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
First claim
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What is claimed is: 1. A system for decomposing and scanning a surface of a semiconducting wafer utilizing a nozzle comprising: a nozzle including a nozzle body defining an inlet port in fluid communication with a first nozzle port, and defining a second nozzle port in fluid communication with an outlet port, the nozzle body configured to receive a fluid through the inlet port and direct the fluid through the first nozzle port to introduce the fluid to a surface of a semiconducting wafer, the nozzle body configured to remove the fluid from the surface of the semiconducting wafer via the second nozzle port and direct the fluid from the second nozzle port through the outlet port, and a nozzle hood extending from the nozzle body adjacent the first nozzle port and the second nozzle port and defining a channel disposed at least partially between the first nozzle port and the second nozzle port, the nozzle hood configured to direct the fluid from the first nozzle port to the second nozzle port along the surface of the semiconducting wafer; and a pump system fluidically coupled to the nozzle, the pump system including a first pump fluidically coupled to the inlet port of the nozzle body, the first pump configured to deliver the fluid to the inlet port and to introduce the fluid to the surface of the semiconducting wafer via the first nozzle port upon operation of the first pump, and a second pump fluidically coupled to the outlet port of the nozzle body, the second pump configured to remove the fluid from the surface of the semiconducting wafer via the second nozzle port and direct the fluid from the second nozzle port through the outlet port. 2. The system of claim 1 , further comprising a nebulizer fluidically coupled to the pump system, the nebulizer configured to spray a decomposition fluid onto the surface of the semiconducting wafer upon operation of the pump system. 3. The system of claim 2 , wherein the pump system includes a third pump, the third pump configured to push the decomposition fluid to the nebulizer, wherein the nebulizer aerosolizes the decomposition fluid onto the surface of the semiconducting wafer upon operation of the third pump. 4. The system of claim 1 , wherein the channel of the nozzle hood has a length of approximately a radius of the semiconducting wafer. 5. The system of claim 1 , further including a sensor configured to detect a presence or an absence of a fluid within a fluid line between the nozzle and the first pump or between the nozzle and the second pump. 6. The system of claim 5 , further including a controller operably coupled to the sensor and the pump system, the controller configured to control operation of the pump system responsive to receipt of sense signals from the sensor indicative of the presence or the absence of the fluid within the fluid line. 7. The system of claim 1 , further including a first sensor configured to detect a presence or an absence of a fluid within a fluid line between the nozzle and the first pump; and a second sensor configured to detect a presence or an absence of a fluid within a fluid line between the nozzle and the second pump.
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Classifications
Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title
Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title
Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title
involving removal of lid, door or cover · CPC title
Horizontal transfer of a single workpiece · CPC title
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Frequently asked questions
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- What does patent US11476134B2 cover?
- Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
- Who is the assignee on this patent?
- Elemental Scientific Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0414. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 18 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).