Lead component mounting machine and lead component mounting method

US10617013B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10617013-B2
Application numberUS-201415312037-A
CountryUS
Kind codeB2
Filing dateMay 20, 2014
Priority dateMay 20, 2014
Publication dateApr 7, 2020
Grant dateApr 7, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A lead component mounting machine is provided in which lead wires are pinched and held from both sides by a pair of pawl portions, and the lead wires are inserted into through-holes of a board. The holding by the pawl portions is loosened, and a component main body is pushed in by a pushing-in device until the component main body comes into contact with the pawl portions. Subsequently, the strength of the holding by the pawl portions is increased, and the cutting and clinching of the lead wires is performed. Sliding movement of the lead wires is in a state of being suppressed by the pawl portions.

First claim

Opening claim text (preview).

The invention claimed is: 1. A lead component mounting machine comprising: a component insertion device which holds two lead wires which are included in a lead component, and inserts the two lead wires into two corresponding through-holes which are formed in a circuit board from a first side of the circuit board; and a cut-and-clinch device which cuts and bends protruding portions, which are portions protruding from a second side of the circuit board, of the two lead wires which are inserted into the two corresponding through-holes, wherein the component insertion device includes a pair of pawl portions which pinch and hold each of the two lead wires from two sides, a moving device which causes the pair of pawl portions to move in a thickness direction of the circuit board, and a swing device which causes the pair of pawl portions to swing, wherein the pair of pawl portions includes base end sections which extend in the thickness direction of the circuit board, and holding sections which extend out from the base end sections in a substantially horizontal direction, wherein the lead component includes a single component main body which is provided integrally with two lead wires, wherein the swing device includes a driving member which extends in the horizontal direction and is provided in a fixed manner on a rod which is an output member of a driving source of the swing device, a pair of first members which are joined to end portions of the driving member to be relatively swingable, and a pair of second members, first ends of the second members being joined to the first members to be swingable, the pair of pawl portions being fixed integrally to second ends of the second members, and a middle portion of the second members being swingably joined to a swing shaft, wherein movement of the driving member of the swing device along the thickness direction of the circuit board causes the second members of the swing device to swing around the swing shaft and causes the pair of pawl portions to approach or separate relative to each other, wherein the moving device lowers the pair of pawl portions until bottom surfaces of the holding sections come into contact with an upper surface of the circuit board, then the swing device renders a swing angle of the pair of pawl portions larger to cause the lead component to move downward until a bottom surface of the component main body comes into contact with upper surfaces of the holding sections, then the swing device reduces the swing angle of the pair of pawl portions, and wherein the cut-and-clinch device cuts and bends the protruding portions of the two lead wires from the second side of the circuit board in a state in which the two lead wires are held by the pair of pawl portions. 2. The lead component mounting machine according to claim 1 , wherein the cut-and-clinch device cuts and bends the protruding portions of the two lead wires in a state in which each of the two lead wires is pinched and held by the pair of pawl portions at a portion between a surface of the first side of the circuit board and the single component main body. 3. The lead component mounting machine according to claim 1 , wherein the component insertion device includes a pawl portion movement control section which causes the pair of pawl portions to come into contact with a surface of the first side of the circuit board in a state in which the two lead wires are inserted into the two through-holes. 4. The lead component mounting machine according to claim 1 , wherein the component insertion device includes a pushing-in device which pushes in the single component main body toward the circuit board in a state in which the two lead wires are inserted into the two corresponding through-holes. 5. The lead component mounting machine according to claim 4 , wherein the component insertion device includes a pushing-in device control section which causes the pushing-in device to push in the single component main body until the single component main body comes into contact with the pair of pawl portions in a state in which the two lead wires are inserted into the corresponding two through-holes, and a holding strength of each of the two lead wires by the pair of pawl portions is lower than a set strength. 6. A lead component mounting machine comprising: a component insertion device which holds two lead wires which are included in a lead component, and inserts the two lead wires into two corresponding through-holes which are formed in a circuit board from a first side of the circuit board; and a cut-and-clinch device which cuts and bends protruding portions, which are portions protruding from a second side of the circuit board, of the two lead wires which are inserted into the two corresponding through-holes, wherein the component insertion device includes a pair of pawl portions which hold the two lead wires at portions separated from the single component main body, a moving device which causes the pair of pawl portions to move in a thickness direction of the circuit board, and a swing device which causes the pair of pawl portions to swing, wherein the pair of pawl portions includes base end sections which extend in the thickness direction of the circuit board, and holding sections which extend out from the base end sections in a substantially horizontal direction, wherein the swing device includes a driving member which extends in the horizontal direction and is provided in a fixed manner on a rod which is an output member of a driving source of the swing device, a pair of first members which are joined to end portions of the driving member to be relatively swingable, and a pair of second members, first ends of the second members being joined to the first members to be swingable, the pair of pawl portions being fixed integrally to second ends of the second members, and a middle portion of the second members being swingably joined to a swing shaft, wherein movement of the driving member of the swing device along the thickness direction of the circuit board causes the second members of the swing device to swing around the swing shaft and causes the pair of pawl portions to approach or separate relative to each other, wherein the moving device lowers the pair of pawl portions until bottom surfaces of the holding sections come into contact with an upper surface of the circuit board, then the swing device renders a swing angle of the pair of pawl portions larger to cause the lead component to move downward until a bottom surface of the component main body comes into contact with upper surfaces of the holding sections, then the swing device reduces the swing angle of the pair of pawl portions, and wherein the cut-and-clinch device cuts and bends the protruding portions of the two lead wires from the second side of the circuit board in a state in which the two lead wires are held by the pair of pawl portions. 7. The lead component mounting machine according to claim 1 , wherein a recessed section is provided in a mutually-facing side of each of the holding sections. 8. The lead component mounting machine according to claim 6 , wherein a recessed section is provided in a mutually-facing side of each of the holding sections. 9. The lead component mounting machine according to claim 1 , wherein the cut-and-clinch device includes: a unit main body, a pair of first movable sections which are held by the unit main body to be capable of moving linearly in the horizontal direction, a pair of second movable sections which are respectively held by the first movable sections to be capable of relative movement in the horizontal direction, a pitch changing device which is provided on the unit main body and changes a pi

Assignees

Inventors

Classifications

  • H05K3/306Primary

    with lead-in-hole components (H05K3/32 takes precedence) · CPC title

  • Incorporating a pick-up tool · CPC title

  • Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board · CPC title

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Frequently asked questions

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What does patent US10617013B2 cover?
A lead component mounting machine is provided in which lead wires are pinched and held from both sides by a pair of pawl portions, and the lead wires are inserted into through-holes of a board. The holding by the pawl portions is loosened, and a component main body is pushed in by a pushing-in device until the component main body comes into contact with the pawl portions. Subsequently, the stre…
Who is the assignee on this patent?
Fuji Corp
What technology area does this patent fall under?
Primary CPC classification H05K3/306. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 07 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).