Compression bonding apparatus

Patent metadata

Field	Value
Publication number	US-11469343-B2
Application number	US-201916768492-A
Country	US
Kind code	B2
Filing date	Jan 3, 2019
Priority date	Feb 14, 2018
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

A compression bonding apparatus is disclosed. The compression bonding apparatus comprises: a stage configured to support a substrate on which a plurality of light emitting elements are arranged on an adhesive layer having a predetermined viscosity; a support member disposed on the stage and surrounding at least a part of a side surface of the substrate; and a pressing member configured to press the plurality of light emitting elements, wherein the support member is configured to have a height equal to or greater than the height of the substrate.

First claim

The invention claimed is:

1. A compression bonding apparatus, comprising:
a stage configured to support a substrate on which a plurality of light emitting devices are arranged on an adhesive layer having a predetermined viscosity;
a support member disposed on the stage and surrounding at least a part of a side surface of the substrate; and
a pressing member configured to press the plurality of light emitting devices,
wherein the support member has a height equal to or greater than a height of the substrate,
wherein the plurality of light emitting devices is configured to be fixed to the substrate as the adhesive layer is cured,
wherein the adhesive layer is made of a thermosetting material, and
wherein the pressing member is further configured to heat the adhesive layer while pressing the plurality of light emitting devices.

2. The compression bonding apparatus as claimed in claim 1 , wherein the pressing member is further configured to descend from upper sides of the plurality of light emitting devices to press the plurality of light emitting devices so that the plurality of light emitting devices come into contact with the substrate.

3. The compression bonding apparatus as claimed in claim 1 , wherein the height of the support member is equal to a sum of the height of the substrate and a height of the plurality of light emitting devices.

4. The compression bonding apparatus as claimed in claim 1 , wherein the height of the support member is set to be smaller than a sum of the height of the substrate, a height of the adhesive layer, and a height of the plurality of light emitting devices.

5. The compression bonding apparatus as claimed in claim 4 , wherein the height of the support member is set to be equal to or greater than a sum of the height of the substrate and the height of the plurality of light emitting devices.

6. The compression bonding apparatus as claimed in claim 5 , wherein a height of a part of the support member is set to be different from heights of other parts thereof.

7. The compression bonding apparatus as claimed in claim 1 , wherein the support member surrounds an entire side surface portion of the substrate along a circumference of the substrate.

8. The compression bonding apparatus as claimed in claim 7 , wherein the substrate has a rectangular shape,
the side surface portion of the substrate includes a first side surface, a second side surface, a third side surface, and a fourth side surface, and
the support member includes a first support member, a second support member, a third support member, and a fourth support member surrounding the first side surface, the second side surface, the third side surface, and the fourth side surface.

9. The compression bonding apparatus as claimed in claim 8 , wherein a height of at least one of the first support member, the second support member, the third support member, and the fourth support member is set differently.

10. The compression bonding apparatus as claimed in claim 1 , wherein an upper surface of the support member and an upper surface of each of the plurality of light emitting devices are arranged in parallel with a pressing surface of the pressing member.

11. The compression bonding apparatus as claimed in claim 1 , wherein at least a part of an upper surface of the support member faces a pressed surface of the pressing member.

12. The compression bonding apparatus as claimed in claim 1 , wherein thermal conductivity of the support member is equal to that of the substrate.

13. The compression bonding apparatus as claimed in claim 1 , wherein the adhesive layer consists of a non-conductive paste.

14. The compression bonding apparatus as claimed in claim 1 , wherein the adhesive layer consists of an anisotropic conductive paste.

15. A method of using a compression bonding apparatus to manufacture a light source module, the method comprising:
forming an adhesive layer having a predetermined viscosity on an upper surface of a substrate;
arranging a plurality of light emitting devices on the adhesive layer;
arranging the substrate on which the plurality of light emitting devices on a stage;
arranging a support member surrounding at least a part of a side surface of the substrate, wherein a height of the support member equal to or greater than a height of the substrate on the stage, and a height of a part of the support member is different from heights of other parts thereof;
pressing the plurality of light emitting devices by a pressing member descending from upper sides of the plurality of light emitting devices; and
curing the adhesive layer so that the plurality of light emitting devices is fixed to the substrate,
wherein the adhesive layer is made of a thermosetting material, and
wherein the pressing member is further configured to heat the adhesive layer while pressing the plurality of light emitting devices.

16. A method of using a compression bonding apparatus to manufacture a light source module, the method comprising:
measuring a pressure distribution applied by a pressing member to a stage by pressing a pressure sensing sheet arranged on the stage by a-the pressing member;
arranging a substrate on which a plurality of light emitting devices are arranged on an adhesive layer having a predetermined viscosity on the stage;
arranging a support member surrounding at least a part of a side surface of the substrate, wherein a height of the support member equal to or greater than a height of the substrate on the stage, and a height of a part of the support member is different from heights of other parts thereof;
pressing the plurality of light emitting devices by the pressing member descending from upper sides of the plurality of light emitting devices; and
curing the adhesive layer so that the plurality of the light emitting devices is fixed to the substrate,
wherein the support member is configured so that a height of a part corresponding to a part where the pressure distribution is measured relatively higher is greater than heights of other parts corresponding to a part where the pressure distribution is measured relatively lower,
wherein the adhesive layer is made of a thermosetting material, and
wherein the pressing member is further configured to heat the adhesive layer while pressing the plurality of light emitting devices.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Yoonsuk
• Kwag Doyoung
• Park Sangmoo

Classifications

• H10P72/70

  for supporting or gripping · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• G02F1/1335

  Structural association of cells with optical devices, e.g. polarisers or reflectors · CPC title