Method for assembling two substrates of different natures via a ductile intermediate layer
US-2016126215-A1 · May 5, 2016 · US
US9956643B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9956643-B2 |
| Application number | US-201515122925-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 31, 2015 |
| Priority date | Mar 31, 2015 |
| Publication date | May 1, 2018 |
| Grant date | May 1, 2018 |
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Provided is a pressure applying unit used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by heating the assembled body while applying pressure to the assembled body using a pair of heating parts. The pressure applying unit includes: a pair of transferring members which transfers pressure and heat to the assembled body by sandwiching the assembled body therebetween; guide members which movably connect the pair of transferring members to each other; and a distance adjusting mechanism being configured to make the second transferring member separated from the assembled body during a pressure non-applying time and brings both the first transferring member and the second transferring member into contact with the assembled body during a pressure applying time.
Opening claim text (preview).
The invention claimed is: 1. A pressure applying unit used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by heating the assembled body while applying pressure to the assembled body using a pair of heating parts, wherein a time during which pressure is not applied to the pressure applying unit is defined as a pressure non-applying time and a time during which predetermined pressure is applied to the pressure applying unit is defined as a pressure applying time, the pressure applying unit comprises: a pair of transferring members which is constituted of a plate-like first transferring member being in contact with the substrate at least during the pressure applying time and a plate-like second transferring member being in contact with the electronic part at least during the pressure applying time and transfers pressure and heat to the assembled body by sandwiching the assembled body therebetween in sintering the metal particle paste; a guide member which connects the pair of transferring members to each other, and allows the movement of at least one transferring member out of the first transferring member and the second transferring member while keeping parallelism of one transferring member with the other transferring member; and a distance adjusting mechanism for adjusting a distance between the first transferring member and the second transferring member, the distance adjusting mechanism being configured to, in a state where the assembled body is arranged between the pair of transferring members, make the first transferring member or the second transferring member separated from the assembled body during the pressure non-applying time and brings both the first transferring member and the second transferring member into contact with the assembled body during the pressure applying time, wherein the distance adjusting mechanism includes a resilient member which extends during the pressure non-applying time, and shrinks during the pressure applying time. 2. The pressure applying unit according to claim 1 , wherein the resilient member is formed of a coil spring, and is arranged using the guide member as a shaft. 3. The pressure applying unit according to claim 1 , wherein one end portion of the guide member is fixed to the first transferring member, a guide member receiving hole which conforms to the guide member is formed in the second transferring member, and the second transferring member is movable along the guide member inserted into the guide member receiving hole. 4. The pressure applying unit according to claim 3 , wherein the other end portion of the guide member disposed on a side opposite to said one end portion of the guide member is disposed in the guide member receiving hole during the pressure applying time. 5. The pressure applying unit according to claim 3 , wherein the other end portion of the guide member disposed on a side opposite to said one end portion of the guide member is configured to project from the guide member receiving hole toward a side of the second transferring member on a side opposite to the first transferring member during the pressure applying time, and the second transferring member further includes a spacer having a thickness larger than a length by which the guide member projects from the guide member receiving hole on a side of the second transferring member where the guide member projects. 6. A pressure applying unit used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by heating the assembled body while applying pressure to the assembled body using a pair of heating parts, wherein a time during which pressure is not applied to the pressure applying unit is defined as a pressure non-applying time and a time during which predetermined pressure is applied to the pressure applying unit is defined as a pressure applying time, the pressure applying unit comprises: a pair of transferring members which is constituted of a plate-like first transferring member being in contact with the substrate at least during the pressure applying time and a plate-like second transferring member being in contact with the electronic part at least during the pressure applying time and transfers pressure and heat to the assembled body by sandwiching the assembled body therebetween in sintering the metal particle paste; a guide member which connects the pair of transferring members to each other, and allows the movement of at least one transferring member out of the first transferring member and the second transferring member while keeping parallelism of one transferring member with the other transferring member; and a distance adjusting mechanism for adjusting a distance between the first transferring member and the second transferring member, the distance adjusting mechanism being configured to, in a state where the assembled body is arranged between the pair of transferring members, make the first transferring member or the second transferring member separated from the assembled body during the pressure non-applying time and brings both the first transferring member and the second transferring member into contact with the assembled body during the pressure applying time, wherein the pressure applying unit includes four or more guide members, and when the guide members are viewed in a direction perpendicular to a surface of the first transferring member on which the substrate is arranged, the guide members are arranged at least at apexes of a predetermined quadrangular shape surrounding a place where the assembled body is to be arranged.
Means for applying energy, e.g. ovens or lasers · CPC title
Means for aligning · CPC title
Connecting or disconnecting · CPC title
Connecting techniques · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
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