Heat dissipation structure for magnetic component and magnetic component having the same

Patent metadata

Field	Value
Publication number	US-11469035-B2
Application number	US-201916239673-A
Country	US
Kind code	B2
Filing date	Jan 4, 2019
Priority date	Feb 5, 2018
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

The present disclosure provides a heat dissipation structure for a magnetic component and a magnetic component having the same. The magnetic component includes a plurality of heat dissipation pins, which are disposed on the winding of the magnetic component, wherein the magnetic component has one or more windings. The heat dissipation structure includes a circuit board on which a plurality of heat dissipation channels are disposed, and the heat dissipation pins of the windings are in contact with the heat dissipation channels; a plurality of heat conduction portions are disposed correspondingly under the heat dissipation channels of the circuit board; a heat conduction layer is arranged under the heat conduction portions and contacts with the heat conduction portions; and a heat dissipation layer is arranged under the heat conduction layer and contacts with the heat conduction layer.

First claim

What is claimed is:

1. A heat dissipation structure for a magnetic component, comprising:
heat dissipation pins, disposed on a winding of the magnetic component, wherein the winding is split into at least two strands, and two ends of each of the strands form the heat dissipation pins;
a circuit board, provided with a plurality of heat dissipation channels, wherein the heat dissipation pins are in contact with the corresponding heat dissipation channels;
a plurality of heat conduction portions, disposed correspondingly under the heat dissipation channels and being in contact with a portion of the circuit board;
a heat conduction layer, which is arranged under the heat conduction portions and contacts with the heat conduction portions; and
a heat dissipation layer, which is arranged under the heat conduction layer and contacts with the heat conduction layer.

2. The heat dissipation structure according to claim 1 , wherein the winding is divided into at least two segments, and two ends of each of the segments form the heat dissipation pins.

3. The heat dissipation structure according to claim 1 , wherein at least one of the plurality of heat dissipation channels is formed by a via hole in the circuit board, and the heat dissipation pin is soldered in the via hole of the circuit board.

4. The heat dissipation structure according to claim 1 , wherein at least one of the plurality of heat dissipation channels is formed by a solder pad on the circuit board, and the heat dissipation pin is soldered on the solder pad.

5. The heat dissipation structure according to claim 1 , wherein some of the plurality of heat dissipation channels are formed by via holes on the circuit board, and others are formed by solder pads in the circuit board.

6. The heat dissipation structure according to claim 5 , wherein some of the heat dissipation pins are correspondingly disposed in the via holes of the circuit board, and others are correspondingly soldered on the solder pads of the circuit board.

7. The heat dissipation structure according to claim 1 , wherein the heat conduction portions are metal sheet.

8. The heat dissipation structure according to claim 7 , wherein the metal sheet is a copper sheet.

9. The heat dissipation structure according to claim 1 , wherein the heat conduction layer is selected from one or more of thermal adhesive, heat-conducting silicone grease, a ceramic sheet and a thermal pad.

10. The heat dissipation structure according to claim 1 , wherein the heat dissipation layer is a heat dissipation fin or a heat dissipation plate.

11. The heat dissipation structure according to claim 1 , wherein the heat dissipation layer is a water cooling plate.

12. The heat dissipation structure according to claim 1 , wherein the magnetic component is a single transformer, a single inductor, or an integrated magnetic component having a transformer and an inductor.

13. The heat dissipation structure according to claim 1 , wherein the magnetic component comprises a magnetic core, and the winding is wounded on the magnetic core.

Assignees

• Delta Electronics Shanghai Co

Inventors

• Yan Chao
• Wang Zejun
• Lu Yiwen
• Li Zhihua

Classifications

• H01F27/22

  Cooling by heat conduction through solid or powdered fillings · CPC title

• H01F27/16

  Water cooling · CPC title

• H01F2027/297

  with pin-like terminal to be inserted in hole of printed path · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K1/0206

  by printed thermal vias · CPC title