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US-2017310149-A1 · Oct 26, 2017 · US
Cooling by heat conduction through solid or powdered fillings · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01F27/22 |
| Official title | Cooling by heat conduction through solid or powdered fillings |
| Display label | Cooling by heat conduction through solid or powdered fillings |
| Total patents | 639 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 25 |
| 2016 | 29 |
| 2017 | 40 |
| 2018 | 56 |
| 2019 | 58 |
| 2020 | 78 |
| 2021 | 64 |
| 2022 | 69 |
| 2023 | 81 |
| 2024 | 64 |
| 2025 | 59 |
| 2026 | 16 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2017310149-A1 · Oct 26, 2017 · US
US-9785812-B2 · Oct 10, 2017 · US
US-9679694-B2 · Jun 13, 2017 · US
US-2017076862-A1 · Mar 16, 2017 · US
US-9552918-B2 · Jan 24, 2017 · US
US-2017004921-A1 · Jan 5, 2017 · US
US-2016372249-A1 · Dec 22, 2016 · US
US-2016372250-A1 · Dec 22, 2016 · US
US-9521781-B2 · Dec 13, 2016 · US
US-2016347188-A1 · Dec 1, 2016 · US
US-9496085-B2 · Nov 15, 2016 · US
US-9490059-B2 · Nov 8, 2016 · US
US-9490058-B1 · Nov 8, 2016 · US
US-2016307684-A1 · Oct 20, 2016 · US
US-9466415-B2 · Oct 11, 2016 · US
US-2016260538-A1 · Sep 8, 2016 · US
US-2016254086-A1 · Sep 1, 2016 · US
US-2016254085-A1 · Sep 1, 2016 · US
US-9431166-B2 · Aug 30, 2016 · US
US-2016248278-A1 · Aug 25, 2016 · US
Answers are generated from the same data shown on this page.