Cooling by heat conduction through solid or powdered fillings

Cooling by heat conduction through solid or powdered fillings · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01F27/22
Official titleCooling by heat conduction through solid or powdered fillings
Display labelCooling by heat conduction through solid or powdered fillings
Total patents639

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is stable.

Patents filed per year
YearPatents
201525
201629
201740
201856
201958
202078
202164
202269
202381
202464
202559
202616

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01F27/22?
CPC H01F27/22 is the Cooperative Patent Classification code for “Cooling by heat conduction through solid or powdered fillings.”
How many patents are filed under CPC H01F27/22 (Cooling by heat conduction through solid or powdered fillings)?
Our database includes 639 publications tagged with this CPC code.
Is patent activity under CPC H01F27/22 growing?
Publication counts under this code: 64 in 2024 vs 59 in 2025 (latest complete years).