Reactor, Converter and Power Conversion Device
US-2015365015-A1 · Dec 17, 2015 · US
Apparatus for dissipating heat of inductor
US2016125997A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016125997-A1 |
| Application number | US-201514924796-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 28, 2015 |
| Priority date | Oct 31, 2014 |
| Publication date | May 5, 2016 |
| Grant date | — |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Provided is an apparatus for effectively dissipating heat generated by an inductor of a DC-DC converter, and allowing for reducing a size and a weight of the DC-DC converter to thereby reduce manufacturing cost. The apparatus for dissipating heat of an inductor includes an inductor configured to protrude to outside; and a heat sink configured to be installed outside of the inductor and to receive the inductor.
First claim
Opening claim text (preview).
What is claimed is: 1 . An apparatus for dissipating heat of an inductor, the apparatus comprising: an inductor configured to protrude to an outside; and a heat sink configured to be installed outside of the inductor and to receive the inductor. 2 . The apparatus of claim 1 , further comprising: a printed circuit board (PCB) on which the inductor is mounted; and a housing configured to hermetically seal an internal component mounted on the PCB. 3 . The apparatus of claim 2 , wherein the internal component is mounted on a first surface of the PCB and the inductor is mounted on a second surface opposing the first surface of PCB. 4 . The apparatus of claim 1 , wherein the heat sink includes a receiving unit for receiving the inductor. 5 . The apparatus of claim 4 , wherein an edge of an entrance of the receiving unit is rounded with a predetermined curvature. 6 . The apparatus of claim 4 , wherein the edge of the entrance of the receiving unit is chamfered with a predetermined with and a predetermined slope. 7 . The apparatus of claim 4 , wherein a thermal grease is applied to the interior of the receiving unit. 8 . The apparatus of claim 7 , wherein the thermal grease is at least one of a ceramic-based thermal grease, a metal-based thermal grease, a carbon-based thermal grease, a fusible metal-based thermal grease. 9 . The apparatus of claim 4 , wherein a solder cream is applied between the receiving unit and the inductor. 10 . The apparatus of claim 4 , wherein the inductor is in contact with an inner surface of the receiving unit.
Assignees
Inventors
Classifications
- H01F27/22Primary
Cooling by heat conduction through solid or powdered fillings · CPC title
Printed windings · CPC title
Fixed inductances not covered by group H01F17/00 · CPC title
Mounting on printed circuit boards · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2016125997A1 cover?
- Provided is an apparatus for effectively dissipating heat generated by an inductor of a DC-DC converter, and allowing for reducing a size and a weight of the DC-DC converter to thereby reduce manufacturing cost. The apparatus for dissipating heat of an inductor includes an inductor configured to protrude to outside; and a heat sink configured to be installed outside of the inductor and to recei…
- Who is the assignee on this patent?
- Hyundai Mobis Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01F27/22. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu May 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).