Heat amount measuring method and heat amount measuring apparatus

Patent metadata

Field	Value
Publication number	US-11467040-B2
Application number	US-201916534176-A
Country	US
Kind code	B2
Filing date	Aug 7, 2019
Priority date	Aug 8, 2018
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

A heat amount measuring method includes a first step of providing a heat-transferring component that transfers and receives heat to and from a heating component and measuring, while the heating component is generating heat, a first heat amount of heat transmitted from the heating component to the heat-transferring component, a first heating component temperature, and a first substrate temperature, a second step of changing an output of the heat-transferring component and measuring a second heat amount of heat transmitted from the heating component to the heat-transferring component, a second heating component temperature, and a second substrate temperature, and a third step of calculating a heat amount of heat transmitted from the heating component to a substrate by using the first heat amount, the first heating component temperature, the first substrate temperature, the second heat amount, the second heating component temperature, and the second substrate temperature.

First claim

What is claimed is:

1. An amount measuring method of measuring a heat amount of a heating component mounted on a substrate, the method comprising:
a first step of providing a heat-transferring component including a Peltier element that transfers and receives heat to and from the heating component and measuring, while current flows to the heating component and the heating component generates heat, a first heat amount of heat transmitted from the heating component to the heat-transferring component, a first heating component temperature of the heating component, and a first substrate temperature of the substrate;
a second step of changing an output of the heat-transferring component and measuring, while current flows to the heating component and the heating component generates heat, a second heat amount of heat transmitted from the heating component to the heat-transferring component, a second heating component temperature of the heating component, and a second substrate temperature of the substrate; and
a third step of calculating a heat amount of heat transmitted from the heating component to the substrate by using the first heat amount, the first heating component temperature, the first substrate temperature, the second heat amount, the second heating component temperature, and the second substrate temperature,
wherein the first substrate temperature and the second substrate temperature are measured in the first step and the second step at a measurement point on the substrate that is a distance apart from the heating component.

2. The heat amount measuring method according to claim 1 , wherein
no heating unit is located between the heating component and a measurement point of the first substrate temperature, and
no heating unit is located between the heating component and a measurement point of the second substrate temperature.

3. The heat amount measuring method according to claim 1 , in the first step or the second step, further includes measuring a third heat amount as at least part of a heat amount of heat transmitted from a surface of the heating component which faces neither the substrate nor the heat-transferring component.

4. The heat amount measuring method according to claim 3 , further comprising:
a step of calculating a heat amount of the heating component by using a heat amount of heat transmitted from the heating component to the substrate and at least one of the first heat amount, the second heat amount, and the third heat amount.

5. The heat amount measuring method according to claim 1 , wherein the heat-transferring component is a heating device and a heat absorbing device.

6. The heat amount measuring method according to claim 1 , wherein the first substrate temperature and the second substrate temperature each are measured at a plurality of measurement points.

7. The heat amount measuring method according to claim 1 , wherein a temperature of a thin plate in contact with the heating component is regarded as the first heating component temperature or the second heating component temperature.

8. The heat amount measuring method according to claim 1 , wherein the first heating component temperature, the second heating component temperature, the first substrate temperature, and the second substrate temperature are measured by a thermocouple thermometer.

9. The heat amount measuring method according to claim 1 , wherein
the first heating component temperature and the second heating component temperature are measured by a thermocouple thermometer, and
the first substrate temperature and the second substrate temperature are measured by a non-contact thermometer.

10. A heat amount measuring apparatus for measuring a heat amount of a heating component mounted on a substrate, the apparatus comprising:
a controller;
a computing unit; and
a heat-transferring component including a Peltier element that transfers and receives heat to and from the heating component,
wherein
the controller
measures a first heat amount of heat transmitted from the heating component to the heat-transferring component, a first heating component temperature of the heating component, and a first substrate temperature of the substrate, while current flows to the heating component and the heating component generates heat, and
measures a second heat amount of heat transmitted from the heating component to the heat-transferring component, a second heating component temperature of the heating component, and a second substrate temperature of the substrate, while current flows to the heating component and the heating component generates heat after the controller changes an output of the heat-transferring component, and

the computing unit calculates a heat amount of heat transmitted from the heating component to the substrate by using the first heat amount, the first heating component temperature, the first substrate temperature, the second heat amount, the second heating component temperature, and the second substrate temperature,
wherein the controller measures the first substrate temperature and the second substrate temperatures at a measurement point on the substrate that is a distance apart from the heating component.

11. The heat amount measuring apparatus according to claim 10 , wherein no heating unit is located between the heating component and a measurement point of the first substrate temperature, and no heating unit is located between the heating component and a measurement point of the second substrate temperature.

12. The heat amount measuring apparatus according to claim 10 , wherein the controller further measures a third heat amount as at least part of a heat amount of heat transmitted from a surface of the heating component which faces neither the substrate nor the heat-transferring component, while the heating component is generating heat.

13. The heat amount measuring apparatus according to claim 12 , wherein a heat amount of the heating component is calculated by using a heat amount of heat transmitted from the heating component to the substrate and at least one of the first heat amount, the second heat amount, and the third heat amount.

14. The heat amount measuring apparatus according to claim 10 , wherein the heat-transferring component is a heating device and a heat absorbing device.

15. The heat amount measuring apparatus according to claim 10 , wherein the controller measures each of the first substrate temperature and the second substrate temperature at a plurality of measurement points.

16. The heat amount measuring apparatus according to claim 10 , further comprising:
a thin plate in contact with the heating component,
the controller measures a temperature of the thin plate as the first heating component temperature or the second heating component temperature.

17. The heat amount measuring apparatus according to claim 10 , further comprising a thermocouple thermometer,
wherein the controller measures the first heating component temperature, the second heating component temperature, the first substrate temperature, and the second substrate temperature with a thermocouple thermometer.

18. The heat amount measuring apparatus according to claim 10 , further comprising a thermocouple thermometer and a non-contact thermometer,
wherein the controller measures the first heating component temperature and the second heating component temperature with a thermocouple thermometer, and measures the first substrate temperature and the second substrate temperature with a non-contact thermometer.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Kitade Naoya
• Iyoda Makoto

Classifications

• G01K17/06

  Measuring quantity of heat conveyed by flowing media, e.g. in heating systems (G01K17/02, G01K17/04 take precedence){e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device} · CPC title

• G01K7/021 Primary

  Particular circuit arrangements (G01K7/026, G01K7/12, G01K7/14 take precedence) · CPC title

• G01K17/00 Primary

  Measuring quantity of heat (measuring temperature by calorimetry G01K3/00 - G01K11/00; specially adapted for measuring thermal properties of materials, e.g. specific heat, heat of combustion G01N) · CPC title