Temperature measuring board device and temperature measuring board thereof

Patent metadata

Field	Value
Publication number	US-9810582-B2
Application number	US-201414509565-A
Country	US
Kind code	B2
Filing date	Oct 8, 2014
Priority date	May 6, 2014
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.

First claim

What is claimed is:

1. A temperature measuring board for use in measuring an oven temperature of a reflow oven, said temperature measuring board comprising:
a modular substrate including a plurality of substrates assembled to each other, each of said substrates having at least one first fixing portion, and at least one second fixing portion removably fixed to said first fixing portion of another one of said substrates, wherein a selected number of said substrates can be assembled to each other to form a desired shape of said modular substrate through engagement of said first and second fixing portions; and
a thermal compensation unit including at least one surface-measured compensation member fixed to said modular substrate at a selected location.

2. The temperature measuring board as claimed in claim 1 , wherein said first fixing portion is an engaging groove extending inwardly from a lateral side of a corresponding one of said substrates, and said second fixing portion is an engaging rib protruding from another lateral side of the corresponding said substrate and releasably engaging said engaging groove in an adjacent one of said substrates.

3. The temperature measuring board as claimed in claim 1 , wherein said modular substrate has a thermal decomposition temperature greater than 320° C., a glass transition temperature greater than 170° C., and a thermal expansion coefficient smaller than 0.0002 m/° C.

4. The temperature measuring board as claimed in claim 1 , wherein the material of said modular substrate is one of FR-4 epoxy glass fiber and Stononlead.

5. The temperature measuring board as claimed in claim 1 , wherein each of said substrates is plate-shaped, said first and second fixing portions being formed on two lateral sides of a corresponding one of said substrates.

6. The temperature measuring board as claimed in claim 5 , wherein each of said substrates has a groove extending inwardly from a bottom side thereof for receiving a portion of said thermal compensation unit.

7. The temperature measuring board as claimed in claim 6 , wherein each of said substrates further includes at least one wire organizing notch that communicates said groove with an ambient environment and that is registered with said wire organizing notch of an adjacent one of said substrates.

8. The temperature measuring board as claimed in claim 1 , wherein said thermal compensation unit further includes at least one stacked-layered compensation member removably fixed to said modular substrate at the selected location, said temperature measuring board further comprising at least one retaining mechanism for removably retaining said stacked-layered compensation member to said modular substrate.

9. The temperature measuring board as claimed in claim 8 , wherein said retaining mechanism includes at least one threaded rod extending through said modular substrate, and a screw hole formed in said stacked-layered compensation member for threaded engagement with said threaded rod.

10. The temperature measuring board as claimed in claim 8 , wherein said retaining mechanism includes at least one first magnet disposed on said modular substrate, and a second magnet disposed on said stacked-layered compensation member and magnetically attracted to said first magnet.

11. The temperature measuring board as claimed in claim 8 , wherein said stacked-layered compensation member is a metal piece fitted to said modular substrate.

12. A temperature measuring board device for use in measuring an oven temperature of a reflow oven, said temperature measuring board device comprising:
a temperature measuring board including a modular substrate and a thermal compensation unit, said modular substrate including a plurality of substrates assembled to each other, each of said substrates having a first engaging portion, said thermal compensation unit including at least one surface-measured compensation member fixed to said modular substrate at a selected location; and
a fixture supporting and fixing said temperature measuring board, and including a main body and a plurality of second engaging portions disposed on said main body;
wherein said first engaging portion of each of said substrates is removably engaged to a corresponding one of said second engaging portions, and wherein a selected number of said substrates can be assembled to said fixture to form a desired shape of said modular substrate.

13. The temperature measuring board device as claimed in claim 12 , wherein each of said substrates further has at least one first fixing portion, and at least one second fixing portion removably fixed to said first fixing portion of another one of said substrates.

14. The temperature measuring board device as claimed in claim 12 , wherein said fixture is formed with a plurality of through holes extending through said main body.

15. The temperature measuring board device as claimed in claim 12 , wherein said modular substrate has a thermal decomposition temperature greater than 320° C., a glass transition temperature greater than 170° C., and a thermal expansion coefficient smaller than 0.0002 m/° C.

16. The temperature measuring board device as claimed in claim 12 , wherein the material of said modular substrate is one of FR-4 epoxy glass fiber and Stononlead.

17. The temperature measuring board device as claimed in claim 12 , wherein each of said substrates is plate-shaped, said first engaging portion being a groove extending inwardly from a side of a respective one of said substrates that is adjacent to said fixture, each of said second engaging portions being an abutment stud that projects from said main body and that is engaged to said groove of a corresponding said substrate.

18. The temperature measuring board device as claimed in claim 17 , wherein said groove receives a portion of said thermal compensation unit, each of said substrates further having at least one wire organizing notch that communicates said groove with an ambient environment and that is registered with said wire organizing notch of an adjacent one of said substrates.

19. The temperature measuring board device as claimed in claim 12 , wherein said thermal compensation unit further includes at least one stacked-layered compensation member removably fixed to said modular substrate at the selected location, said temperature measuring board further including a retaining mechanism for removably fixing said stacked-layered compensation member to said modular substrate.

20. The temperature measuring board device as claimed in claim 19 , wherein said retaining mechanism includes at least one threaded rod extending through said modular substrate, and a screw hole formed in said stacked-layered compensation member for threaded engagement with said threaded rod.

21. The temperature measuring board device as claimed in claim 19 , wherein said retaining mechanism includes at least one first magnet disposed on said modular substrate, and a second magnet disposed on said stacked-layered compensation member and magnetically attracted to said first magnet.

22. The temperature measuring board device as claimed in claim 19 , wherein said stacked-layered compensation member is a metal piece fitted to said modular substrate.

Assignees

• Wistron Corp

Inventors

• Hsieh Hao-Chun
• Tsai Hsin-Lun
• Wu Kaun-Chang

Classifications

• G01K7/02

  using thermoelectric elements, e.g. thermocouples · CPC title

• G01K7/021

  Particular circuit arrangements (G01K7/026, G01K7/12, G01K7/14 take precedence) · CPC title

• G01K1/14 Primary

  Supports; Fastening devices; Arrangements for mounting thermometers in particular locations · CPC title

• G01K1/20

  Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature · CPC title

• G01K13/00

  Thermometers specially adapted for specific purposes · CPC title