Film peeling device and method of peeling film

Patent metadata

Field	Value
Publication number	US-11465333-B2
Application number	US-202117360628-A
Country	US
Kind code	B2
Filing date	Jun 28, 2021
Priority date	Nov 5, 2020
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

A film peeling device includes a chamber, a lower stage disposed on a first wall of the chamber, first to fourth grippers capable of peeling first to fourth sides of a film by gripping the first to fourth sides of the film attached to an object disposed on the lower stage and an upper stage disposed on a second wall of the chamber facing the first wall of the chamber and capable of extending in a first direction in which the object is disposed.

First claim

What is claimed is:

1. A method of peeling film comprising:
arranging an object on a lower stage disposed on a first wall of a chamber positioned in a first direction of the chamber;
gripping first to fourth sides of a film attached to the object by using first to fourth grippers disposed inside the chamber; and
peeling the first to fourth sides of the film attached to the object by moving the first to fourth grippers.

2. The method of claim 1 , wherein
an upper stage is disposed on a second wall of the chamber facing the first wall of the chamber, and
the upper stage includes:
a support part disposed on the second wall of the chamber;
an extension part at least partially disposed inside the support part; and
an adsorption part disposed at an end of the extension part in the first direction.

3. The method of claim 2 , further comprising, after the peeling of the first to fourth sides of the film:
adsorbing the object by moving the extension part of the upper stage in the first direction; and
separating the object from the film by moving the extension part in a second direction opposite to the first direction.

4. The method of claim 3 , wherein the separating of the object includes:
tilting the upper stage to separate only a portion of the film from the object.

5. The method of claim 3 , further comprising, after the separating of the object:
transporting the upper stage and the object together with a transport part disposed between the second wall of the chamber and the upper stage.

6. The method of claim 1 , wherein the peeling of the first to fourth sides of the film includes moving the first to fourth grippers in the first direction to peel the film attached to the object.

7. The method of claim 1 , wherein the peeling of the first to fourth sides of the film includes moving the first to fourth grippers in a direction between the first direction and a direction perpendicular to the first direction to peel the film attached to the object.

8. The method of claim 1 , wherein
a plurality of connection elements are disposed between the first wall of the chamber and the lower stage, and
each of the plurality of connection elements includes:
a support part disposed on the first wall of the chamber; and
an extension part at least partially disposed inside the support part.

9. The method of claim 8 , wherein
an upper stage is disposed on a second will of the chamber facing the first wall of the chamber;
the upper stage includes:
a support part disposed on the second wall of the chamber;
an extension part at least partially disposed inside the support part; and
an adsorption part disposed at an end of the extension part in the first direction, and

the method further comprises, after the peeling of the first to fourth sides of the film:
adsorbing the object by the upper stage by moving the extension part in a second direction; and
separating the film from the object by moving the extension part in the first direction.

10. The method of claim 9 , wherein the separating of the object includes:
tilting the upper stage to separate only a portion of the film from the object.

Assignees

• Samsung Display Co Ltd

Inventors

• Choi Myunggil
• Han Hee Soo

Classifications

• H10P72/7442

  Separation by peeling · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• B32B43/006

  Delaminating · CPC title

• Y10T156/1978

  Delaminating bending means · CPC title