Method for producing aluminum platter

Patent metadata

Field	Value
Publication number	US-11447661-B2
Application number	US-201716958361-A
Country	US
Kind code	B2
Filing date	Dec 27, 2017
Priority date	Dec 27, 2017
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

In one aspect, the present disclosure provides a method for producing an aluminum platter, which can improve the smoothness of the substrate surface before a magnetic layer is formed thereon and can provide a hard disk substrate that can be processed into a medium with a high yield. In another aspect, the present disclosure relates to a method for producing an aluminum platter, including the following steps 1 and 2: step 1: bringing a composition containing a compound (component A) that has at least one structure represented by the following formula (I) and has a molecular weight between 50 and 100,000 inclusive into contact with a substrate surface of a Ni—P plated aluminum alloy substrate; and step 2: forming a magnetic layer on the substrate obtained in the step 1.

First claim

The invention claimed is:

1. A method for producing an aluminum platter, the method comprising the following steps 1 and 2, and conducting the step 1 immediately before the step 2:
step 1: bringing a composition containing a compound (component A) that has at least one structure represented by the following formula (I) and has a molecular weight between 50 and 100,000 inclusive into contact with a substrate surface of a Ni—P plated aluminum alloy substrate; and
step 2: forming a magnetic layer on the substrate obtained in the step 1,

where, in the formula (I), R 1 is at least one selected from an ethylene group, a propylene group, and an isopropylene group, and * represents a bond.

2. The method for producing an aluminum platter according to claim 1 ,
wherein the step 1 is a step of bringing the composition containing the component A into contact with the substrate, rinsing the substrate with an aqueous solvent, and drying the substrate.

3. The method for producing an aluminum platter according to claim 1 ,
wherein the composition containing the component A is an aqueous solution.

4. The method for producing an aluminum platter according to claim 1 ,
wherein the Ni—P plated aluminum alloy substrate has been previously polished and has a diminished smoothness as compared with that immediately after being polished.

5. The method for producing an aluminum platter according to claim 1 ,
wherein the composition containing the component A is a smoothing agent composition for smoothing a surface of the substrate on which a magnetic layer is to be formed.

6. The method for producing an aluminum platter according to claim 1 ,
wherein the component A is at least one selected from a compound represented by the following formula (II) and polyethyleneimine,

where, in the formula (II), R 1 is at least one selected from an ethylene group, a propylene group, and an isopropylene group, and R 2 and R 3 are each independently at least one selected from a hydrogen atom, a methyl group, an ethyl group, a hydroxymethyl group, a hydroxyethyl group, a hydroxypropyl group, an aminoethyl group, an aminopropyl group, and a —(CH 2 ) 2 NH(CH 2 ) 2 NH 2 group.

7. The method for producing an aluminum platter according to claim 1 ,
wherein a pH of the composition containing the component A is between 9 and 14 inclusive.

8. The method for producing an aluminum platter according to claim 1 ,
wherein a pH of the composition containing the component A is between 11.8 and 14 inclusive.

9. The method for producing an aluminum platter according to claim 1 ,
wherein the composition containing the component A further contains a chelating agent (component B).

10. The method for producing an aluminum platter according to claim 1 ,
wherein the composition containing the component A is substantially free of at least one selected from a compound having an aromatic sulfonic acid group, an anionic surfactant, a nonionic surfactant, and an abrasive.

11. The method for producing an aluminum platter according to claim 1 ,
wherein the composition containing the component A further contains a chelating agent (component B), water (component C), and an alkali agent (component D) other than the component A, and
the composition is composed of the component A, the component B, the component C, and the component D.

12. The method for producing an aluminum platter according to claim 1 ,
wherein the substrate in the step 1 has an oxidized substrate surface.

13. The method for producing an aluminum platter according to claim 1 ,
wherein the substrate in the step 1 is a substrate that has been previously polished one hour or more ago.

14. The method for producing an aluminum platter according to claim 1 ,
wherein the step 1 and the step 2 are performed continuously in this order.

Assignees

• Kao Corp

Inventors

• Ando Keisuke

Classifications

• B05D2202/25

  based on Al · CPC title

• C23C14/028

  Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing · CPC title

• C09G1/04 Primary

  Aqueous dispersions (C09G1/02 takes precedence) · CPC title

• G11B5/73919

  Aluminium or titanium elemental or alloy substrates · CPC title

• G11B5/73913 Primary

  Composites or coated substrates · CPC title