Systems for printing solder paste and other viscous materials at high resolution

Patent metadata

Field	Value
Publication number	US-11446750-B2
Application number	US-202016807489-A
Country	US
Kind code	B2
Filing date	Mar 3, 2020
Priority date	Feb 3, 2020
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

First claim

What is claimed is:

1. A system, comprising a first printing unit configured to print individual dots of a material on an intermediate substrate, and a second printing unit configured to receive the intermediate substrate having the dots of material printed thereon and to transfer the dots of material from the intermediate substrate to a final substrate,
wherein the first printing unit includes a coating system configured to create a uniform layer of the material on a donor substrate, and the first printing unit is further configured to transfer the material in the individual dots from the donor substrate onto the intermediate substrate, and
wherein the coating system includes a syringe of the material and an air or mechanical pump arranged to drive the material onto the donor substrate, and the coating system is further configured to transport the donor substrate with the material thereon towards and through a first gap between rollers or knifes to create a uniform layer of the material on the donor substrate, the uniform layer of the material having a thickness that is defined by the first gap.

2. The system of claim 1 , wherein the coating system is enclosed in a controlled environment.

3. The system of claim 1 , wherein the coating system is configured to apply more than one material onto the donor substrate in a plurality of printing procedures.

4. The system of claim 1 , wherein the material comprises an ultra-violet (UV) light curable or heat curable material.

5. The system of claim 1 , wherein at least one of the first printing unit or the second printing unit comprises a laser-based system that includes a high frequency laser configured to jet the dots of material from one substrate to another substrate.

6. The system of claim 1 , wherein at least one of the first printing unit or the second printing unit is a laser assisted deposition/laser dispensing system rotated by 0-90 degrees or 90-180 degrees from a main axis of a gravitational field within which it is located.

7. The system of claim 1 , wherein the first printing unit is configured to maintain a second gap between the donor substrate and the intermediate substrate.

8. The system of claim 1 , further comprising rollers to deliver the dots of material printed on the intermediate substrate at the first printing unit to the second printing unit, wherein the intermediate substrate is a continuous film substrate.

9. The system of claim 1 , further comprising ultra-violet (UV) lights arranged to at least one of (i) cure the dots of material printed on the intermediate substrate during movement of the intermediate substrate from the first printing unit to the second printing unit, or (ii) cure the final substrate after transfer of the dots of material thereto.

10. The system of claim 1 , further comprising at least one imaging system arranged to image at least one of (i) the dots of material printed on the intermediate substrate during movement of the intermediate substrate from the first printing unit to the second printing unit, or (ii) the dots of material after transfer to the final substrate.

11. The system of claim 10 , wherein the at least one imaging system is configured to measure the dots of material printed on the intermediate substrate during movement of the intermediate substrate from the first printing unit to the second printing unit in two or three dimensions and to transfer data gathered by said measuring to the second printing unit for use in transfer of the dots of material onto the final substrate.

12. The system of claim 1 , further comprising a heater arranged to at least one of (i) cure the dots of material printed on the intermediate substrate during movement of the intermediate substrate from the first printing unit to the second printing unit, or (ii) cure the final substrate after transfer of the dots of material thereto.

Assignees

• Io Tech Group Ltd

Inventors

• Zenou Michael
• Gilan Ziv
• Nesher Guy

Classifications

• H05K2203/163

  Monitoring a manufacturing process · CPC title

• H05K2203/107

  Using laser light · CPC title

• H05K2203/0534

  Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member · CPC title

• H05K2203/0528

  Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser · CPC title

• H05K2203/0338

  Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component · CPC title