Edge load ring

US11440159B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11440159-B2
Application numberUS-202017034541-A
CountryUS
Kind codeB2
Filing dateSep 28, 2020
Priority dateSep 28, 2020
Publication dateSep 13, 2022
Grant dateSep 13, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Apparatus and methods relating to chemical mechanical polishing (CMP) are described herein. An edge load ring (ELR) is configured to fit inside a retaining ring of a CMP head. The ELR includes an annular body having an inner surface and an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside a retaining ring. The annular body includes a body portion formed from a first material and a bottom projection extending below the body portion. The bottom projection has a bottom surface facing away from the body portion, and the bottom projection is formed form a second material different from the first material. The annular body includes a venting feature formed through the annular body, the venting feature being in fluid communication between the inner and outer surfaces.

First claim

Opening claim text (preview).

What is claimed is: 1. An edge load ring (ELR) configured to fit inside a retaining ring of a chemical mechanical polishing (CMP) head, the ELR comprising: an annular body including: an inner surface; an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside the retaining ring; a body portion; a bottom projection extending below the body portion, the bottom projection having a bottom surface facing away from the body portion, the bottom surface configured to contact a substrate; and a venting feature formed through the annular body, the venting feature being in fluid communication between the inner and outer surfaces. 2. The ELR of claim 1 , wherein the body portion and the bottom projection are separately formed and coupled together, wherein the body portion comprises a metal, and wherein the bottom projection comprises a plastic. 3. The ELR of claim 2 , wherein the bottom projection is coupled to the body portion using at least one of an adhesive or a plurality of fasteners. 4. The ELR of claim 1 , wherein the body portion and the bottom projection are integrally formed. 5. The ELR of claim 1 , wherein the bottom projection comprises a plurality of projections. 6. The ELR of claim 1 , wherein: the body portion is formed from a first material; the bottom projection is formed from a second material different from the first material; and the first material has a first hardness, and wherein the second material has a second hardness less than the first hardness. 7. The ELR of claim 1 , wherein the venting feature comprises: a slot formed in the inner surface; and a passage extending radially through the annular body from the slot to the outer surface. 8. The ELR of claim 7 , wherein a longitudinal axis of the slot is orthogonal to the bottom surface, and wherein a longitudinal axis of the passage is orthogonal to the longitudinal axis of the slot. 9. The ELR of claim 7 , wherein the slot is formed in the inner surface of the body portion without extending to a portion of the inner surface along the bottom projection. 10. The ELR of claim 7 , wherein the slot has a width of about 60 mil or less. 11. The ELR of claim 1 , wherein the venting feature is formed in the bottom projection without extending to the body portion, and wherein the venting feature extends through the bottom surface. 12. The ELR of claim 1 , wherein the venting feature is formed in the bottom projection without extending to the body portion, and wherein the venting feature extends through the inner surface without extending to the bottom surface. 13. An edge load ring (ELR) configured to fit inside a retaining ring of a chemical mechanical polishing (CMP) head, the ELR comprising: an annular body including: an inner surface having a step configured to retain the annular body within the polishing head; an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside the retaining ring; a bottom surface extending between the inner and outer surfaces, the bottom surface configured to contact a substrate disposed in the polishing head; an inner taper extending from the inner surface to the bottom surface; an outer taper extending from the outer surface to the bottom surface; and a venting feature extending between the inner and outer surfaces. 14. The ELR of claim 13 , wherein the venting feature is configured to be in fluid communication with a sealed volume formed between the substrate, the inner surface, and a membrane in contact with the inner surface. 15. The ELR of claim 13 , wherein the annular body further comprises: a body portion, wherein the body portion is formed from a first material having a first hardness, the first material having a tensile modulus of about 2,500 MPa or greater; and a bottom projection extending below the body portion, wherein the bottom projection is formed from a second material having a second hardness less than the first hardness. 16. The ELR of claim 15 , wherein the bottom surface is configured to contact a back side of the substrate, wherein the first hardness is greater than a hardness of the back side, and wherein the second hardness is equal to or less than the hardness of the back side. 17. The ELR of claim 15 , wherein the body portion and the bottom projection are separately formed and coupled together, wherein the first material comprises a metal, and wherein the second material comprises a plastic. 18. A polishing head, comprising: a housing; a retaining ring coupled to the housing; a membrane coupled to the housing inside the retaining ring, the membrane and the retaining ring forming a substrate-receiving pocket; and an edge load ring (ELR) disposed radially between the membrane and the retaining ring, the ELR including an annular body, the annular body having: an inner surface having a step configured to retain the annular body within the polishing head; an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside the retaining ring; a bottom surface extending between the inner and outer surfaces, the bottom surface configured to contact a substrate disposed in the substrate-receiving pocket, wherein the substrate extends radially to the retaining ring; and a venting feature extending between the inner and outer surfaces. 19. The polishing head of claim 18 , wherein the venting feature comprises: a slot formed in the inner surface; and a passage extending radially through the annular body from the slot to the outer surface. 20. The polishing head of claim 18 , wherein the annular body further comprises: a body portion, wherein the body portion is formed from a first material having a first hardness; and a bottom projection extending below the body portion, wherein the bottom projection is formed from a second material having a second hardness less than the first hardness, wherein the venting feature is formed in the bottom projection without extending to the body portion, and wherein the venting feature extends through the bottom surface.

Assignees

Inventors

Classifications

  • B24B37/32Primary

    Retaining rings · CPC title

  • for single side lapping of plane surfaces · CPC title

Patent family

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External sources

Frequently asked questions

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What does patent US11440159B2 cover?
Apparatus and methods relating to chemical mechanical polishing (CMP) are described herein. An edge load ring (ELR) is configured to fit inside a retaining ring of a CMP head. The ELR includes an annular body having an inner surface and an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside a retaining ring. The annular body includes a body po…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/32. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 13 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).