Laminate constructs for micro-fluid ejection devices

Patent metadata

Field	Value
Publication number	US-9707758-B2
Application number	US-201514869583-A
Country	US
Kind code	B2
Filing date	Sep 29, 2015
Priority date	May 27, 2010
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-conductive layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.

First claim

What is claimed:

1. A micro-fluid ejection head for use in a micro-fluid ejection device, comprising:
an ejection chip that expels fluid toward a print media, the ejection chip comprising a fluid feed slot; and
a laminate construct that supports the ejection chip, the laminate construct comprising:
a plurality of electrical interconnect layers, at least one of the plurality of interconnect layers being electrically connected to the ejection chip;
conductive layers, at least one of the conductive layers being vertically stacked between two of the plurality of electrical interconnect layers, the conductive layers comprising carbon fiber; and
an ink feed slot in fluid communication with the fluid feed slot of the ejection chip, the ink feed slot passing through the electrical interconnect layers and the conductive layers.

2. The micro-fluid ejection head of claim 1 , further comprising a tile layer in fluid communication with the ejection chip and the laminate construct.

3. The micro-fluid ejection head of claim 2 , wherein the tile layer is disposed between the ejection chip and the laminate construct.

4. The micro-fluid ejection head of claim 2 , wherein the tile layer is made of silicon.

5. The micro-fluid ejection head of claim 1 , further comprising a manifold that supports the laminate construct.

6. The micro-fluid ejection head of claim 5 , wherein the manifold is a plastic manifold.

7. The micro-fluid ejection head of claim 5 , wherein the ejection chip is disposed within a recessed pocket of the laminate construct.

8. The micro-fluid ejection head of claim 5 , further comprising a tile layer in fluid communication with the ejection chip, the laminate construct and the manifold.

9. The micro-fluid ejection head of claim 8 , wherein the tile layer is disposed between the laminate construct and the manifold.

Assignees

• Funai Electric Co
• Funai Electric Co

Inventors

• Anderson Frank Edward
• Corley Richard Earl
• Dixon Michael John
• Fang Jiandong
• Singh Jeanne Marie Saldanha

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• B41J2/14072 Primary

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title

• B41J2/1634

  laser machining · CPC title

• B41J2002/14419

  Manifold · CPC title

• B41J2202/20

  Modules · CPC title