Pedestal heater for spatial multi-wafer processing tool

Patent metadata

Field	Value
Publication number	US-11430686-B2
Application number	US-202017066971-A
Country	US
Kind code	B2
Filing date	Oct 9, 2020
Priority date	Oct 11, 2019
Publication date	Aug 30, 2022
Grant date	Aug 30, 2022

Abstract

Substrate supports comprising a top plate positioned on a shaft are described. The top plate including a primary heating element a first depth from the surface of the top plate, a inner zone heating element a second depth from the surface of the top plate and an outer zone heating element a third depth from the surface of the top plate. Substrate support assemblies comprising a plurality of substrate supports and methods of processing a substrate are also disclosed.

First claim

What is claimed is:

1. A substrate support comprising:
a top plate having a support surface and a bottom surface defining a thickness of the top plate;
a shaft connected to the bottom surface of the top plate, the shaft comprising a sidewall;
a primary heating element within the top plate at a first depth below the support surface;
an inner zone heating element within the top plate at a second depth from the support surface different than the first depth, the inner zone positioned over the sidewall of the shaft;
an outer zone heating element within the top plate at a third depth from the support surface different than the first depth, the outer zone heating element extending further from a central axis of the substrate support than the primary heating element; and
a seal band formed on the support surface.

2. The substrate support of claim 1 , wherein the shaft is hollow and the sidewalls have a thickness.

3. The substrate support of claim 2 , wherein the inner zone heating element is centered over the thickness of the sidewalls.

4. The substrate support of claim 2 , further comprising a primary heating element power line, an inner zone heating element power line and an outer zone heating element power line routed through the hollow shaft to the top plate.

5. The substrate support of claim 1 , wherein the first depth is greater than or equal to about 50% of the thickness of the top plate.

6. The substrate support of claim 1 , wherein the second depth and the third depth are the same.

7. The substrate support of claim 1 , wherein the second depth and third depth are independently greater than the first depth.

8. The substrate support of claim 1 , wherein the outer zone heating element is located at a distance from the central axis sufficient to overlap an edge of a substrate to be supported by the support surface.

9. The substrate support of claim 1 , wherein the top plate has a thickness in the range of about 10 mm to about 30 mm.

10. The substrate support of claim 9 , wherein the top plate has a thickness of about 20 mm.

11. The substrate support of claim 1 , further comprising a plurality of mesas formed within the seal band on the support surface.

12. The substrate support of claim 11 , wherein the mesas have a height in the range of about 10 μm to about 20 μm.

13. The substrate support of claim 1 , further comprising one or more electrodes configured to form an electrostatic chuck.

14. The substrate support of claim 1 , wherein the primary heating element is connected to a power supply with a power in the range of about 900 W to about 1300 W.

15. The substrate support of claim 14 , wherein the inner zone heating element and the outer zone heating element are connected to one or more power supplies with a power in the range of about 40 W to about 70 W.

16. The substrate support of claim 1 , further comprising one or more temperature sensors within the top plate.

17. The substrate support of claim 1 , further comprising a controller comprising one or more configurations selected from a configuration to power the primary heating element, a configuration to power the inner zone heating element, a configuration to power the outer zone heating element, a configuration to measure a temperature of the top plate, and/or a configuration to power one or more electrodes within the top plate to electrostatically chuck a substrate to the support surface.

18. A substrate support assembly comprising a plurality of substrate supports connected to a central hub, the substrate supports rotatable about the central hub, each of the substrate supports comprising:
a top plate having a support surface and a bottom surface defining a thickness of the top plate;
a shaft connected to the bottom surface of the top plate, the shaft comprising a sidewall;
a primary heating element within the top plate at a first depth below the support surface;
an inner zone heating element within the top plate at a second depth from the support surface greater than the first depth, the inner zone positioned over the sidewall of the shaft;
an outer zone heating element within the top plate at a third depth from the support surface greater than the first depth, the outer zone heating element extending further from a central axis of the substrate support than the primary heating element; and
a seal band formed on the support surface.

19. A method of processing a substrate comprising:
chucking a substrate to a substrate support comprising
a top plate having a support surface and a bottom surface defining a thickness of the top plate,
a shaft connected to the bottom surface of the top plate, the shaft comprising a sidewall,
a primary heating element within the top plate at a first depth below the support surface,
an inner zone heating element within the top plate at a second depth from the support surface greater than the first depth, the inner zone positioned over the sidewall of the shaft,
an outer zone heating element within the top plate at a third depth from the support surface greater than the first depth, the outer zone heating element extending further from a central axis of the substrate support than the primary heating element, and
a seal band formed on the support surface; and

powering the primary heating element, the inner zone heating element and the outer zone heating element to heat the top plate and the substrate.

Assignees

• Applied Materials Inc

Inventors

• Ulavi Tejas
• Baluja Sanjeev
• Kashyap Dhritiman Subha

Classifications

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H01L21/67103

  Electricity · mapped topic

• H01L21/6833 Primary

  Electricity · mapped topic