Position and temperature monitoring of ALD platen susceptor

US11430680B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11430680-B2
Application numberUS-201916388132-A
CountryUS
Kind codeB2
Filing dateApr 18, 2019
Priority dateMar 15, 2013
Publication dateAug 30, 2022
Grant dateAug 30, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.

First claim

Opening claim text (preview).

What is claimed is: 1. A deposition apparatus comprising: a gas distribution assembly having a front surface and an edge with a reference mark; a susceptor assembly spaced from the gas distribution assembly to rotate a plurality of substrates around a central axis, the susceptor assembly having a top surface with a plurality of recesses to hold a plurality of substrates, a bottom surface and an edge, the top surface of the susceptor assembly and the front surface of the gas distribution assembly defining a gap; a camera having a field of view including the edge of the susceptor assembly, the edge of the gas distribution assembly, the reference mark, and the gap; and a controller connected to the camera and configured to determine the gap between the top surface of the susceptor assembly and the front surface of the gas distribution assembly by measuring a distance from the reference mark to the top surface of the susceptor assembly. 2. The apparatus of claim 1 , wherein the camera comprises at least three cameras spaced about an interior region of the deposition apparatus. 3. The apparatus of claim 2 , wherein the controller is configured to determine the gap at each camera position while the susceptor assembly remains stationary. 4. The apparatus of claim 2 , wherein the controller is configured to determine a plane formed by the susceptor assembly relative to a plane formed by the gas distribution assembly. 5. The apparatus of claim 1 , wherein the controller is configured to determine the planarity of the susceptor assembly based on a plurality of images from the camera taken during a processing cycle in which the susceptor assembly rotates. 6. The apparatus of claim 1 , wherein the controller includes a feedback circuit in communication with at least one gap control actuation device, the controller configured to provide a signal to the at least one gap control actuation device to move the susceptor assembly to change the gap. 7. A deposition apparatus comprising: a gas distribution assembly having a front surface and an edge with a reference mark; a susceptor assembly spaced from the gas distribution assembly to rotate a plurality of substrates around a central axis, the susceptor assembly having a top surface, a bottom surface, and an edge, the top surface and the front surface defining a gap, the top surface having a plurality of recesses to hold a plurality of substrates, the bottom surface having a reference point having a shape involving at least two vertices having a known distance; a side camera having a field of view including the edge of the susceptor assembly, the edge of the gas distribution assembly, the reference mark, and the gap; a bottom camera with a field of view directed at the bottom surface of the susceptor assembly, the reference point within the field of view of the bottom camera; and a controller connected to the side camera and the bottom camera, the controller configured to: determine the gap by measuring a distance from the reference mark to the top surface of the susceptor assembly; and determine one or more of a distance of the bottom camera from the susceptor assembly or the gap by measure a distance between the at least two vertices. 8. The apparatus of claim 7 , wherein the bottom camera comprises at least three cameras spaced about an interior region of the deposition apparatus and the reference point comprises at least three reference points, each reference point positioned within a field of view of at least one camera. 9. The apparatus of claim 8 , wherein the controller is configured to determine the gap at each reference point position while the susceptor assembly remains stationary. 10. The apparatus of claim 8 , wherein the controller is configured to determine the planarity of the susceptor assembly based on a plurality of images from the at least three cameras taken during a processing cycle in which the susceptor assembly rotates. 11. The apparatus of claim 7 , wherein the controller includes a feedback circuit in communication with at least one gap control actuation device, the controller configured to provide a signal to the at least one gap control actuation device to move one or more of the susceptor assembly or the gas distribution assembly to change the gap. 12. The apparatus of claim 8 , wherein the controller is configured to use a plurality of measurements from at least one of the at least three cameras taken during a processing cycle in which the susceptor assembly rotates to determine the planarity of the susceptor assembly adjacent the at least one of at least three cameras during the processing cycle.

Assignees

Inventors

Classifications

  • characterised by supporting two or more semiconductor substrates · CPC title

  • characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

  • Temperature monitoring · CPC title

  • Position monitoring, e.g. misposition detection or presence detection · CPC title

  • the substrate being rotated · CPC title

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Frequently asked questions

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What does patent US11430680B2 cover?
Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/0606. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 30 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).