Fluidization of agglomerated solder microspheres
US-11247285-B1 · Feb 15, 2022 · US
Soldering device
US11420282B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11420282-B2 |
| Application number | US-201716305705-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 27, 2017 |
| Priority date | Feb 1, 2017 |
| Publication date | Aug 23, 2022 |
| Grant date | Aug 23, 2022 |
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- Title
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Abstract
Official abstract text for this publication.
A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.
First claim
Opening claim text (preview).
The invention claimed is: 1. A soldering device, comprising: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the plurality of solder piece guide tubes; and a heating unit which heats the first holding unit, wherein tip end portions of the plurality of solder piece guide tubes on a soldering side are arranged inside of the first holding unit; and a second holding unit which is arranged closer to a side of the supply port than the first holding unit and holds the plurality of solder piece guide tubes, wherein the plurality of solder piece guide tubes include a region exposed to external space between a portion thereof held by the first holding unit and a portion thereof held by the second holding unit. 2. The soldering device according to claim 1 , wherein the first holding unit is a plate-shaped body made of metal, in which a plurality of hole portions are formed, and the plurality of solder piece guide tubes are inserted in the plurality of hole portions so as to be held in the first holding unit. 3. The soldering device according to claim 1 , wherein an end surface of the first holding unit is capable of abutting on a surface of an object to be soldered, and the tip end portions of the solder piece guide tubes are arranged on the same plane as the end surface of the first holding unit. 4. The soldering device according to claim 1 , wherein an end surface of the first holding unit is capable of abutting on a surface of an object to be soldered, and the tip end portions of the solder piece guide tubes are arranged rearward of the end surface of the first holding unit. 5. The soldering device according to claim 1 , wherein the first holding unit is formed of aluminum or stainless steel, and the solder piece guide tubes are formed of glass, ceramic, aluminum, stainless steel, or titanium. 6. The soldering device according to claim 1 , wherein the first holding unit is formed of aluminum or stainless steel, the second holding unit is formed of any of polyacetal resin, polycarbonate resin, epoxy resin, and phenol resin, and the solder piece guide tubes are formed of glass, ceramic, aluminum, stainless steel, or titanium. 7. The soldering device according to claim 1 , further comprising: means which supplies cooling air to the region exposed to the external space.
Assignees
Inventors
Classifications
Bits or tips · CPC title
by soldering · CPC title
- B23K3/0615Primary
forming part of a soldering iron · CPC title
- B23K3/0623Primary
for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets · CPC title
electric · CPC title
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Frequently asked questions
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- What does patent US11420282B2 cover?
- A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding un…
- Who is the assignee on this patent?
- Hitachi Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K3/0615. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 23 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).