Optical interposer

US11409063B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11409063-B2
Application numberUS-201916967493-A
CountryUS
Kind codeB2
Filing dateFeb 5, 2019
Priority dateFeb 5, 2018
Publication dateAug 9, 2022
Grant dateAug 9, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Waveguides of optically transparent interposers are adiabatically coupled to respective waveguides of photonic integrated circuits that are mounted to the optically transparent interposers. In particular, photonic integrated circuits can be mounted to an interposer that has both optical connections and electrical connections. The optical connections of the interposer can be adiabatically coupled to the photonic integrated circuit. The electrical connections can be connected to the photonic integrated circuit and to a host board that also supports an ASIC.

First claim

Opening claim text (preview).

What is claimed: 1. An interposer for use with a photonically co-packaged application specific integrated circuit, the interposer comprising: a first surface and a second surface opposite the first surface, such that the first surface defines a recessed region whereby the first surface defines a recessed portion at the recessed region, the recessed portion being recessed toward the second surface with respect to the first surface outside the recessed region, wherein the first surface has optical connections and electrical connections, the second surface comprises electrical connections and no optical connections, and the electrical connections of the first surface are disposed in the recessed region, wherein at least one of the optical connections comprises at least one evanescent coupling region carried at least adjacent to the first surface. 2. The interposer as recited in claim 1 , wherein the at least one evanescent coupling region is defined by a tapered region of at least one waveguide that defines a corresponding at least one of the optical connections. 3. The interposer as recited in claim 2 , further comprising an interposer body that defines the first and second surfaces, wherein the interposer body is optically transparent. 4. The interposer of claim 2 , wherein each at least one waveguide comprises a spatially localized region having a refractive index that is raised with respect to a surrounding material of the interposer body. 5. The interposer as recited in claim 2 , further comprising: an interposer body that defines the second surface and partially defines the first surfaces; and an optically transparent layer that is supported by the interposer body and partially defines the first surface, such that the optically transparent layer and the interposer body combine to define the first surface. 6. The interposer as recited in claim 5 , wherein the optically transparent layer is made of glass. 7. The interposer as recited in claim 1 , wherein the first and second surfaces are opposite each other along a transverse direction, the interposer further comprising a standoff that defines the recessed region and is offset from the recessed region along a direction that is perpendicular to the transverse direction, wherein the standoff carries at least one of the optical connections. 8. An optically transparent interposer comprising an optical waveguide having an evanescent coupling region that is configured to evanescently couple to a waveguide of a photonic integrated circuit of an optical engine, wherein each at least one waveguide further defines a mode conversion region that is configured to transform a mode size of the optical waveguide at the evanescent coupling region. 9. The optically transparent interposer as recited in claim 8 , further comprising a first electrical connection configured to be placed in electrical communication with the optical engine. 10. The optically transparent interposer as recited in claim 9 , further comprising a second electrical connection configured to be placed in electrical communication with a host substrate. 11. The optically transparent interposer as recited in claim 10 , defining a first surface and a second surface, wherein the first surface carries the first electrical connection, the evanescent coupling region is disposed at least adjacent to the first surface, and the second surface carries the second electrical connection. 12. The optically transparent interposer as recited in claim 11 , wherein the second surface does not carry any optical connections. 13. The optically transparent interposer as recited in claim 12 , further comprising a plurality of optical connections, wherein at least one of the optical connections comprises at least one evanescent coupling region disposed at least adjacent to the first surface. 14. The optically transparent interposer as recited in claim 13 , further comprising an interposer body that defines the first and second surfaces. 15. The optically transparent interposer as recited in claim 14 , wherein the at least one evanescent coupling region is defined by at least one waveguide that defines a corresponding at least one of the optical connections. 16. The optically transparent interposer as recited in claim 15 , wherein each at least one waveguide is a single mode optical waveguide. 17. The optically transparent interposer as recited in claim 15 , further comprising an optically transparent interposer body that defines the first and second surfaces. 18. The optically transparent interposer as recited in claim 15 , wherein each at least one waveguide comprises a spatially localized region having a refractive index that is raised with respect to a surrounding material of the interposer body. 19. The optically transparent interposer as recited in claim 8 , wherein the waveguide is at least partially defined by an ion exchange layer. 20. The optically transparent interposer as recited in claim 8 , further comprising a first surface and a second surface opposite the first surface along a transverse direction, the interposer further comprising a standoff that defines a recessed region and is offset from the recessed region along a direction that is perpendicular to the transverse direction, wherein the optical waveguide is disposed at the standoff, and the recessed region carries a plurality of electrical connections. 21. An interposer comprising: an interposer body that partially defines a first outer surface of the interposer, and further defines a second outer surface of the interposer opposite the first outer surface; and an optically transparent layer that is supported by the interposer body and partially defines the first outer surface, wherein the optically transparent layer comprises an optical waveguide having an evanescent coupling region that is configured to evanescently couple to a waveguide of an optical engine. 22. The interposer as recited in claim 21 , wherein the interposer body defines a first electrical connection at the first outer surface, and a second electrical connection at the second outer surface. 23. The interposer as recited in claim 21 , wherein the first outer surface at the interposer body is recessed with respect to the first outer surface at the optically transparent layer. 24. The interposer as recited in claim 23 , wherein the interposer body comprises a plurality of electrical vias. 25. The interposer as recited in claim 21 , wherein the optically transparent layer is made of glass. 26. The interposer as recited in- claim 21 , wherein the interposer body is optically opaque. 27. The interposer as recited in claim 21 , wherein the interposer body is optically translucent. 28. The interposer as recited in claim 21 , wherein the interposer body is optically transparent.

Assignees

Inventors

Classifications

  • G02B6/43Primary

    Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections · CPC title

  • G02B6/4246Primary

    Bidirectionally operating package structures · CPC title

  • Coupler · CPC title

  • Silicon · CPC title

  • having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence) · CPC title

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What does patent US11409063B2 cover?
Waveguides of optically transparent interposers are adiabatically coupled to respective waveguides of photonic integrated circuits that are mounted to the optically transparent interposers. In particular, photonic integrated circuits can be mounted to an interposer that has both optical connections and electrical connections. The optical connections of the interposer can be adiabatically couple…
Who is the assignee on this patent?
Samtec Inc
What technology area does this patent fall under?
Primary CPC classification G02B6/43. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 09 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).