Optical coupling lens and optical communication module having same
US-9235012-B1 · Jan 12, 2016 · US
Optical I/O system using planar light-wave integrated circuit
US9507086B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9507086-B2 |
| Application number | US-201113996531-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 30, 2011 |
| Priority date | Dec 30, 2011 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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Abstract
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Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.
First claim
Opening claim text (preview).
What is claimed is: 1. A processor comprising: a package substrate; a processor die coupled to the package substrate; and a planar light-wave circuit (PLC) coupled to the processor die on the package substrate, the PLC including electrical-optical circuits coupled through the PLC using through-silicon vias (TSVs) to transceiver logic on the package substrate, the electrical-optical circuits to convert between an electrical signal and a corresponding optical signal, wherein th…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9507086B2 cover?
- Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electr…
- Who is the assignee on this patent?
- Kobrinsky Mauro J, Braunisch Henning, Liff Shawna M, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification G02B6/12. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).