Optoelectronic integrated package module and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-8965149-B2
Application number	US-201313839930-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Aug 13, 2012
Publication date	Feb 24, 2015
Grant date	Feb 24, 2015

Abstract

According to one embodiment, there is provided an optoelectronic integrated package module including a silicon interposer, an optical semiconductor element formed in the silicon interposer, and a semiconductor integrated circuit chip module including a first semiconductor integrated circuit chip including a logic circuit and mounted on a first principal surface and a second semiconductor integrated circuit chip having a second principal surface side mounted on the silicon interposer. The first and second semiconductor integrated circuit chips are electrically connected to each other via the via interconnections formed inside the second semiconductor integrated circuit chip from the first principal surface. The first or second semiconductor integrated circuit chip receives an electrical signal obtained via the via interconnection by means of the unterminated reception circuit.

First claim

What is claimed is:

1. An optoelectronic integrated package module comprising:
a silicon interposer formed on a silicon substrate, the interposer including an electrical interconnection and an optical waveguide;
an optical semiconductor element formed in the silicon interposer, the optical semiconductor element being electrically connected to the electrical interconnection and optically coupled to the optical waveguide; and
a semiconductor integrated circuit chip module includ…

Assignees

• Toshiba Kk

Inventors

• Uemura Hiroshi
• Furuyama Hideto

Classifications

• H10W90/724

  Electricity · mapped topic

• G02B6/12 Primary

  Physics · mapped topic

• G02B6/4245

  Physics · mapped topic

• H01L2224/16225

  Electricity · mapped topic

• G02B6/43

  Physics · mapped topic