Resin composition and article made therefrom

Patent metadata

Field	Value
Publication number	US-11407895-B2
Application number	US-202016923315-A
Country	US
Kind code	B2
Filing date	Jul 8, 2020
Priority date	May 29, 2020
Publication date	Aug 9, 2022
Grant date	Aug 9, 2022

Abstract

A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

First claim

What is claimed is:

1. A resin composition, comprising:
60 parts by weight of a maleimide resin;
10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I):

wherein n is an integer of 0 to 10; and
5 parts by weight to 30 parts by weight of a methylenebis(diethylaniline).

2. The resin composition of claim 1 , wherein the maleimide resin comprises 4,4′-diphenylmethane bismaleimide, polyphenylmethane maleimide, bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide, 3,3′-dimethyl-5,5′-dipropyl-4,4′-diphenylmethane bismaleimide, m-phenylene bismaleimide, 4-methyl-1,3-phenylene bismaleimide, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, N-2,3-xylylmaleimide, N-2,6-xylylmaleimide, N-phenyl maleimide, vinyl benzyl maleimide, maleimide resin containing aliphatic long chain structure, prepolymer of diallyl compound and maleimide resin, prepolymer of diamine and maleimide resin, prepolymer of multi-functional amine and maleimide resin, prepolymer of acid phenol compound and maleimide resin, or a combination thereof.

3. The resin composition of claim 1 , further comprising polyphenylene ether resin, cyanate ester resin, active ester, vinylbenzyl-dicyclopentadiene phenylene ether, bis(vinylbenzyl)ether, 1,2-bis(vinylphenyl)ethane, divinylbenzene, triallyl isocyanurate, triallyl cyanurate, 1,2,4-trivinyl cyclohexane, diallyl bisphenol A, styrene, acrylate, polyolefin, epoxy resin, phenolic resin, benzoxazine resin, styrene maleic anhydride resin, polyamide, polyimide, or a combination thereof.

4. The resin composition of claim 1 , further comprising flame retardant, inorganic filler, curing accelerator, polymerization inhibitor, solvent, silane coupling agent, surfactant, coloring agent, toughening agent, core-shell rubber, or a combination thereof.

5. An article made from the resin composition of claim 1 , comprising a prepreg, a resin film, a laminate or a printed circuit board.

6. The article of claim 5 , characterized by absence of weave exposure under visual inspection.

7. The article of claim 5 , having a glass transition temperature as measured by reference to IPC-TM-650 2.4.24.4 of greater than or equal to 280° C.

8. The article of claim 5 , having a percentage of storage modulus change between 50° C. and 250° C. as measured by reference to IPC-TM-650 2.4.24.4 of less than or equal to 20%.

9. The article of claim 5 , having an X-axis thermal expansion coefficient as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 8.2 ppm/° C.

10. The article of claim 5 , having a dielectric constant as measured by reference to JIS C2565 at 10 GHz of less than or equal to 3.97.

11. The article of claim 5 , having a dissipation factor as measured by reference to JIS C2565 at 10 GHz of less than or equal to 0.0070.

Assignees

• Elite Material Co Ltd

Inventors

• Hsu Ching-Hsien

Classifications

• C08L79/085 Primary

  Unsaturated polyimide precursors · CPC title

• C08G59/5033

  aromatic · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

• B32B27/18

  characterised by the use of special additives · CPC title

• C08J2463/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title