Rapid curing epoxy repair composition and use thereof
US-2024360306-A1 · Oct 31, 2024 · US
Insulating resin composition for printed circuit board and products manufactured by using the same
US2015114693A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114693-A1 |
| Application number | US-201414195665-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 3, 2014 |
| Priority date | Oct 25, 2013 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.
First claim
Opening claim text (preview).
What is claimed is: 1 . An insulating resin composition for a printed circuit board comprising: a naphthalene-based epoxy resin; a bismaleimide resin; a cyanate ester resin; a coupling agent; and an eucryptite inorganic filler. 2 . The insulating resin composition for a printed circuit board as set forth in claim 1 , wherein the naphthalene-based epoxy resin is contained in a content of 5 to 30 wt %, the bismaleimide resin is contained in a conte…
Assignees
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Classifications
Chemistry & Metallurgy · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- C08L63/00Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US2015114693A1 cover?
- Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coeffi…
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification C08L63/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Apr 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).