Electrostatic chuck and plasma processing apparatus including the same

Patent metadata

Field	Value
Publication number	US-11398397-B2
Application number	US-201916456757-A
Country	US
Kind code	B2
Filing date	Jun 28, 2019
Priority date	Nov 21, 2018
Publication date	Jul 26, 2022
Grant date	Jul 26, 2022

Abstract

Electrostatic chucks, plasma processing apparatuses, and methods of fabricating semiconductor devices using the same are provided. The electrostatic chuck includes a chuck base, an upper plate provided on the chuck base, and an inner plate provided between the chuck base and the upper plate. A first diameter of the inner plate is less than a second diameter of the upper plate.

First claim

What is claimed is:

1. An electrostatic chuck comprising:
a chuck base;
an upper plate provided on the chuck base; and
an inner plate provided between the chuck base and the upper plate, the inner plate having a first diameter that is less than a second diameter of the upper plate,
wherein the inner plate has a first dielectric constant different from a second dielectric constant of the upper plate.

2. The electrostatic chuck of claim 1 , wherein the first dielectric constant is less than the second dielectric constant.

3. The electrostatic chuck of claim 2 , wherein the inner plate includes polytetrafluoroethylene.

4. The electrostatic chuck of claim 2 further comprising an outer dielectric ring surrounding the inner plate, an outer diameter of the outer dielectric ring being equal to the second diameter of the upper plate.

5. The electrostatic chuck of claim 4 , wherein the outer dielectric ring has a third dielectric constant that is greater than the first dielectric constant of the inner plate.

6. The electrostatic chuck of claim 4 , wherein the outer dielectric ring comprises quartz.

7. The electrostatic chuck of claim 5 further comprising an inner dielectric ring provided between the outer dielectric ring and the inner plate.

8. The electrostatic chuck of claim 7 , wherein the inner dielectric ring has a fourth dielectric constant that is less than the third dielectric constant of the outer dielectric ring and is greater than the first dielectric constant of the inner plate.

9. The electrostatic chuck of claim 7 , wherein the inner dielectric ring includes polyetheretherketone, polybenzimidazole, or biaxially-oriented polyethylene terephthalate.

10. The electrostatic chuck of claim 1 , wherein the inner plate has a first thickness that is one to three times of a second thickness of the upper plate.

11. The electrostatic chuck of claim 10 , wherein the first thickness of the inner plate is equal to or less than about 20 mm.

12. The electrostatic chuck of claim 11 , wherein the first thickness of the inner plate has a range between about 1.7 mm and about 5 mm.

13. The electrostatic chuck of claim 1 , wherein the first diameter of the inner plate has a range between about 40 mm and about 80 mm.

14. The electrostatic chuck of claim 1 , wherein the chuck base comprises:
a first lower plate; and
a second lower plate provided on the first lower plate, the second lower plate comprising a recess provided in the second lower plate, and
wherein the inner plate is provided in the recess of the second lower plate.

15. The electrostatic chuck of claim 14 , wherein the recess is provided in a center portion of the second lower plate.

16. A plasma processing apparatus comprising:
a housing;
an electrostatic chuck provided in the housing and configured to receive a substrate; and
an edge ring surrounding the electrostatic chuck,
wherein the electrostatic chuck comprises:
a chuck base;
an upper plate provided on the chuck base; and
an inner plate provided between the chuck base and the upper plate, the inner plate having a first diameter that is less than a second diameter of the upper plate, and

wherein the inner plate has a first dielectric constant different from a second dielectric constant of the upper plate.

17. The plasma processing apparatus of claim 16 , wherein the edge ring is provided on an edge of the chuck base and surrounds an outer circumference of the upper plate, and
wherein the inner plate is provided within the edge ring and is thinner than the edge ring.

18. The plasma processing apparatus of claim 17 , wherein the electrostatic chuck further comprises an outer dielectric ring provided within the edge ring and surrounding the inner plate.

19. The plasma processing apparatus of claim 18 , wherein the electrostatic chuck further comprises an inner dielectric ring provided within the edge ring and between the inner plate and the outer dielectric ring.

20. The plasma processing apparatus of claim 19 , wherein the inner dielectric ring is spaced apart at about 10 mm or less from the inner plate.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Yongwoo
• Noh Youngjin
• Choi Myungsun
• Hur Minyoung
• Shim Seungbo
• Lee Jaehak

Classifications

• H10P50/242

  of Group IV materials · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H01J2237/3343

  Problems associated with etching · CPC title

• H01J37/32532 Primary

  Electrodes · CPC title