Increasing electrical conductivity at selected locations of a 3D object

Patent metadata

Field	Value
Publication number	US-11396129-B2
Application number	US-201716076514-A
Country	US
Kind code	B2
Filing date	Apr 18, 2017
Priority date	Apr 18, 2017
Publication date	Jul 26, 2022
Grant date	Jul 26, 2022

Abstract

A device includes a coater, a dispenser, and a treatment portion. The coater is to coat, layer-by-layer, a build material relative to a build pad to form a 3D object. The dispenser is to at least dispense a fluid including a first at least potentially electrically conductive material. In at least some selected locations of an external surface of the 3D object. The treatment portion is to treat the 3D object to substantially increase electrically conductivity on the external surface of the 3D object at the at least some selected locations.

First claim

The invention claimed is:

1. An additive manufacturing device comprising:
a coater;
a dispenser;
a treatment portion; and
a controller configured to cause:
the coater to coat, layer-by-layer, a build material on a build pad to form a 3D object;
the dispenser to dispense at least a fluid including a first at least potentially electrically conductive material along with a salt solution causing the potentially electrically conductive material to become electrically active in at least some selected locations of an external surface of the 3D object; and
the treatment portion to treat the 3D object to substantially increase electrical conductivity on the external surface of the 3D object at the at least some selected locations dispensed with the fluid by causing plating to be deposited on the 3D object at the at least some selected locations.

2. The device of claim 1 , further comprising:
an energy source configured to apply energy to fuse selected portions of each respective layer of the 3D object.

3. The device of claim 1 ,
wherein the dispenser is further configured to dispense a fluid including a second electrically conductive material in the form of a metal salt in at least some selected locations of the external surface of the 3D object,
wherein the treatment portion is configured to expose the 3D object to a first treatment to decompose the metal salt to a zero-valent metal, and
wherein the first treatment comprises at least one of a chemical treatment or a thermal treatment.

4. The device of claim 3 , wherein the electrical conductivity at the at least some selected locations dispensed with the second electrically conductive material, after the first treatment, is on a same order of magnitude of a bulk conductivity of the metal forming the metal salt.

5. The device of claim 1 , wherein the plating is electroplating formed as a second electrically conductive material deposited onto the first electrically conductive material at the at least some selected locations to substantially increase electrical conductivity.

6. The device of claim 1 , wherein the dispenser is further configured to dispense a fluid including a second electrically conductive material in the form of a metal salt in at least some selected locations of an external surface of the 3D object,
wherein at a time of the dispensing of the second electrically conductive material, the second electrically conductive material is in an electrically inactive state, and
wherein the device is configured to apply energy to the at least some selected locations dispensed with the second electrically conductive material to convert the second electrically conductive material from the electrically inactive state to an electrically active state.

7. The device of claim 1 , wherein the treatment portion is configured to treat a first group of the at least some selected locations with a second electrically conductive material and to treat a second group of the at least some selected locations with a third electrically conductive material having a material composition different than the second electrically conductive material.

8. The device of claim 1 , wherein the treatment portion comprises at least one of:
a sprayer to deposit the plating as a second electrically conductive material at the at least some selected locations via at least one of electrospraying, arc spraying, and plasma spraying; or
an electroless plating treatment to deposit the plating as a second electrically conductive material at the at least some selected locations.

9. A device comprising:
a control portion including a processing resource configured to execute machine-readable instructions, stored in a non-transitory medium, to:
arrange, within a build environment, layers of a build material on a build pad to additively manufacture a monolithic 3D object;
dispense in at least some selected locations of an external surface of the 3D object a fluid including a first potentially electrically conductive material along with a salt solution causing the potentially electrically conductive material to become electrically active; and
treat, within a treatment environment, the 3D object to substantially increase an electrical conductivity at the at least some selected locations dispensed with the fluid by causing plating to be deposited on the 3D object at the at least some selected locations.

10. The device of claim 9 , the instructions being further executable to implement a treatment engine to select a treatment to increase the electrical conductivity at the at least some selected locations via at least one of:
an electroplating treatment;
an electroless plating treatment;
or
a spraying treatment.

11. The device of claim 9 , the instructions being further executable to implement a dispenser engine to select the first electrical conductive material from a fluid comprising at least one of:
a metal material; or
a non-metal material.

12. An additive manufacturing method comprising:
forming a build material layer on a build pad;
dispensing a first fluid onto selected portions of the build material layer;
repeating the forming and the dispensing of the first fluid to additively manufacture a 3D object;
dispensing a second fluid comprising a first potentially electrically conductive material and a salt solution causing the potentially electrically conductive material to become electrically active, at at least some selected locations of an external surface of the 3D object;
treating the external surface of the 3D object to substantially increase a volume of electrically conductive material, including the first potentially electrically conductive material, at the at least some selected locations; and
electroplating a second electrically conductive material at the at least some selected locations dispensed with the second fluid.

13. The method of claim 12 , further comprising dispensing a third fluid comprising a metal salt in at least some selected locations of the external surface of the 3D object, wherein the treating further comprises:
exposing the external surface of the 3D object to a first treatment to decompose the metal salt to a zero-valent metal exposed on the external surface of the 3D object.

14. The method of claim 12 , wherein the respective first and second electrically conductive materials define all electrically conductive materials at the at least some selected locations.

15. The method of claim 12 , further comprising:
arranging an electrically conductive structure within an interior of the 3D object, with at least one portion of the electrically conductive structure electrically connected to at least one of the some selected locations.

Assignees

• Hewlett Packard Development Co

Inventors

• Erickson Kristopher J
• Anthony Thomas C
• Zhao Lihua

Classifications

• B22F10/12

  by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP] · CPC title

• B22F10/64

  by thermal means (control of energy beam parameters for post heating B22F10/364) · CPC title

• B22F10/50

  Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up · CPC title

• B22F10/18

  by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF] · CPC title

• B22F10/62

  by chemical means · CPC title