Direct writing for additive manufacturing systems

Patent metadata

Field	Value
Publication number	US-9533451-B2
Application number	US-201414213731-A
Country	US
Kind code	B2
Filing date	Mar 14, 2014
Priority date	Mar 15, 2013
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

There are provided techniques for direct printing material into parts made by additive manufacturing, such as parts made by laser sintering. The direct printed material may be a metal, elastomer, ceramic, or any other material. Further, the direct printed material is typically different than the laser sintering material. Other aspects of the invention include using direct printed materials in the laser sintered parts to improve part strength, provide multi-materials, selectively provide electrical conductivity, and/or provide other desirable features to the parts.

First claim

That which is claimed:

1. A method of fabricating a three-dimensional object from digital data representing the object, the method comprising:
providing a first layer of particulate material;
consolidating at least a first portion of the first layer of particulate material to form a consolidated first cross-section of the object;
applying a first portion of conductive material to the consolidated first cross-section;
applying a second layer of particulate material to the consolidated first cross-section of the first layer; and
consolidating at least a second portion of the second layer of particulate material to form a consolidated second cross-section of the object.

2. The method of claim 1 , wherein consolidating the first portion of particulate material and/or the second portion of particulate material comprises exposing the first portion of particulate material and/or the second portion of particulate material to electromagnetic radiation, thereby sintering the particulate material in the exposed first portion of particulate material and/or the second portion of particulate material.

3. The method of claim 1 , wherein consolidating the first portion of particulate material and/or the second portion of particulate material comprises applying a fluid binder material to the first portion of particulate material and/or the second portion of particulate material.

4. The method of claim 1 , wherein the second layer of particulate material is of a height greater than the height of the first portion of the conductive material.

5. The method of claim 1 , wherein the second layer of particulate material is of a height less than the height of the first portion of the conductive material.

6. The method of claim 1 , wherein the second layer of particulate material is of a height approximately equal to the height of the first portion of the conductive material.

7. The method of claim 1 , further comprising:
applying a second portion of conductive material to the consolidated second cross-section of the object.

8. The method of claim 5 , further comprising:
applying a second portion of conductive material to the consolidated second cross-section of the object in electrical contact with the first portion of conductive material.

9. The method of claim 6 , further comprising:
applying a second portion of conductive material to the consolidated second cross-section of the object in electrical contact with the first portion of conductive material.

10. An apparatus for fabricating a three-dimensional object from digital data representing the object, the apparatus comprising:
a housing;
a first additive manufacturing device positioned in the housing and having a bed configured for carrying a first layer of particulate material;
the first additive manufacturing device being configured to consolidate a portion of the first layer of particulate material to form a consolidated first cross-section of the object;
a second device positioned in the housing and configured to deposit a first portion of conductive material on the consolidated first cross-section;
the first additive manufacturing device being configured to apply a second layer of particulate material to the consolidated first cross-section of the first layer;
the first additive manufacturing device being configured to selectively consolidate a portion of the second layer of particulate matter to form a consolidated second cross-section of the object; and
the second device being configured to apply a second portion of conductive material to the consolidated second cross-section of the object, wherein the first additive manufacturing device is a selective laser sintering device, and
wherein the second device is a 3D printer.

11. The apparatus as defined in claim 10 , wherein the first additive manufacturing device is configured to form the consolidated second cross-section of a height that is greater than the height of the first portion of the conductive material.

12. The apparatus of claim 10 , wherein the first additive manufacturing device is configured to form the consolidated second cross-section of a height that is less than the height of the first portion of the conductive material.

13. The apparatus of claim 10 , wherein the first additive manufacturing device is configured to form the consolidated second cross-section of a height that is approximately equal to the height of the first portion of the conductive material.

14. The apparatus of claim 12 , wherein the second device is configured to form the second portion of conductive material in electrical contact with the first portion of conductive material.

15. An object made by additive manufacturing, the object comprising:
a plurality of stacked layers formed from a particulate build material, the layers being bonded to one another in the z-direction; and
an electrically conductive network disposed within the layers of particulate build material, the electrically conductive network extending in the z-direction through a plurality of the layers of particulate build material.

16. The object of claim 15 , wherein the electrically conductive network extends in the z-direction through at least 10 stacked layers formed from the particulate build material.

17. The object of claim 15 , wherein the electrically conducive network is a continuous network.

18. The object of claim 15 , wherein the electrically conductive network of the object has a feature resolution of 100 μm or less.

19. The method of claim 1 , wherein the particulate material is formed from a ceramic material or a polymeric material.

20. The method of claim 1 , wherein the particulate material is formed from alumina, an aluminosilicate, an acrylic resin, polyethylene, polypropylene, polyethylene oxide, polypropylene oxide, polyethyleneimine, polystyrene, a polyurethane, a polyurea, a polyester, a polyamide, a polyimide, poly(ether ether ketone) (PEEK), poly(ether ketone ketone) (PEKK), poly(ether ketone) (PEK), poly(arylether ketone) (PAEK), poly(ether ether ketone ketone) (PEEKK), poly(ether ketone ether ketone ketone) (PEKEKK), carboxymethyl cellulose, a gelatin, a starch, chitin, chitosan, or a combination of one or more of the foregoing.

Assignees

• 3D Systems Inc

Inventors

• Folgar Luis N
• Folgar Christian E

Classifications

• H01C17/065

  by thick film techniques, e.g. serigraphy · CPC title

• H01C7/18

  comprising a plurality of layers stacked between terminals · CPC title

• H01C7/027

  consisting of conducting or semi-conducting material dispersed in a non-conductive organic material · CPC title

• H01B5/16

  comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber (H01B1/14, H01B1/20 take precedence; insulating bodies with conductive admixtures H01B17/64; conductive paints C09D5/24) · CPC title

• B29C64/153

  using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title