Visualizing and modeling thermomechanical stress using photoluminescence

Patent metadata

Field	Value
Publication number	US-11386544-B2
Application number	US-201916668604-A
Country	US
Kind code	B2
Filing date	Oct 30, 2019
Priority date	Oct 30, 2019
Publication date	Jul 12, 2022
Grant date	Jul 12, 2022

Abstract

An electronics system may include a substrate, an electronic device bonded to the substrate, a plurality of photoluminescent particles disposed on the electronic device, an illuminator, a sensor, and a control module. The illuminator can illuminate the electronic device. The sensor can capture a first set of positions of the photoluminescent particles on the electronic device when the electronic device is not operating under a load and a second set of positions of the photoluminescent particles when the electronic device is operating under a load. The control module can determine thermomechanical stress on the electronic device based at least in part on a difference between the first set of positions and the second set of positions.

First claim

The invention claimed is:

1. An electronics system comprising:
a substrate;
an electronic device bonded to the substrate;
a plurality of photoluminescent particles disposed on the electronic device;
an illuminator to illuminate the electronic device;
a sensor to capture a first set of positions of the photoluminescent particles on the electronic device when the electronic device is not operating under a load and a second set of positions of the photoluminescent particles when the electronic device is operating under a load; and
a control module to determine thermomechanical stress on the electronic device based at least in part on a difference between the first set of positions and the second set of positions.

2. The electronics system of claim 1 , wherein the photoluminescent particles emit visible light when the photoluminescent particles are illuminated with ultraviolet light by the illuminator.

3. The electronics system of claim 1 , wherein the photoluminescent particles comprise phosphor particles.

4. The electronics system of claim 1 , wherein the substrate is bonded to a baseplate.

5. The electronics system of claim 1 , wherein the photoluminescent particles are arranged in a predetermined pattern.

6. The electronics system of claim 1 , wherein the photoluminescent particles are arranged in a random pattern.

7. The electronics system of claim 1 , wherein the control module determines delamination between the substrate and the electronic device based at least in part on the difference between the first set of positions and the second set of positions.

8. The electronics system of claim 1 , wherein the control module determines a strain map of the electronic device based at least in part on the difference between the first set of positions and the second set of positions.

9. The electronics system of claim 8 , wherein the control module converts the strain map to a stress map of the electronic device.

10. The electronics system of claim 9 , wherein the control module converts the strain map to a stress map based on a linear elastic model of a surface of the electronic device.

11. The electronics system of claim 1 , wherein the sensor detects intensities of luminescence of a plurality of the photoluminescent particles and the control module determines thermomechanical stress on the electronic device based at least in part on the detected intensities.

12. The electronics system of claim 1 , wherein the sensor detects wavelengths of photoluminescent emissions of a plurality of the photoluminescent particles and the control module determines thermomechanical stress on the electronic device based at least in part on the detected wavelengths of photoluminescent emissions.

13. A method comprising:
depositing a plurality of photoluminescent particles on a surface of an electronic device bonded to a substrate;
illuminating the surface of the electronic device with light at a first wavelength when the electronic device is not operating under load and determining a first set of positions of the photoluminescent particles on the electronic device;
illuminating the surface of the electronic device with light at the first wavelength when the electronic device is operating under load and determining a second set of positions of the photoluminescent particles on the electronic device; and
determining thermomechanical stress on the electronic device based at least in part on a difference between the first set of positions and the second set of positions.

14. The method of claim 13 , wherein determining the positions of the photoluminescent particles while the surface of the electronic device is being illuminated with light at the first wavelength comprises capturing an image of the electronic device with a sensor that can detect light at a second wavelength, wherein the photoluminescent particles emit light at the second wavelength when the photoluminescent particles are illuminated with light at the first wavelength.

15. The method of claim 13 , wherein the plurality of photoluminescent particles are deposited on the surface of the electronic device in a predetermined pattern.

16. The method of claim 13 , further comprising determining a strain map of the electronic device based at least in part on the difference between the first set of positions and the second set of positions.

17. The method of claim 16 , further comprising converting the strain map to a stress map of the electronic device.

18. The method of claim 17 , further comprising converting the strain map to a stress map based on a linear elastic model of the surface of the electronic device.

19. The method of claim 13 , further comprising:
determining a first set of intensities of luminescence of the photoluminescent particles while the particles are being illuminated with light at the first wavelength and the electronic device is not operating under a load;
determining a second set of intensities of luminescence of the photoluminescent particles while the particles are being illuminated with light at the first wavelength and the electronic device is operating under a load; and
determining thermomechanical stress on the electronic device based at least in part on a difference between the first set of intensities and the second set of intensities.

20. The method of claim 13 , further comprising:
determining a first set of wavelengths of luminescence of the photoluminescent particles while the particles are being illuminated with light at the first wavelength and the electronic device is not operating under a load;
determining a second set of wavelengths of luminescence of the photoluminescent particles while the particles are being illuminated with light at the first wavelength and the electronic device is operating under a load; and
determining thermomechanical stress on the electronic device based at least in part on a difference between the first set of wavelengths and the second set of wavelengths.

Assignees

• Toyota Eng & Mfg North America
• Univ Ohio State
• Toyota Motor Engineeeing & Mfg North America Inc

Inventors

• Joshi Shailesh N
• Gandhi Umesh
• Sundaresan Vishnu
• Venkatesh Vijay
• Krishnan Srivatsava

Classifications

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• G01L1/24 Primary

  by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis {using infrared, visible light, ultraviolet} · CPC title

• G06T2207/30148

  Semiconductor; IC; Wafer · CPC title

• G01B11/16

  for measuring the deformation in a solid, e.g. optical strain gauge · CPC title

• G01L1/25 Primary

  using wave or particle radiation, e.g. X-rays {, microwaves}, neutrons (G01L1/24 takes precedence) · CPC title