Film thickness uniformity improvement using edge ring and bias electrode geometry

Patent metadata

Field	Value
Publication number	US-11380575-B2
Application number	US-202016939898-A
Country	US
Kind code	B2
Filing date	Jul 27, 2020
Priority date	Jul 27, 2020
Publication date	Jul 5, 2022
Grant date	Jul 5, 2022

Abstract

Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.

First claim

What is claimed is:

1. An apparatus for substrate processing comprising:
an edge ring, comprising:
a bottom surface;
an upper surface; and
a groove disposed in the upper surface;

an overhang ring disposed in the groove, the overhang ring further comprising:
a first portion extending from the groove; and
a second portion connected to the first portion and extending radially inward.

2. The apparatus of claim 1 , wherein the edge ring comprises a quartz material.

3. The apparatus of claim 1 , wherein the overhang ring comprises a quartz material.

4. The apparatus of claim 1 , wherein the edge ring further comprises a plurality of tabs disposed on the upper surface.

5. The apparatus of claim 4 , wherein the plurality of tabs comprises 3 to 10 tabs.

6. The apparatus of claim 4 , wherein the plurality of tabs are disposed radially inward of the groove.

7. The apparatus of claim 4 , wherein the second portion of the overhang ring extends radially inward of an outer surface of the plurality of tabs.

8. The apparatus of claim 1 , wherein the edge ring further comprises an outer ledge, the outer ledge extending from the bottom surface of the edge ring.

9. The apparatus of claim 1 , wherein the second portion of the overhang ring is perpendicular to the first portion of the overhang ring.

10. The apparatus of claim 1 , wherein the overhang ring has an inner radius less than the inner radius of the edge ring.

11. The apparatus of claim 1 , wherein the groove of the edge ring has sidewalls sized to accept the first portion of the overhang ring.

12. An apparatus for substrate processing comprising:
an edge ring comprising:
a bottom surface;
an upper surface;
a central opening; and
a groove disposed in the upper surface;

an overhang ring disposed in the groove, the overhang ring further comprising:
a first portion extending upwards from the groove; and
a second portion extending radially inward toward a central axis of the overhang ring.

13. The apparatus of claim 12 , wherein the overhang ring has an inner radius less than the inner radius of the edge ring.

14. The apparatus of claim 12 , wherein the bottom surface further comprises:
an inner bottom surface;
a lower stepped surface connected to an outer edge of the inner bottom surface;
a primary bottom surface connected to an opposite end of the lower stepped surface as the inner bottom surface; and
an inner ledge surface connected to an outer edge of the primary bottom surface.

15. The apparatus of claim 14 , wherein a bottom surface of the groove is about 1 mm to about 5 mm vertically disposed from the inner bottom surface.

16. The apparatus of claim 14 , wherein the second portion is about 10 mm to about 30 mm from the bottom surface of the groove.

17. The apparatus of claim 12 , wherein the groove is less than about 15 mm in width.

18. An apparatus for substrate processing comprising:
an edge ring, the edge ring further comprising:
a support surface;
an upper surface;
a groove disposed in the upper surface; and
a plurality of tabs disposed on the upper surface;

an overhang ring disposed in the groove, the overhang ring further comprising:
a first portion extending from the groove; and
a second portion connected to the first portion and extending radially inward.

19. The apparatus of claim 18 , wherein the edge ring and the overhang ring comprise a quartz material.

20. The apparatus of claim 18 , wherein the groove is about the same width as the first portion of the overhang ring.

Assignees

• Applied Materials Inc

Inventors

• Lo Kin Pong
• Nagorny Vladimir
• Liu Wei
• Guarini Theresa Kramer
• Hwang Bernard L
• Bevan Malcolm J
• Abraham Jacob
• Behera Swayambhu Prasad

Classifications

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/7611 Primary

  characterised by edge profile or support profile · CPC title

• C23C16/4585

  Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds · CPC title

• H01J37/32715

  Workpiece holder · CPC title

• H01J37/32642 Primary

  Focus rings · CPC title