Multilayer electronic component for enhanced moisture resistance and bending strength

Patent metadata

Field	Value
Publication number	US-11380488-B2
Application number	US-202016834202-A
Country	US
Kind code	B2
Filing date	Mar 30, 2020
Priority date	Aug 28, 2019
Publication date	Jul 5, 2022
Grant date	Jul 5, 2022

Abstract

A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region in which an electrode layer and a conductive resin layer are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between a conductive resin layer and a plating layer of an external electrode, and thus, may improve bending strength and moisture resistance reliability.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a body including dielectric layers, and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween, the body having first and second surfaces opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;
a first external electrode including a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer, and a first plating layer disposed on the first conductive resin layer, and each having a first connection portion disposed on the third surface of the body and a first band portion extending from the first connection portion to a portion of each of the first, second, fifth, and sixth surfaces;
a second external electrode including a second electrode layer connected to the second internal electrode, a second conductive resin layer disposed on the second electrode layer, and a second plating layer disposed on the second conductive resin layer, and each having a second connection portion disposed on the fourth surface of the body and a second band portion extending from the second connection portion to a portion of each of the first, second, fifth, and sixth surfaces; and
a silicon (Si) organic compound layer having a body cover portion disposed on a region of external surfaces of the body between the first and second conductive resin layers, a first extending portion disposed to extend from the body cover portion to a region between the first band portion of the first conductive resin layer and the first band portion of the first plating layer, and a second extending portion disposed to extend from the body cover portion to a region between the second band portion of the second conductive resin layer and the second band portion of the second plating layer,
wherein Tb/Ta is 0.5 or more and 0.9 or less, where a thickness of the first conductive resin layer on the first band portion of the first electrode layer is defined as ‘Ta’ and a thickness of the first extending portion is defined as ‘Tb’.

2. The multilayer electronic component of claim 1 , wherein the Si organic compound layer includes alkoxy silane.

3. The multilayer electronic component of claim 1 , wherein the first and second conductive resin layers include a conductive metal and a base resin.

4. The multilayer electronic component of claim 1 , wherein the first and second electrode layers include a conductive metal and glass.

5. The multilayer electronic component of claim 1 , further comprising:
first and second additional plating layers disposed on the first and second plating layers, respectively.

6. The multilayer electronic component of claim 1 , wherein each of the first and second extending portions has an opening.

7. The multilayer electronic component of claim 1 , wherein the body cover portion is disposed on the external surfaces of the body on which the first and second electrode layers and the first and second conductive resin layers are not disposed.

8. The multilayer electronic component of claim 1 , wherein the first extending portion extends only between the first band portion of the first conductive resin layer and the first band portion of the first plating layer, and
wherein the second extending portion extends only between the second band portion of the second conductive resin layer and the second band portion of the second plating layer.

9. The multilayer electronic component of claim 1 , wherein the Si organic compound layer is disposed on the first, second, fifth, and sixth surfaces of the body.

10. The multilayer electronic component of claim 9 , wherein the Si organic compound layer is disposed on the first connection portion of the first conductive resin layer and disposed on the second connection portion of the second conductive resin layer.

11. A multilayer electronic component comprising:
a body including dielectric layers, and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween, the body having first and second surfaces opposing each other in a stacking direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;
a first external electrode including a first electrode layer connected to the first internal electrode, a first conductive resin layer disposed on the first electrode layer, and a first plating layer disposed on the first conductive resin layer, and each having a first connection portion disposed on the third surface of the body and a first band portion extending from the first connection portion to a portion of each of the first, second, fifth, and sixth surfaces;
a second external electrode including a second electrode layer connected to the second internal electrode, a second conductive resin layer disposed on the second electrode layer, and a second plating layer disposed on the second conductive resin layer, and each having a second connection portion disposed on the fourth surface of the body and a second band portion extending from the second connection portion to a portion of each of the first, second, fifth, and sixth surfaces; and
a silicon (Si) organic compound layer having a body cover portion disposed on a region of external surfaces of the body between the first and second conductive resin layers, a first extending portion disposed to extend from the body cover portion to a region between the first conductive resin layer and the first plating layer, and a second extending portion disposed to extend from the body cover portion to a region between the second conductive resin layer and the second plating layer,
wherein the first and second extending portions have first and second openings, respectively, and
wherein Tb/Ta is 0.5 or more and 0.9 or less, where a thickness of the first conductive resin layer on the first band portion of the first electrode layer is defined as ‘Ta’ and a thickness of the first extending portion is defined as ‘Tb’.

12. The multilayer electronic component of claim 11 , wherein an area of the first opening is 20 to 90% of an area of the first extending portion, and
an area of the second opening is 20 to 90% of an area of the second extending portion.

13. The multilayer electronic component of claim 11 , wherein the first opening is disposed in at least one of the first band portion or the first connection portion, and
the second opening is disposed in at least one of the second band portion or the second connection portion.

14. The multilayer electronic component of claim 11 , wherein the Si organic compound layer includes alkoxy silane.

15. The multilayer electronic component of claim 11 , wherein the first and second conductive resin layers include a conductive metal and a base resin.

16. The multilayer electronic component of claim 11 , wherein the first and second electrode layers include a conductive metal and glass.

17. The multilayer electronic component of claim 11 , further comprising:
first and second additional plating layers disposed on the first and second plating layers, respectively.

18. The multilayer electronic component of claim 11 , wherein the Si organic compound layer is disposed on the first, second, fifth, and sixth surfaces of t

Assignees

• Samsung Electro Mech

Inventors

• Kim Dong Yeong
• Shin Woo Chul
• Jo Ji Hong

Classifications

• H01G4/224 Primary

  Housing; Encapsulation · CPC title

• H01G4/008

  Selection of materials · CPC title

• H01G4/1218

  based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

• H01G4/252

  the terminals being coated on the capacitive element (H01G4/232 takes precedence) · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title