Electronic component
US-10325723-B1 · Jun 18, 2019 · US
the terminals being coated on the capacitive element (H01G4/232 takes precedence)
the terminals being coated on the capacitive element (H01G4/232 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01G4/252 |
| Official title | the terminals being coated on the capacitive element (H01G4/232 takes precedence) |
| Display label | the terminals being coated on the capacitive element (H01G4/232 takes precedence) |
| Total patents | 445 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 9 |
| 2017 | 19 |
| 2018 | 25 |
| 2019 | 51 |
| 2020 | 77 |
| 2021 | 68 |
| 2022 | 67 |
| 2023 | 43 |
| 2024 | 32 |
| 2025 | 40 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic component and method of manufacturing electronic component
US-10153082-B2 · Dec 11, 2018 · US
Laminated electronic component and mounting structure thereof
US-10141112-B2 · Nov 27, 2018 · US
Electronic component
US-2018337001-A1 · Nov 22, 2018 · US
Multilayer capacitor and circuit board containing the same
US-2018330880-A1 · Nov 15, 2018 · US
Multilayer capacitor and circuit board containing the same
US-2018330881-A1 · Nov 15, 2018 · US
Capacitor and method for manufacturing the same
US-2018330883-A1 · Nov 15, 2018 · US
Composite electronic component
US-10121593-B2 · Nov 6, 2018 · US
Capacitor and board having the same
US-2018315550-A1 · Nov 1, 2018 · US
Method for producing an electric contact connection of a multilayer component
US-10090454-B2 · Oct 2, 2018 · US
Capacitor component
US-2018277306-A1 · Sep 27, 2018 · US
Metallized film capacitor
US-10083794-B2 · Sep 25, 2018 · US
Electronic component and method for manufacturing the same
US-10068709-B2 · Sep 4, 2018 · US
Electronic component and substrate including electronic component
US-2018211785-A1 · Jul 26, 2018 · US
Electronic component
US-10026556-B2 · Jul 17, 2018 · US
Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor
US-2018174752-A1 · Jun 21, 2018 · US
Ceramic electronic component and manufacturing method thereof
US-2018166202-A1 · Jun 14, 2018 · US
Capacitor and method for manufacturing capacitor
US-2018137990-A1 · May 17, 2018 · US
Ceramic Electronic Component and Method of Producing the Same
US-2018108481-A1 · Apr 19, 2018 · US
Multilayer ceramic capacitor and method for manufacturing the same
US-2018096791-A1 · Apr 5, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01G4/252?
- CPC H01G4/252 is the Cooperative Patent Classification code for “the terminals being coated on the capacitive element (H01G4/232 takes precedence).”
- How many patents are filed under CPC H01G4/252 (the terminals being coated on the capacitive element (H01G4/232 takes precedence))?
- Our database includes 445 publications tagged with this CPC code.
- Is patent activity under CPC H01G4/252 growing?
- Publication counts under this code: 32 in 2024 vs 40 in 2025 (latest complete years).