Electrode bonding apparatus and electrode bonding method

Patent metadata

Field	Value
Publication number	US-2016288246-A1
Application number	US-201315035166-A
Country	US
Kind code	A1
Filing date	Nov 6, 2013
Priority date	Nov 6, 2013
Publication date	Oct 6, 2016
Grant date	—

Abstract

The present invention has an object to provide an electrode bonding apparatus that performs ultrasonic vibration bonding on points of an electrode and is capable of reducing variations in a peel force among the points even when the electrode is bonded onto the substrate at a lower peel force. According to the present invention, a collecting electrode ( 20 A, 20 B) is disposed along a side (L 1 , L 2 ) of a glass substrate ( 1 ) on a solar cell (ST 1 ). Then, the glass substrate is pressed along the side in a region of the glass substrate between the side and an arrangement position of the collecting electrode. During application of the pressure, the ultrasonic vibration bonding is performed on the collecting electrode using an ultrasonic vibration tool ( 14 ).

First claim

1 . An electrode bonding apparatus ( 100 ) that bonds an electrode ( 20 A, 20 B) onto a substrate ( 1 ) on which a solar cell (ST 1 ) is formed, along a side (L 1 , L 2 ) of the substrate, the substrate being rectangular, said electrode bonding apparatus comprising:
a table ( 11 ) on which the substrate is mounted; an ultrasonic vibration tool ( 14 ) that performs ultrasonic vibration bonding on the electrode disposed along the side, on the solar cell; and two pressure parts ( 12 A) that press the substrate, said pressure parts being vertically movable, wherein the substrate has a first side (L 1 ), and a second side (L 2 ) facing the first side, one of said pressure parts presses the substrate along the first side, in a first predetermined region of the substrate between the first side and an arrangement position of the electrode, and the other of said pressure parts presses the substrate along the second side, in a second predetermined region of the substrate between the second side and an arrangement position of the electrode.

2 . The electrode bonding apparatus according to claim 1 ,
wherein said pressure parts are L-shaped in a cross-sectional view, and said pressure parts are horizontally movable.

3 . The electrode bonding apparatus according to claim 2 ,
wherein a portion of said pressure parts that abuts on the solar cell is softer than a portion of said pressure parts that abuts on a side surface of the substrate.

4 . The electrode bonding apparatus according to claim 1 , further comprising
a controller that controls said pressure parts, wherein said controller variably controls pressure applied by said pressure parts.

5 . The electrode bonding apparatus according to claim 4 ,
wherein said controller variably controls a condition of the ultrasonic vibration bonding performed by said ultrasonic vibration tool.

6 . An electrode bonding method, comprising:
(A) mounting, on a table (ii), a substrate ( 1 ) on which a solar cell (ST 1 ) is formed, the substrate being rectangular; (B) disposing an electrode ( 20 A, 20 B) along a side (L 1 , L 2 ) of the substrate, on the solar cell: (C) pressing the substrate along the side, in a region of the substrate between the side and an arrangement position of the electrode; and (D) bonding the electrode onto the substrate by performing ultrasonic vibration bonding on the substrate during said step (C).

Assignees

• Toshiba Mitsubishi Electric Industrial Systems Corp

Inventors

• Ichinose Akihiro
• Yamada Yoshihito
• Nishinaka Tomoyuki
• Yoshida Akio

Classifications

• H10W72/07333

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/07233

  Ultrasonic bonding, e.g. thermosonic bonding · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/011

  Apparatus therefor · CPC title

• B23K2101/40

  Semiconductor devices · CPC title