Display device having a bonding filament and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11367854-B2
Application number	US-201816474372-A
Country	US
Kind code	B2
Filing date	Dec 27, 2018
Priority date	Apr 13, 2018
Publication date	Jun 21, 2022
Grant date	Jun 21, 2022

Abstract

Provided are a display device and a method of manufacturing a display device. The display device includes a first substrate in which a display area and a non-display area disposed outside the display area are defined; a second substrate which faces the first substrate and comprises an area recessed in a thickness direction and a contact area disposed outside the recessed area; and a cell seal which bonds the first substrate and the second substrate together, wherein the cell seal comprises a bonding filament which is disposed between the contact area and the non-display area to connect the contact area and the first substrate and a frit seal which is disposed between the recessed area and the non-display area.

First claim

The invention claimed is:

1. A display device comprising:
a first substrate in which a display area and a non-display area disposed outside the display area are defined;
a second substrate which faces the first substrate and comprises an area recessed in a thickness direction and a contact area disposed outside the recessed area; and
a cell seal which bonds the first substrate and the second substrate together,
wherein the cell seal comprises a bonding filament which is disposed between the contact area and the non-display area to connect the contact area and the first substrate and a frit seal which is disposed between the recessed area and the non-display area.

2. The display device of claim 1 , further comprising a first driver integrated circuit which is disposed in the non-display area, wherein the frit seal is disposed between the display area and the first driver integrated circuit.

3. The display device of claim 1 , wherein the contact area has a width of about 50 μm to about 300 μm.

4. The display device of claim 3 , wherein the bonding filament at least partially overlaps the contact area.

5. The display device of claim 4 , wherein the bonding filament has a width of about 10 μm to about 300 μm.

6. The display device of claim 1 , wherein the second substrate further comprises inner sidewalls which connect the recessed area and the contact area, wherein an opening is defined by the inner sidewalls, the recessed area and the first substrate, and the frit seal fills the opening.

7. The display device of claim 1 , further comprising a middle area which is disposed between the recessed area and the contact area and has a different refractive index from that of the recessed area.

8. The display device of claim 7 , wherein the middle area has a width of about 5 μm to about 30 μm.

9. The display device of claim 1 , wherein the non-display area comprises an upper non-display area disposed on an upper side of the display area, a lower non-display area disposed on a lower side of the display area, a left non display area disposed on a left side of the display area, and a right non-display area disposed on a right side of the display area.

10. The display device of claim 9 , wherein the bonding filament is disposed over the upper non-display area, the left non-display area and the right non-display area, and the frit seal is disposed in the lower non-display area.

11. The display device of claim 1 , wherein the bonding filament comprises a central portion and a peripheral portion disposed outside the central portion, wherein the central portion and the peripheral portion have different refractive indices.

12. The display device of claim 1 , wherein a distance from a surface of the contact area to a surface of the recessed area is greater than or equal to a height of an organic light emitting diode.

13. A method of manufacturing a display device, the method comprising:
preparing a first substrate in which a display area and a non-display area disposed outside the display area are defined and a second substrate which faces the first substrate;
applying a frit onto the first substrate or the second substrate to overlap the non-display area of the first substrate;
forming a recessed area and a contact area disposed outside the recessed area by recessing a part of the second substrate in a thickness direction;
forming a bonding filament for connecting the contact area and the first substrate by irradiating a laser beam in a state where the contact area and the first substrate are in contact with each other; and
forming a frit seal by curing the frit.

14. The method of claim 13 , wherein the laser beam is a femtosecond laser beam having a pulse width of about 200 femtoseconds to about 500 femtoseconds.

15. The method of claim 13 , wherein a focus of the laser beam is set inside the first substrate, and a depth of focus is about −100 μm to less than about 0 μm.

16. The method of claim 13 , wherein one or more insulating films are formed on the first substrate and further comprising removing the insulating films, wherein the contact area contacts a part of the first substrate from which the insulating films have been removed.

Assignees

• Samsung Display Co Ltd

Inventors

• Seo Woo Suk
• Kang Eui Jeong
• Kwon Yong Hoon
• Kim Jung Hyun
• Song Si Joon

Classifications

• H10W90/00

  Package configurations · CPC title

• H10K71/421

  using coherent electromagnetic radiation, e.g. laser annealing · CPC title

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• H10K59/8722 Primary

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H01L25/18

  Electricity · mapped topic